Abstract: An apparatus and a method for mining temporal pattern are provided. A method for mining temporal pattern includes generating a data pattern group comprising data patterns from sequential data, generating a candidate pattern group comprising candidate patterns from the data pattern group, calculating a support value for a candidate pattern in a candidate pattern group based on a discrepancy value of the candidate pattern, and determining whether the candidate pattern satisfies a predetermined pattern requirement, based on the calculated support value.

Abstract: A semiconductor package includes a semiconductor chip electrically connected to a substrate, and a molding part including first molding members and second molding members arranged in an alternating pattern. The first molding members have a first physical flexibility which is different from a second physical flexibility of the second molding members.

Abstract: A display module may include a flexible panel that is bent in a direction such that a compressive stress is exerted on a display unit within a housing.

Abstract: A method of forming a polycrystalline silicon layer includes forming a first amorphous silicon layer and forming a second amorphous silicon layer such that the first amorphous silicon layer and the second amorphous silicon layer have different film qualities from each other, and crystallizing the first amorphous silicon layer and the second amorphous silicon layer using a metal catalyst to form a first polycrystalline silicon layer and a second polycrystalline silicon layer. A thin film transistor includes the polycrystalline silicon layer formed by the method and an organic light emitting device includes the thin film transistor.

Abstract: A robot cleaner based on wall following and a controlling method thereof are provided. The robot cleaner includes a first detector configured to generate a wall detection signal by detecting a wall, a second detector configured to generate a first contact signal through contact with the wall, a cleaner main body in which the first and second detectors are disposed and which includes a driver configured to drive on a surface to be cleaned, and a controller which is mounted on the cleaner main body and to which the first and second detectors and the driver are electrically coupled.

Abstract: An apparatus and a method for Computer Aid Diagnosis (CAD) based on eye movement are provided. The apparatus includes a gaze area detector configured to detect, based on eye movement of a user, a gaze area on a medical image on which a region of interest (ROI) is detected, the gaze area being an area at which the user gazes for a period of time. The apparatus further includes an ROI redetector configured to detect another ROI on the gaze area.

Abstract: An apparatus for diagnosis of a medical image includes a storage having a predetermined size, the storage being configured to store sample frames sampled from among received frames which are received from a medical imaging device; a frame collector configured to, once a reference frame is determined, collect one or more sample frames stored in the storage; and a diagnosis component configured to provide a diagnosis for the reference frame based on diagnostic results associated with the one or more collected sample frames.

Abstract: A separated target apparatus includes a base plate; and a plurality of source units including a plurality of separated targets that are adhered on one surface of the base plate and that form a regular array, and a plurality of magnets that are adhered on the other surface of the base plate and that make a pair with the plurality of separated targets. The plurality of source units are arrayed in parallel at an angle between a first direction that is a direction of the regular array and a second direction that is perpendicular to the first direction. Sputtering is performed by using the separated target apparatus having the aforementioned structure.

Abstract: A multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; a first internal electrode formed within the ceramic main body, including a capacitance formation part having an overlap region to form capacitance and a first lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; a second internal electrode alternately laminated together with the first internal electrode, having a second lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; first and second external electrodes; and insulating layers.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The method for manufacturing the printed circuit board includes forming a base circuit board including a cavity circuit pattern in a cavity region on upper and lower portions of a substrate and internal circuit layers outside the cavity region, forming a cavity separation layer on the cavity circuit pattern, forming at least one pair of an insulating layer and a circuit layer on the base circuit board, cutting the insulating layer and the cavity separation layer provided on an etch stop pattern by controlling a focal length of a laser beam such that the laser beam reaches a surface of the base circuit board, and removing the insulating layer by separating the cavity separation layer to form the cavity. The cavity separation layer is formed on the cavity circuit pattern, and the resultant structure is cut to the cavity separation layer by using a laser so that the insulating layer is separated.

Abstract: A display device includes a display panel having a bendable part and flat parts, at least one flat part disposed at each side of the bendable part; and a panel guide attached to surfaces of the flat parts of the display panel, in which the display panel is attached to the panel guide when the bendable part is in a state of being tensioned at a reference strain included in an elastic range.

Abstract: An apparatus and method for adaptive computer-aided diagnosis (CAD) are provided. The adaptive CAD apparatus includes an image analysis algorithm selector configured to select an image analysis algorithm based on a speed of a probe or a resolution of a current image frame obtained by the probe; and an image analyzer configured to detect and classify a region of interest (ROI) in the current image frame using the selected image analysis algorithm.

Abstract: There is provided an apparatus for visualizing a region of interest (ROI) in a Computer Aided Diagnosis (CAD) system. The apparatus includes: an image receiver configured to receive images; an ROI acquirer configured to acquire the ROI from a current image; and an ROI visualizer configured to, in response to acquisition of the ROI from the current image, output visualization information for visualizing the ROI acquired from the current image based on a change between the ROI acquired from the current image and an ROI acquired from a previous image.

Abstract: A semiconductor stacked package may include a substrate formed with a plurality of coupling pads, a plurality of semiconductor chips stacked on the substrate. The semiconductor stacked package may also include first circuit units disposed on each of the semiconductor chips, and electrically connected with the coupling pads by the medium of bonding pads. The semiconductor stacked package may include second circuit units disposed on each of the semiconductor chips and electrically disconnected with the coupling pads, connection pads disposed on each of the semiconductor chips and corresponding to the second circuit units, and blocking circuits coupled between the second circuit units and the connection pads. The semiconductor stacked package may also include bonding wires electrically connecting the bonding pads and the coupling pads.

Abstract: A dielectric ceramic composition includes: a base material powder BamTiO3 (0.995?m?1.010); 0.2 to 2.0 moles of a first accessory ingredient, an oxide or carbide containing at least one of Ba and Ca, based on 100 moles of the base material powder; a second accessory ingredient, an oxide containing Si or a glass compound containing Si; 0.2 to 1.5 moles of a third accessory ingredient, an oxide containing at least one of Sc, Y, La, Ac, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, based on 100 moles of the base material powder; and 0.05 to 0.80 mole of a fourth accessory ingredient, an oxide containing at least one of Cr, Mo, W, Mn, Fe, Co, and Ni, based on 100 moles of the base material powder, a content ratio of the first accessory ingredient to the second accessory ingredient being 0.5 to 1.7.

Abstract: A semiconductor stacked package may include a substrate formed with a plurality of coupling pads, a plurality of semiconductor chips stacked on the substrate. The semiconductor stacked package may also include first circuit units disposed on each of the semiconductor chips, and electrically connected with the coupling pads by the medium of bonding pads. The semiconductor stacked package may include second circuit units disposed on each of the semiconductor chips and electrically disconnected with the coupling pads, connection pads disposed on each of the semiconductor chips and corresponding to the second circuit units, and blocking circuits coupled between the second circuit units and the connection pads. The semiconductor stacked package may also include bonding wires electrically connecting the bonding pads and the coupling pads.

Abstract: A display device includes a first display, an accommodation unit on a side of the first display, and a second display. The second display is rollably accommodated in the accommodation unit in a rolled state.

Abstract: A thin film transistor including a first polycrystalline semiconductor layer disposed on a substrate, a second polycrystalline semiconductor layer disposed on the first polycrystalline semiconductor layer, and metal catalysts configured to adjoin the first polycrystalline semiconductor layer and spaced apart from one another at specific intervals.

Abstract: A method of fabricating a polysilicon layer includes forming a buffer layer on a substrate, forming a metal catalyst layer on the buffer layer, diffusing a metal catalyst into the metal catalyst layer to the buffer layer, removing the metal catalyst layer, forming an amorphous silicon layer on the buffer layer, and annealing the substrate to crystallize the amorphous silicon layer into a polysilicon layer. The thin film transistor includes a substrate, a buffer layer disposed on the substrate, a semiconductor layer disposed on the buffer layer, a gate insulating layer disposed above the substrate and on the semiconductor layer, a gate electrode disposed on the gate insulating layer, a source electrode and a drain electrode both electrically connected to the semiconductor layer, and a metal silicide disposed between the buffer layer and the semiconductor layer.

Abstract: A multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and having first and second main surfaces opposing each other in a thickness direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction; first and second internal electrodes stacked to have the dielectric layer interposed therebetween within the ceramic body and alternately exposed through the first and second end surfaces; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, and including first and second head parts formed on the first and second end surfaces, wherein width of the first and second head parts is less than width of the ceramic body, and when length, width and thickness of the ceramic body are defined as L, W, and T, respectively, T/W>1.0 is satisfied.