Abstract: An antenna may comprise a body including at least one first layer formed of metal and at least one second layer formed of resin, the first layer and the second layer being thermally fused to each other; and a waveguide formed in the body. A method for manufacturing an antenna may comprise heating a first layer formed of metal; and bonding the heated first layer formed of the metal and a second layer formed of resin so that the first layer and the second layer are thermally fused to each other to form a waveguide in a body of the antenna. The antenna and the method for manufacturing the antenna may save the weight and material costs by reducing the number of components and assembly processes, reduce the overall size, prevent damage during the assembly process.

Abstract: A position roller for meander control includes, in one example, a roller with a rotational axis; a first ball joint supporting a distal end among both ends of the rotational axis for pivotal movement; an XZ driver that drives a proximal end among both ends of the rotational axis into two-dimensional motion in a plane; and a base supporting the first ball joint and the XZ driver.

Abstract: Disclosed are a message service provision method for providing a message service via an open chat room corresponding to link information, and a message server and a terminal for executing the message service provision method. The message service provision method comprises the steps of: transmitting, to a message server, a request for issuing link information for an open chat room via a message application; receiving, from the message server, link information generated in response to the request for issuing link information; sharing the link information according to a request for sharing inputted by a user of a host terminal; and performing chatting with a user of a guest terminal participating in the open chat room by means of the shared link information; wherein the user of the guest terminal and the user of the host terminal are users who subscribed to a message service provided via the message server.

Abstract: Disclosed is an apparatus for reducing floating radioactive material in a containment building capable of reducing radioactive material in the event of a major accident in a containment building such as a nuclear power plant. A radioactive material reduction unit configured to reduce radioactive material in the air is provided upstream of a flow induction unit configured to induce an air flow through catalytic reaction with hydrogen in the air in the event of a major accident. The flow induction unit may have a replaceable modular form. The radioactive material reduction unit may include an adsorber module configured to remove gaseous radioactive material, such as iodine or an iodine compound. The adsorber module may have a replaceable modular form. In addition, the radioactive material reduction unit may further include an aerosol filter fixed to an inlet to remove particulate radioactive material.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: A method for displaying a message in a messenger service by a user terminal is proposed. The method may include receiving the message from a server. The method may also include receiving a mask command for the message from the server when text information extracted from the message satisfies a preset condition. The method may further include displaying a mask message corresponding to the message in a chat room of the messenger service based on the mask command.

Abstract: The present disclosure provides a low-voltage battery unit of a fuel cell electric vehicle (FCEV) type commercial special purpose vehicle. The low-voltage battery unit features a dualized structure by using a 12V LDC and adopting a battery exclusively providing DC12V, instead of using a low-voltage DC-DC converter (LDC) for 24V and a battery equalizer (BEQ) to supply 24V and 12V in the low-voltage battery unit.

Abstract: A pouch-type secondary battery according to an embodiment of the present invention for solving the above problems includes a cup part configured to accommodate an electrode assembly formed by stacking electrodes and separators, wherein the cup part includes: a bottom portion configured to form a bottom; an outer wall configured to form a side surface and meet the bottom portion; a punch edge configured to connect the bottom portion to the outer wall; a thickness edge configured to connect two adjacent outer walls to each other; and a corner formed by connecting the two adjacent punch edges to the thickness edge, wherein at least one of the punch edges is rounded, at least one of the thickness edge is rounded, at least one of the corner is rounded and has a curvature radius different from that of each of the punch edge and the thickness edge.

Abstract: Proposed is a method for providing at least one channel group by a server. The method may include in response to an interaction from a user terminal requesting creation of a channel group, creating the channel group; in response to the channel group being created. The method may also include creating a default chat channel included in the channel group. The method may further include in response to an interaction from the user terminal requesting creation of a chat channel, creating the chat channel included in the channel group.

Abstract: The present technology includes a semiconductor memory device. The semiconductor memory device includes a first channel pattern and a second channel pattern each extending in a vertical direction and facing each other, a channel separation pattern formed between the first channel pattern and the second channel pattern and extending in the vertical direction, a stack including conductive patterns each surrounding the first channel pattern, the second channel pattern, and the channel separation pattern and stacked apart from each other in the vertical direction, a first memory pattern disposed between each of the conductive patterns and the first channel pattern, and a second memory pattern disposed between each of the conductive patterns and the second channel pattern.

Abstract: An embodiment of the present inventive concept provides a display device including: a mother substrate on which a plurality of display modules are located; and a mother film located on a rear surface of the mother substrate, wherein the mother film may include a first layer, and a second layer disposed between the first layer and the mother substrate, the second layer has a thickness of from about 40 ?m to about 60 ?m, and a thickness of the first layer may be greater than that of the second layer.

Abstract: A method of manufacturing a semiconductor die stack structure includes: preparing a base die including a base die substrate and a base die inter-layer dielectric layer; forming a base die front-side bonding pad structure; preparing a bottom die having a bottom die substrate and bottom die through-electrode; forming a bottom die front-side bonding pad structure in the bottom die substrate; forming a base-bottom die stack structure where the bottom die front-side bonding pad structure is directly in contact with the base die front-side; forming a base die through-electrode vertically passing through the base die substrate and electrically connected to the base die front-side bonding pad structure; forming a base die back-side bump structure electrically connected to the base die through-electrode; stacking middle dies and a top die in the base-bottom die stack structure; and forming a bottom die back-side bump structure electrically connected to the bottom die through-electrode.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: A sliding apparatus for durability evaluation of a flexible material includes a base unit having a folding space formed therethrough, a sliding unit which is coupled to the base unit to be slidably movable and to which one side of a flexible material to be evaluated is fixed, and a folding unit which is arranged to be apart from the sliding unit, to which the other side of the flexible material is fixed, and which rotates with respect to the sliding unit to in-fold or out-fold the flexible material in an unfolded state. The sliding unit changes the position of the bent portion formed in the flexible material as the sliding unit slidably moves on the base unit with the flexible material in an in-folded state or out-folded state.

Abstract: A folding mechanism includes a base module and a folding module which is coupled to the base module such that the folding module is capable of being rotated so as to realize a folding operation of a flexible material and which is coupled to the flexible material such that the folding module is capable of being slidably moved.

Abstract: A semiconductor package includes a package substrate, a plurality of memory chips stacked over the package substrate, and a control chip disposed over the package substrate to be spaced apart from the plurality of memory chips. The control chip includes a plurality of first chip enable signal control pads transmitting chip enable signals to and from the plurality of memory chips, a plurality of second chip enable signal control pads transmitting the chip enable signals to and from an external electronic device external to the semiconductor package, a chip enable signal control circuit configured to control transmission paths of the chip enable signals between the plurality of first chip enable signal control pads and the plurality of second chip enable signal control pads, and a third chip enable signal control pad receiving a path control signal from the external electronic device for controlling the chip enable signal control circuit.

Abstract: A 360 degree folding jig performs actions similar to those of a product to which a sample is applied when conducting a durability test for the sample. The 360 degree folding jig includes a fixed plate module on which one side of a sample is supported, a folding plate module that is spaced apart from the fixed plate module and on which the other side of the sample is supported so as to be reciprocally movable, and a pair of rotation support modules respectively provided at each end of the mutually adjacent fixed plate module and the folding plate module, and configured to couple the folding plate module to the fixed plate module so that the folding plate module is in-folded or out-folded.

Abstract: A semiconductor package including a shield layer and a method of manufacturing the same. The semiconductor package includes a package substrate, a semiconductor die, an encapsulant layer, and a shield layer. The semiconductor package includes a side that connects a first surface and second surface of the package substrate and includes recesses that are formed along an edge where the second surface and the side meet.

Abstract: A semiconductor package includes a control chip and a memory stack mounted on a substrate, and first and second stack bonding wires. The memory stack includes first and second memory stacks. The substrate includes first and second bond fingers. The first and second bonding wires connect the first and second bond fingers to the first and second memory stack, respectively. A first electrical path connecting a first channel pad of the control chip to the first bond finger is longer than a second electrical path connecting a second channel pad of the control chip to the second bond finger. The first stack bonding wire is shorter than the second stack bonding wire.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces. A plurality of internal electrodes is disposed inside the ceramic body, connected to the first and second surfaces, and have one ends connected to the third and fourth surfaces. First and second side margin parts are disposed on end portions of the internal electrodes connected to the first and second surfaces. The ceramic body includes an active portion forming capacitance by including the plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween. An average Sn content in a region adjacent to the side margin part of the active portion is greater than an average Sn content in a central region of the active portion.