Patents by Inventor Ki-Youn Jang

Ki-Youn Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10842057
    Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: November 17, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Youn Jang, Jeong-Ung Kim, Jung-Je Bang, Sang-Hyun An
  • Patent number: 10698461
    Abstract: An electronic device according to an embodiment includes a battery supplying power to the electronic device, at least one circuit board having one or more components disposed thereon, a first temperature sensor disposed in a first region of the circuit board that is adjacent to one of the one or more components, a second temperature sensor disposed in a second region away from the first region, and a processor configured to measure a first temperature corresponding to the first region using the first temperature sensor, measure a second temperature corresponding to the second region or the outside of the electronic device using the second temperature sensor, determine a third temperature for the battery based at least on the first and second temperatures, and control the use of a resource of the electronic device when the third temperature satisfies a specified condition. Other various embodiments are also possible.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: June 30, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki Youn Jang, Kyung Ha Koo, Kun Tak Kim, Hyun Tae Jang, Chi Hwan Jeong, Chi Hyun Cho
  • Patent number: 10470345
    Abstract: Disclosed are various embodiments relating to an electronic device that includes a shield structure.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 5, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Heung Ye, Jung-Je Bang, Jeong-Ung Kim, Ki-Youn Jang
  • Patent number: 10340737
    Abstract: According to various embodiments, an electronic device for charging a battery of an external device may include a coil and a first circuit configured to wirelessly transmit power to the external device through the coil. A second circuit may be configured to wirelessly receive information from the external device. A fan may be disposed adjacent to the coil to discharge heat to the exterior of the electronic device. A control circuit may adjust the driving speed of the fan based at least in part on the received information.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: July 2, 2019
    Assignee: Samsmg Electronics Co., Ltd.
    Inventors: Ku-Chul Jung, Kyung-Ha Koo, Chul-Woo Park, Ki-Youn Jang, Yong-Sang Yun, Chi-Hyun Cho
  • Patent number: 10197457
    Abstract: A method and apparatus for determining a control temperature to control a function of an electronic device by using an atmospheric temperature when controlling a temperature of the electronic device, and for controlling the function of the electronic device according to a control step of the determined control temperature are provided. A method of operating an electronic device includes measuring an atmospheric temperature, determining at least one control temperature corresponding to the measured atmospheric temperature, measuring an internal temperature of the electronic device, and controlling a function in accordance with the measured internal temperature of the electronic device and the determined at least one control temperature.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: February 5, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Youn Jang, Min-Su Kim, Kun-Tak Kim, Chi-Hyun Cho
  • Patent number: 10064318
    Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: August 28, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Youn Jang, Jeong-Ung Kim, Jung-Je Bang, Sang-Hyun An
  • Publication number: 20180181171
    Abstract: An electronic device according to an embodiment includes a battery supplying power to the electronic device, at least one circuit board having one or more components disposed thereon, a first temperature sensor disposed in a first region of the circuit board that is adjacent to one of the one or more components, a second temperature sensor disposed in a second region away from the first region, and a processor configured to measure a first temperature corresponding to the first region using the first temperature sensor, measure a second temperature corresponding to the second region or the outside of the electronic device using the second temperature sensor, determine a third temperature for the battery based at least on the first and second temperatures, and control the use of a resource of the electronic device when the third temperature satisfies a specified condition. Other various embodiments are also possible.
    Type: Application
    Filed: December 21, 2017
    Publication date: June 28, 2018
    Inventors: Ki Youn Jang, Kyung Ha Koo, Kun Tak Kim, Hyun Tae Jang, Chi Hwan Jeong, Chi Hyun Cho
  • Publication number: 20170172020
    Abstract: Disclosed are various embodiments relating to an electronic device that includes a shield structure.
    Type: Application
    Filed: December 13, 2016
    Publication date: June 15, 2017
    Inventors: Jae-Heung YE, Jung-Je BANG, Jeong-Ung KIM, Ki-Youn JANG
  • Patent number: 9582051
    Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: February 28, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Youn Jang, Kyung-Ha Koo, Kun-Tak Kim, Ki-Cheol Bae, Hyun-Deok Seo, Hyun-Tae Jang, Jong-Chul Choi
  • Publication number: 20170047784
    Abstract: According to various embodiments, an electronic device for charging a battery of an external device may include a coil and a first circuit configured to wirelessly transmit power to the external device through the coil. A second circuit may be configured to wirelessly receive information from the external device. A fan may be disposed adjacent to the coil to discharge heat to the exterior of the electronic device. A control circuit may adjust the driving speed of the fan based at least in part on the received information.
    Type: Application
    Filed: August 10, 2016
    Publication date: February 16, 2017
    Inventors: Ku-Chul JUNG, Kyung-Ha KOO, Chul-Woo PARK, Ki-Youn JANG, Yong-Sang YUN, Chi-Hyun CHO
  • Patent number: 9202715
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and forming a package body on the substrate, the connection post, and the integrated circuit die.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: December 1, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: YoungChul Kim, KyungHoon Lee, Seong Won Park, Ki Youn Jang, JaeHyun Lee, DeokKyung Yang, In Sang Yoon, SungEun Park
  • Publication number: 20150264844
    Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.
    Type: Application
    Filed: May 15, 2015
    Publication date: September 17, 2015
    Inventors: Ki-Youn Jang, Jeong-Ung Kim, Jung-Je Bang, Sang-Hyun An
  • Patent number: 9129826
    Abstract: In a semiconductor assembly having stacked elements, discrete bumps made of a polymer such as an electrically nonconductive epoxy are interposed between the upper surface of a substrate and the lower surface of the overhanging part of an elevated element (die or package) with the discrete bump directly under bond sites on the elevated element.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: September 8, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Hun Teak Lee, Jong Kook Kim, Chul Sik Kim, Ki Youn Jang
  • Publication number: 20150241935
    Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.
    Type: Application
    Filed: February 19, 2015
    Publication date: August 27, 2015
    Inventors: Ki-Youn Jang, Kyung-Ha Koo, Kun-Tak Kim, Ki-Cheol Bae, Hyun-Deok Seo, Hyun-Tae Jang, Jong-Chul Choi
  • Publication number: 20140362889
    Abstract: A method and apparatus for determining a control temperature to control a function of an electronic device by using an atmospheric temperature when controlling a temperature of the electronic device, and for controlling the function of the electronic device according to a control step of the determined control temperature are provided. A method of operating an electronic device includes measuring an atmospheric temperature, determining at least one control temperature corresponding to the measured atmospheric temperature, measuring an internal temperature of the electronic device, and controlling a function in accordance with the measured internal temperature of the electronic device and the determined at least one control temperature.
    Type: Application
    Filed: May 28, 2014
    Publication date: December 11, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ki-Youn JANG, Min-Su KIM, Kun-Tak KIM, Chi-Hyun CHO
  • Publication number: 20140362543
    Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.
    Type: Application
    Filed: June 11, 2014
    Publication date: December 11, 2014
    Inventors: Ki-Youn Jang, Jeong-Ung Kim, Jung-Je Bang, Sang-Hyun An
  • Patent number: 8772916
    Abstract: An integrated circuit package system that includes: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. A mold system that includes a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: July 8, 2014
    Assignee: Stats Chippac Ltd.
    Inventors: Ki Youn Jang, Sungmin Song, JoHyun Bae
  • Patent number: 8703541
    Abstract: An electronic system is provided including forming a substrate having a radiating patterned pad, mounting an electrical device having an external interconnect over the radiating patterned pad with the external interconnect offset from the radiating patterned pad, and aligning the external interconnect with the radiating patterned pad.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: April 22, 2014
    Assignee: Stats Chippac Ltd.
    Inventors: Haengcheol Choi, Ki Youn Jang, Taewoo Kang, Il Kwon Shim
  • Patent number: 8524538
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate, the integrated circuit having an inactive side and a non-horizontal side; mounting a mold chase having a buffer layer over the integrated circuit; forming an encapsulation between the substrate and the buffer; and removing the mold chase, leaving the encapsulation having a recess exposing a portion of the non-horizontal side.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: September 3, 2013
    Assignee: Stats Chippac Ltd.
    Inventors: JaeHyun Lee, Ki Youn Jang, DokOk Yu
  • Patent number: RE48641
    Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: July 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Youn Jang, Kyung-Ha Koo, Kun-Tak Kim, Ki-Cheol Bae, Hyun-Deok Seo, Hyun-Tae Jang, Jong-Chul Choi