Patents by Inventor Ki Yeup Lee

Ki Yeup Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating semiconductor device capable of minimizing damage of lower layer using insulating layer resided in opening
    Patent number: 6171938
    Abstract: The present invention is to provide a method for fabricating a semiconductor device, including the steps of: (a) forming an insulating layer on a semiconductor substrate; (b) selectively removing the insulating layer and then forming an opening and the residual insulating layer on a bottom of the opening; (c) removing the residual insulating layer by wet etching in order to expose the semiconductor substrate; and (d) burying a conductive layer in the opening and then forming a conductive layer pattern connected to the semiconductor substrate.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: January 9, 2001
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Ki Yeup Lee, Jeong Woo Ha