Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: A sliding apparatus for durability evaluation of a flexible material includes a base unit having a folding space formed therethrough, a sliding unit which is coupled to the base unit to be slidably movable and to which one side of a flexible material to be evaluated is fixed, and a folding unit which is arranged to be apart from the sliding unit, to which the other side of the flexible material is fixed, and which rotates with respect to the sliding unit to in-fold or out-fold the flexible material in an unfolded state. The sliding unit changes the position of the bent portion formed in the flexible material as the sliding unit slidably moves on the base unit with the flexible material in an in-folded state or out-folded state.

Abstract: A folding mechanism includes a base module and a folding module which is coupled to the base module such that the folding module is capable of being rotated so as to realize a folding operation of a flexible material and which is coupled to the flexible material such that the folding module is capable of being slidably moved.

Abstract: A semiconductor package includes a package substrate, a plurality of memory chips stacked over the package substrate, and a control chip disposed over the package substrate to be spaced apart from the plurality of memory chips. The control chip includes a plurality of first chip enable signal control pads transmitting chip enable signals to and from the plurality of memory chips, a plurality of second chip enable signal control pads transmitting the chip enable signals to and from an external electronic device external to the semiconductor package, a chip enable signal control circuit configured to control transmission paths of the chip enable signals between the plurality of first chip enable signal control pads and the plurality of second chip enable signal control pads, and a third chip enable signal control pad receiving a path control signal from the external electronic device for controlling the chip enable signal control circuit.

Abstract: A 360 degree folding jig performs actions similar to those of a product to which a sample is applied when conducting a durability test for the sample. The 360 degree folding jig includes a fixed plate module on which one side of a sample is supported, a folding plate module that is spaced apart from the fixed plate module and on which the other side of the sample is supported so as to be reciprocally movable, and a pair of rotation support modules respectively provided at each end of the mutually adjacent fixed plate module and the folding plate module, and configured to couple the folding plate module to the fixed plate module so that the folding plate module is in-folded or out-folded.

Abstract: A semiconductor package including a shield layer and a method of manufacturing the same. The semiconductor package includes a package substrate, a semiconductor die, an encapsulant layer, and a shield layer. The semiconductor package includes a side that connects a first surface and second surface of the package substrate and includes recesses that are formed along an edge where the second surface and the side meet.

Abstract: A semiconductor package includes a control chip and a memory stack mounted on a substrate, and first and second stack bonding wires. The memory stack includes first and second memory stacks. The substrate includes first and second bond fingers. The first and second bonding wires connect the first and second bond fingers to the first and second memory stack, respectively. A first electrical path connecting a first channel pad of the control chip to the first bond finger is longer than a second electrical path connecting a second channel pad of the control chip to the second bond finger. The first stack bonding wire is shorter than the second stack bonding wire.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces. A plurality of internal electrodes is disposed inside the ceramic body, connected to the first and second surfaces, and have one ends connected to the third and fourth surfaces. First and second side margin parts are disposed on end portions of the internal electrodes connected to the first and second surfaces. The ceramic body includes an active portion forming capacitance by including the plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween. An average Sn content in a region adjacent to the side margin part of the active portion is greater than an average Sn content in a central region of the active portion.

Abstract: Provided is a device for evaluating 360-degree bidirectional folding durability of a flexible material in which during a folding test of a film-type flexible material, a single folding device can implement both the infolding and outfolding of the flexible material relative to the unfolded state of the flexible material. To this end, the device includes: a fixing unit configured to fix a first side of the flexible material to be evaluated; a moving unit configured to fix a second side of the flexible material and disposed to be spaced apart from the fixing unit; a motion guide unit to which the fixing unit is fixed; and a motion unit connecting the motion guide unit with the moving unit.

Abstract: An apparatus includes a battery unit including a main battery for supplying driving power to a vehicle and a starting battery for supplying power to the video recording device, a smart battery sensor for transmitting state information of the battery to a power distribution device while monitoring a change in an SOC of the starting battery while the vehicle is parked, and requesting to charge the starting battery when the SOC is reduced to a predetermined SOC or less, the power distribution device for transmitting the state information of the battery to the video recording device and controlling whether to charge the starting battery when the vehicle is turned off, and the video recording device for calculating a recordable time capable of recording with the SOC of the starting battery, setting a recording timer, and recording surroundings of the vehicle using the power supplied from the starting battery while the vehicle is parked.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: A semiconductor package includes a semiconductor die and an encapsulant layer. A mark is formed on a surface of the encapsulant layer. A damage barrier layer is disposed between the mark and the semiconductor die. The damage barrier layer blocks the propagation of laser light used to form the mark from reaching the semiconductor die.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: Proposed is an auto-flattening control method that is an auto-flattening control method for determining a minimum driving value of tension that is applied to a sample coupled at both sides to a moving unit and a winding unit, respectively. The auto-flattening control method includes a sample rotation step of rotating the winding unit at a preset reference angle, a setup value checking step of monitoring a rotation load that is applied to a sample by rotation of the winding unit, and a setting comparison step of comparing variations between an N-th (a natural number larger than 0) rotation load and an N-1-th rotation load for the rotation load that is monitored through the setup value checking step.

Abstract: A semiconductor package includes a package substrate, first and second semiconductor chips stacked on the package substrate and wire-bonded to the package substrate. The first semiconductor chip includes first differential pair signal pads, a first option signal pad, and a first signal path control circuit. The second semiconductor chip includes second differential pair signal pads, a second option signal pad, and a second signal path control circuit. The first signal path control circuit changes a signal path of one of the differential pair signals of the first semiconductor chip by a first control signal. The second signal path control circuit changes a signal path of one of the differential pair signals of the second semiconductor chip by a second control signal.

Abstract: A sample stretch test device includes a setup table and grip modules arranged with regular intervals along an edge of a virtual arrangement circle around a center of the setup table and configured to grip a sample to be tested, and further includes at least any one of grip driving modules coupled to the setup table and configured to slide the grip modules along normals of the virtual arrangement circle in a horizontal direction parallel with the sample, and a pressing module disposed under the setup table and configured to press the sample in a vertical direction perpendicular to the sample.

Abstract: A 360 degree folding jig performs actions similar to those of a product to which a sample is applied when conducting a durability test for the sample. The 360 degree folding jig includes a fixed plate module on which one side of a sample is supported, a folding plate module that is spaced apart from the fixed plate module and on which the other side of the sample is supported so as to be reciprocally movable, and a pair of rotation support modules respectively provided at each end of the mutually adjacent fixed plate module and the folding plate module, and configured to couple the folding plate module to the fixed plate module so that the folding plate module is in-folded or out-folded.