Abstract: Calibration circuits and methods to set an on-chip impedance to match a target impedance where the reference voltage does not equal one-half of the positive power supply voltage Vddq are described. In particular, calibration circuits and methods are provided to enable accurate impedance matching at a reference voltage Vref of K*Vddq, where K is a number between 0 and 1. In some embodiments, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed current mirror. In another embodiment, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed mirror pull-up circuit. In yet another embodiment, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed target impedance.

Abstract: Calibration circuits and methods to set an on-chip impedance to match a target impedance where the reference voltage does not equal one-half of the positive power supply voltage Vddq are described. In particular, calibration circuits and methods are provided to enable accurate impedance matching at a reference voltage Vref of K*Vddq, where K is a number between 0 and 1. In some embodiments, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed current mirror. In another embodiment, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed mirror pull-up circuit. In yet another embodiment, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed target impedance.

Abstract: Calibration circuits and methods to set an on-chip impedance to match a target impedance where the reference voltage does not equal one-half of the positive power supply voltage Vddq are described. In particular, calibration circuits and methods are provided to enable accurate impedance matching at a reference voltage Vref of K*Vddq, where K is a number between 0 and 1. In some embodiments, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed current mirror. In another embodiment, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed mirror pull-up circuit. In yet another embodiment, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed target impedance.

Abstract: Calibration circuits and methods to set an on-chip impedance to match a target impedance where the reference voltage does not equal one-half of the positive power supply voltage Vddq are described. In particular, calibration circuits and methods are provided to enable accurate impedance matching at a reference voltage Vref of K*Vddq, where K is a number between 0 and 1. In some embodiments, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed current mirror. In another embodiment, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed mirror pull-up circuit. In yet another embodiment, a calibration circuit for impedance matching at a reference voltage of K*Vddq uses a ratioed target impedance.

Abstract: A dual bit line precharge architecture and method for low power DRAM which provides the low operating voltage of a non-half supply voltage (VCC/2) precharge with the low memory array current consumption and low memory array noise spike of VCC/2 precharge techniques. The architecture and technique of the present invention provides both reference voltage (VSS) precharged sub arrays and VCC precharged sub arrays on the same DRAM memory either with or without the novel charge sharing or charge recycling circuitry between these two different sub arrays as disclosed herein.

Abstract: A dual bit line precharge architecture and method for low power DRAM which provides the low operating voltage of a non-half supply voltage (VCC/2) precharge with the low memory array current consumption and low memory array noise spike of VCC/2 precharge techniques. The architecture and technique of the present invention provides both reference voltage (VSS) precharged sub arrays and VCC precharged sub arrays on the same DRAM memory either with or without the novel charge sharing or charge recycling circuitry between these two different sub arrays as disclosed herein.

Abstract: A dual bit line precharge architecture and method for low power DRAM which provides the low operating voltage of a non-half supply voltage (VCC/2) precharge with the low memory array current consumption and low memory array noise spike of VCC/2 precharge techniques. The architecture and technique of the present invention provides both reference voltage (VSS) precharged sub arrays and VCC precharged sub arrays on the same DRAM memory either with or without the novel charge sharing or charge recycling circuitry between these two different sub arrays as disclosed herein.

Abstract: A short-circuit charge-sharing technique which allows charge-sharing between two or more circuits with a simple shorting transistor controlled to achieve the desired operating voltage levels. The shorting transistor which can be either a P-channel Metal Oxide Semiconductor (PMOS) or an N-channel Metal Oxide Semiconductor (NMOS) device and can be controlled utilizing the same clock that enables the drive of the signals between which charge-sharing occurs. In operation, the desired operating voltage levels can be regulated by increasing and decreasing the pulse width of the control circuit output to the gate of the shorting transistor.

Abstract: A switched capacitor charge sharing technique for integrated circuit devices which allows for efficient charge sharing and signal level generation of exact desired values, and wherein the signal levels of the circuits sharing the charge do not have to have the same voltage levels. In a particular embodiment of the technique of the present invention disclosed herein, a switched capacitor is used to share charge between, for example, two different signals or two different groups of signals. The size of the capacitor can be adjusted to obtain the required signal level of the various signals.

Abstract: A circuit and method provide a charge sharing function during skewed data bus conditions in an integrated circuit memory. The charge sharing circuit includes two additional circuit blocks, one coupled to each of the capacitive lines in the charge-sharing line set, to provide the charge recycling feature. An extra clock signal is active one cycle early during a first clock period to trigger an extra drive circuit to generate a voltage differential on a first capacitive line that is similar to the voltage level generated when real data is being propagated. The presence of an extra voltage signal on the first capacitive line takes place earlier than what would normally happen and allows for proper charge sharing between a second capacitive line and the first capacitive line. Also, there is an additional control signal associated with a last clock period following normal non-skewed charge sharing.

Abstract: A high-speed, static random access memory (SRAM) compatible, high availability memory array and method employing synchronous dynamic random access memory (DRAM) in conjunction with a data cache and separate data read and write registers and tag blocks. The inclusion of separate data read and write registers allows the device to effectively operate at a cycle time limited only by the DRAM subarray cycle time. Further, the inclusion of two tag blocks allows one to be accessed with an externally supplied address and the other to be accessed with a write-back address, thus eliminating the requirement for a single tag to execute two read-modify write cycles in one DRAM cycle time.

Abstract: An early write with data masking technique for dynamic random access memory (DRAM) devices and those devices incorporating embedded DRAM. The technique of the present invention allows for early writes to DRAM arrays with direct bit, byte or word data masking capability.

Abstract: A short-circuit charge-sharing technique which allows charge-sharing between two or more circuits with a simple shorting transistor controlled to achieve the desired operating voltage levels. The shorting transistor which can be either a P-channel Metal Oxide Semiconductor (PMOS) or an N-channel Metal Oxide Semiconductor (NMOS) device and can be controlled utilizing the same clock that enables the drive of the signals between which charge-sharing occurs. In operation, the desired operating voltage levels can be regulated by increasing and decreasing the pulse width of the control circuit output to the gate of the shorting transistor.

Abstract: A high-speed, static random access memory (SRAM) compatible, high availability memory array and method employing synchronous dynamic random access memory (DRAM) in conjunction with a data cache and separate data read and write registers and tag blocks. The inclusion of separate data read and write registers allows the device to effectively operate at a cycle time limited only by the DRAM subarray cycle time. Further, the inclusion of two tag blocks allows one to be accessed with an externally supplied address and the other to be accessed with a write-back address, thus eliminating the requirement for a single tag to execute two read-modify write cycles in one DRAM cycle time.

Abstract: A data bus charge-sharing technique for integrated circuit devices may be implemented utilizing two voltage regulators to generate constant voltages VEQ1 and VEQ2, which are in the particular exemplary implementation disclosed, approximately 0.9 times a supply voltage VCC and 0.1 times VCC, respectively. One set of signals switches between VCC and VEQ1, and a second set of signals switches between VEQ2 and 0V. Charge-sharing between the two sets of signals is accomplished by the unique configuration of the voltage regulators.

Abstract: A switched capacitor charge sharing technique for integrated circuit devices which allows for efficient charge sharing and signal level generation of exact desired values, and wherein the signal levels of the circuits sharing the charge do not have to have the same voltage levels. In a particular embodiment of the technique of the present invention disclosed herein, a switched capacitor is used to share charge between, for example, two different signals or two different groups of signals. The size of the capacitor can be adjusted to obtain the required signal level of the various signals.

Abstract: A circuit and method provide a charge sharing function during skewed data bus conditions in an integrated circuit memory. The charge sharing circuit includes two additional circuit blocks, one coupled to each of the capacitive lines in the charge-sharing line set, to provide the charge recycling feature. An extra clock signal is active one cycle early during a first clock period to trigger an extra drive circuit to generate a voltage differential on a first capacitive line that is similar to the voltage level generated when real data is being propagated. The presence of an extra voltage signal on the first capacitive line takes place earlier than what would normally happen and allows for proper charge sharing between a second capacitive line and the first capacitive line. Also, there is an additional control signal associated with a last clock period following normal non-skewed charge sharing.

Abstract: A power-gating system and method for integrated circuit devices wherein the minimization of “Standby” or “Sleep Mode” current is a design factor and wherein an output stage is coupled directly between a supply voltage level (VCC) and a reference voltage level (VSS). In a representative complementary metal oxide semiconductor (CMOS) implementation, the gate of the N-channel output transistor in the final inverter stage may be driven below VSS in Sleep Mode while, alternatively, the corresponding P-channel transistor can be driven above VCC. In Active Mode, the switching speed of the output stage is not impacted, and the preceding stage can be made smaller than that of the output stage.

Abstract: A high speed power-gating technique for an integrated circuit device having a Sleep Mode of operation comprises providing an output stage coupled between a supply voltage source and a reference voltage source and driving a gate terminal of least one element of the output stage to a level above that of the supply voltage source or below that of the reference voltage source in the Sleep Mode of operation.

Abstract: A sense amplifier power-gating circuit and method is disclosed which is of particular utility with respect to DRAM devices, or those incorporating embedded DRAM, and having a power-down (or Sleep) mode of operation. In accordance with a particular technique of the present invention, the local sense amplifier driver transistors serve a dual purpose as both driver and power gate transistors thereby obviating the need for large, distinct power-gating devices. This serves to minimize on-chip area requirements while not degrading sensing speed as in conventional approaches.