Abstract: A mobile robot system for allowing a user to easily input a control command of a mobile robot, and a remote control method for the same are disclosed. The mobile robot system and the remote control method thereof can allow a user to easily input control commands regarding the movement and operation of the mobile robot using the jog-dial interface, such that the possibility of causing input errors can be reduced and desired commands can be quickly and efficiently transmitted, resulting in increased user manipulation of the mobile robot system. When the user enters the rotation command of the mobile robot, the mobile robot system can allow the user to perform intuitive interfacing through shuttle manipulation, such that the mobile robot system can facilitate transmission of a movement command having a circular trajectory and the same mobile robot control as in the user-intended control is achieved, resulting in implementation of emotional interface capable of increasing user accessibility.

Abstract: A semiconductor package includes a package substrate and semiconductor chips stacked on the package substrate. The package substrate may include at least one first chip enablement finger, at least one second chip enablement finger, and a chip enablement pad selection finger. Each of the semiconductor chips includes a first chip enablement pad connected to the at least one first chip enablement finger, a second chip enablement pad connected to the at least one second chip enablement finger, and a chip enablement pad selection pad connected to the chip enablement pad selection finger. The first chip enablement pads of the semiconductor chips or the second chip enablement pads of the semiconductor chips are optionally activated by a signal applied to the chip enablement pad selection finger.

Abstract: The present invention relates to a peptide derivative for regulating the thymic stromal lymphoid protein-mediated signaling and a pharmaceutical composition including the peptide derivative for preventing and treating allergy and asthma diseases and, more particularly, to a peptide derivative represented by Chemical Formula 1 and a pharmaceutical composition including the peptide derivative for preventing and treating allergy and asthma diseases. According to the present invention, provided are a peptide derivative capable of effectively inhibiting the formation of an inflammatory response of allergy and asthma diseases and a pharmaceutical composition including the peptide derivative. By using the present invention, various allergy and asthma diseases can be fundamentally prevented or treated.

Abstract: An apparatus for purifying waste gases for an integrated semiconductor is provided, which includes a cover including a burner mounted thereon to generate a flame and a plurality of waste gas inlet pipes formed on a circumference of the burner to make waste gases flow therethrough; a reactor including upper and lower openings formed thereon so that the cover is detachably coupled to the upper opening, a converging member tapered to have a smaller diameter as going toward a lower portion thereof, and a transport pipe vertically arranged to communicate with an apex of the converging member, in which a water curtain is formed to prevent accumulation of by-products, to burn and discharge the inflow waste gases; and a cleaning portion integrally formed in the reactor to water-clean the burnt waste gases that are discharged into the reactor after passing through the transport pipe to collect particles. Since the burner, the reactor, and the scrubber are integrally formed in a body.

Abstract: An apparatus and a method for supporting acquisition of a multi-parametric image are provided. An apparatus for supporting acquisition of a multi-parametric image includes: a disease selector configured to select a suspected disease of a patient based on patient information; and an image selector configured to determine a set of imaging conditions of a multi-parametric magnetic resonance image corresponding to the suspected disease based on a multi-parametric magnetic resonance imaging model.

Abstract: A robot cleaner based on wall following and a controlling method thereof are provided. The robot cleaner includes a first detector configured to generate a wall detection signal by detecting a wall, a second detector configured to generate a first contact signal through contact with the wall, a cleaner main body in which the first and second detectors are disposed and which includes a driver configured to drive on a surface to be cleaned, and a controller which is mounted on the cleaner main body and to which the first and second detectors and the driver are electrically coupled.

Abstract: A semiconductor package may be provided. A semiconductor package may include a substrate. The semiconductor package may include a first semiconductor chip and a second semiconductor chip which are disposed adjacent to each other over a first surface of the substrate. The semiconductor package may include first bonding wires which electrically couple the first semiconductor chip and the substrate. The semiconductor package may include an insulation adhesive which is interposed between the second semiconductor chip and the substrate. The first bonding wires may be disposed to pass through the insulation adhesive and electrically couple the first semiconductor chip and the substrate.

Abstract: An apparatus and a method for Computer Aid Diagnosis (CAD) based on eye movement are provided. The apparatus includes a gaze area detector configured to detect, based on eye movement of a user, a gaze area on a medical image on which a region of interest (ROI) is detected, the gaze area being an area at which the user gazes for a period of time. The apparatus further includes an ROI redetector configured to detect another ROI on the gaze area.

Abstract: A semiconductor package includes a package substrate and semiconductor chips stacked on the package substrate. The package substrate may include at least one first chip enablement finger, at least one second chip enablement finger, and a chip enablement pad selection finger. Each of the semiconductor chips includes a first chip enablement pad connected to the at least one first chip enablement finger, a second chip enablement pad connected to the at least one second chip enablement finger, and a chip enablement pad selection pad connected to the chip enablement pad selection finger. The first chip enablement pads of the semiconductor chips or the second chip enablement pads of the semiconductor chips are optionally activated by a signal applied to the chip enablement pad selection finger.

Abstract: Provided herein is a dust measuring apparatus. The dust measuring apparatus includes: a body; a window unit exposed to the outside through an opening part of the body, such that dust present in the outside is gathered on the window unit; a light emitting unit emitting light to the window unit; a light receiving unit receiving light reflected from the window unit; and a controlling unit measuring an amount of dust gathered on the window unit on the basis of strength of the emitted light and strength of the received light.

Abstract: An apparatus and method for adaptive computer-aided diagnosis (CAD) are provided. The adaptive CAD apparatus includes an image analysis algorithm selector configured to select an image analysis algorithm based on a speed of a probe or a resolution of a current image frame obtained by the probe; and an image analyzer configured to detect and classify a region of interest (ROI) in the current image frame using the selected image analysis algorithm.

Abstract: An apparatus for purifying waste gases for an integrated semiconductor is provided, which includes a cover including a burner mounted thereon to generate a flame and a plurality of waste gas inlet pipes formed on a circumference of the burner to make waste gases flow therethrough; a reactor including upper and lower openings formed thereon so that the cover is detachably coupled to the upper opening, a converging member tapered to have a smaller diameter as going toward a lower portion thereof, and a transport pipe vertically arranged to communicate with an apex of the converging member, in which a water curtain is formed to prevent accumulation of by-products, to burn and discharge the inflow waste gases; and a cleaning portion integrally formed in the reactor to water-clean the burnt waste gases that are discharged into the reactor after passing through the transport pipe to collect particles. Since the burner, the reactor, and the scrubber are integrally formed in a body.

Abstract: The semiconductor package includes semiconductor chips, each chip having one or more bonding pads. The semiconductor chips are stacked in a stepped configuration over the surface of the substrate without covering one or more bonding pads. An encapsulation member encapsulates the stacked semiconductor chips on the surface of the substrate. Via wirings in the encapsulation member electrically connect to a bonding pad of at least one of the semiconductor chips. Redistributions are formed over the encapsulation member such that the one or more redistributions are electrically coupled to the via wirings.

Abstract: A method of fabricating a polysilicon layer includes forming a buffer layer on a substrate, forming a metal catalyst layer on the buffer layer, diffusing a metal catalyst into the metal catalyst layer to the buffer layer, removing the metal catalyst layer, forming an amorphous silicon layer on the buffer layer, and annealing the substrate to crystallize the amorphous silicon layer into a polysilicon layer. The thin film transistor includes a substrate, a buffer layer disposed on the substrate, a semiconductor layer disposed on the buffer layer, a gate insulating layer disposed above the substrate and on the semiconductor layer, a gate electrode disposed on the gate insulating layer, a source electrode and a drain electrode both electrically connected to the semiconductor layer, and a metal silicide disposed between the buffer layer and the semiconductor layer.

Abstract: A semiconductor package may be provided. A semiconductor package may include a substrate. The semiconductor package may include a first semiconductor chip and a second semiconductor chip which are disposed adjacent to each other over a first surface of the substrate. The semiconductor package may include first bonding wires which electrically couple the first semiconductor chip and the substrate. The semiconductor package may include an insulation adhesive which is interposed between the second semiconductor chip and the substrate. The first bonding wires may be disposed to pass through the insulation adhesive and electrically couple the first semiconductor chip and the substrate.

Abstract: An apparatus and a method for diagnosis are provided. The apparatus for diagnosis lesion include: a model generation unit configured to categorize learning data into one or more categories and to generate one or more categorized diagnostic models based on the categorized learning data, a model selection unit configured to select one or more diagnostic model for diagnosing a lesion from the categorized diagnostic models, and a diagnosis unit configured to diagnose the lesion based on image data of the lesion and the selected one or more diagnostic model.

Abstract: A method of manufacturing a semiconductor package is provided. The method includes providing a strip substrate having a plurality of unit substrate regions that are spaced apart from each other by a periphery region and have blind vias, a peripheral conductive pattern layer disposed in the periphery region, and a connection pattern layer electrically connecting the blind vias to the peripheral conductive pattern layer. Semiconductor chips are disposed on the plurality of unit substrate regions, respectively. Conductive wires are formed to electrically connect connection pads disposed on the plurality of unit substrate regions to bonding pads disposed on the semiconductor chips. The connection pads are electrically connected to the blind vias, and forming the conductive wires includes performing a test for confirming a current that flows between each conductive wire and the peripheral conductive pattern layer through the unit substrate region.

Abstract: A method of manufacturing a semiconductor package is provided. The method includes providing a strip substrate having a plurality of unit substrate regions that are spaced apart from each other by a periphery region and have blind vias, a peripheral conductive pattern layer disposed in the periphery region, and a connection pattern layer electrically connecting the blind vias to the peripheral conductive pattern layer. Semiconductor chips are disposed on the plurality of unit substrate regions, respectively. Conductive wires are formed to electrically connect connection pads disposed on the plurality of unit substrate regions to bonding pads disposed on the semiconductor chips. The connection pads are electrically connected to the blind vias, and forming the conductive wires includes performing a test for confirming a current that flows between each conductive wire and the peripheral conductive pattern layer through the unit substrate region.

Abstract: Disclosed is a user interface which enables mark based interaction for images. The present disclosure relates to a user interface which enables mark based interaction for images, the images comprising a volume which is a three-dimensional image and slices which are two-dimensional images, each of which represents a cross section of the volume. At least two of the images each include the same visual mark for identifying at least one common region of interest. The user interface comprises: an input unit for receiving a user input associated with the same visual mark included in one of the images; and at least one component for enabling the interaction for the images including the same visual mark associated with the user input.

Abstract: A mobile robot system for allowing a user to easily input a control command of a mobile robot, and a remote control method for the same are disclosed. The mobile robot system and the remote control method thereof can allow a user to easily input control commands regarding the movement and operation of the mobile robot using the jog-dial interface, such that the possibility of causing input errors can be reduced and desired commands can be quickly and efficiently transmitted, resulting in increased user manipulation of the mobile robot system. When the user enters the rotation command of the mobile robot, the mobile robot system can allow the user to perform intuitive interfacing through shuttle manipulation, such that the mobile robot system can facilitate transmission of a movement command having a circular trajectory and the same mobile robot control as in the user-intended control is achieved, resulting in implementation of emotional interface capable of increasing user accessibility.