Abstract: Disclosed herein are a cooling device and method of controlling the same. Cooling device includes a plurality of refrigerant pipes including a polymer material and a power source configured to supply heating power for self-heating of the refrigerant pipes to the refrigerant pipes.

Abstract: A hybrid foundation structure includes a first perforation hole formed in the ground, at least one second perforation hole formed adjacent to the first perforation hole on a side surface of the first perforation hole, and a first pile and a second pile formed by mixing and injecting soil and soil solidifying agent into the first perforation hole and the second perforation hole.

Abstract: A hybrid foundation structure includes a first perforation hole formed in the ground, at least one second perforation hole formed adjacent to the first perforation hole on a side surface of the first perforation hole, and a first pile and a second pile formed by mixing and injecting soil and soil solidifying agent into the first perforation hole and the second perforation hole.

Abstract: Disclosed herein are a cooling device and method of controlling the same. Cooling device includes a plurality of refrigerant pipes including a polymer material and a power source configured to supply heating power for self-heating of the refrigerant pipes to the refrigerant pipes.

Abstract: The present invention relates to a foundation structure vertically installed on the ground, and comprising: an upper support layer 10 formed on the ground in the vertical direction; and a lower support layer 20 formed so as to extend downward from the upper support layer 10 and such that the width thereof is less than that of the upper support layer 10. The disclosed upper support layer 10 and the lower support layer 20 are structures formed from soil solidified by means of feeding and mixing an earth and soil-solidifying agent therein, and therefore are efficient and prevent overload due to boring equipment.

Abstract: The present invention relates to a foundation structure vertically installed on the ground, and comprising: an upper support layer 10 formed on the ground in the vertical direction; and a lower support layer 20 formed so as to extend downward from the upper support layer 10 and such that the width thereof is less than that of the upper support layer 10. The disclosed upper support layer 10 and the lower support layer 20 are structures formed from soil solidified by means of feeding and mixing an earth and soil-solidifying agent therein, and therefore are efficient and prevent overload due to boring equipment.

Abstract: A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.

Abstract: Disclosed herein is an anti-fingerprint coating composition, a coating composition for forming thin films that prevents fingerprints adhered to displays or touch panels from being remarkably visible and exhibits superior durability and slip properties, and a method for preparing the same. The anti-fingerprint coating composition is prepared by mixing a silane compound having an alkyl group with distilled water or acid.

Abstract: Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same.

Abstract: The present invention relates to a foundation structure vertically installed on the ground, and comprising: an upper support layer 10 formed on the ground in the vertical direction; and a lower support layer 20 formed so as to extend downward from the upper support layer 10 and such that the width thereof is less than that of the upper support layer 10. The disclosed upper support layer 10 and the lower support layer 20 are structures formed from soil solidified by means of feeding and mixing an earth and soil-solidifying agent therein, and therefore are efficient and prevent overload due to boring equipment.

Abstract: A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.

Abstract: A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.

Abstract: A coating structure and a method for forming the same where, by forming an aluminum oxide layer and a silicon dioxide layer between a product to be coated and a coating layer, durability, reliability and anti-corrosion of the coating layer can be improved and furthermore, product yield can also be improved. The coating structure formed on the surface of a product includes an aluminum oxide (Al2O3) layer formed on the surface of the product, a silicon dioxide (SiO2) layer formed on the surface of the aluminum oxide (Al2O3) layer, and a coating composition layer formed on the silicon dioxide (SiO2) layer.

Abstract: A photoacceptive layer having a core-shell structure and a solar cell using the same are provided. More specifically, a photoacceptive layer including a metal oxide of a core-shell structure which can improve photoconversion efficiency by improving a electron migration path, and a solar cell using the same are provided.

Abstract: Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same.

Abstract: The present invention relates to a liquid crystal display, wherein arrangement of liquid crystal molecules thereof is controlled by using a monomer that is polymerized by ultraviolet rays to provide a pre-tilt. To prevent damage to organic material layers when irradiating ultraviolet rays to the monomer, a blocking film made of an ultraviolet absorbing agent is formed on or over at least one such layer.

Abstract: A coating structure and a method for forming the same where, by forming an aluminum oxide layer and a silicon dioxide layer between a product to be coated and a coating layer, durability, reliability and anti-corrosion of the coating layer can be improved and furthermore, product yield can also be improved. The coating structure formed on the surface of a product includes an aluminum oxide (Al2O3) layer formed on the surface of the product, a silicon dioxide (SiO2) layer formed on the surface of the aluminum oxide (Al2O3) layer, and a coating composition layer formed on the silicon dioxide (SiO2) layer.

Abstract: Disclosed herein is an anti-fingerprint coating composition, a coating composition for forming thin films that prevents fingerprints adhered to displays or touch panels from being remarkably visible and exhibits superior durability and slip properties, and a method for preparing the same. The anti-fingerprint coating composition is prepared by mixing a silane compound having an alkyl group with distilled water or acid.

Abstract: Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same.

Abstract: Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same.