Abstract: A CMOS semiconductor memory device in which a memory cell array and peripheral circuits are formed on the same semiconductor substrate. Wells of the peripheral circuits with MOS transistors of one channel type formed therein are supplied with a PN junction reverse bias potential higher than that for wells of the memory cell array during the memory operation, while the potential at the peripheral circuit wells is made equal to the potential at the wells of the memory cell array when the memory is not operating. High-speed operation of the memory device may be achieved because the junction capacitance of the MOS transistors formed in the peripheral circuit wells is reduced when the memory is operating.

Abstract: A semiconductor memory device comprising an N conductivity type semiconductor substrate, a P conductivity type well formed in a specified section of the surface of the semiconductor substrate, N conductivity type source and drain regions formed in the P conductivity type well, and a gate insulation layer deposited on the surface of the well over the source and drain regions. The P conductivity type well has a higher impurity concentration than the N conductivity type semiconductor substrate and the N conductivity type source and drain regions have a higher impurity concentration than the P conductivity type well. An insulation film is formed on the drain region and the insulation film, a metal electrode layer deposited on the insulation film and drain region collectively institute a capacitor.

Abstract: A voltage sensing circuit of differential input type includes at least one differential amplifier circuit connected between two complementary data lines of a semiconductor memory. The differential amplifier circuit detects data in response to a minute potential difference between the data lines and amplifies the same by a substantial change in conductance g.sub.m of metal oxide semiconductor field effect transistors (MOSFET) used in the circuit. When data is read from a semiconductor memory onto the data lines, the differential amplifier sensing circuit detects the data quickly by detecting potential changes of the data lines.

Abstract: A semiconductor memory device includes a memory circuit formed of a plurality of matrix-arranged memory cells, a plurality of output data lines, each of which is connected to memory cells arranged in the same column of the matrix memory circuit, and a plurality of data-sensing circuits for delivering output data from the matrix memory circuit to an output device. The data-sensing circuits are divided into a plurality of groups, and the semiconductor memory device further comprises clocked inverters whose input terminals are connected to the output terminals of the respective groups of sensing circuits and whose output terminals are connected to the output device, and a control circuit which, when one of the data-sensing circuits issues an output, supplies an energizing signal to that of the clocked inverters which is connected to said one data-sensing circuit.

Abstract: Provided is a semiconductor memory device comprising a pair of data input lines, a pair of data output lines, memory cells arranged in the form of a matrix, the memory cell of each column being connected between a pair of data lines, the memory cell of each row being connected to a row selection line, a memory cell selection circuit for generating column and row designation signals in order to select a desired one of said memory cells, a switching circuit disposed in each column and turned on upon receipt of a column designation signal from the memory cell selection circuit to connect the data line to a corresponding one of the data input lines, and a data detection circuit connected between the pair of data lines of each column and adapted, upon receipt of a column signal from the memory cell selection circuit, to transmit an inverted signal of a signal on the data line onto the data output line.

Abstract: The dynamic type semiconductor memory device comprises a refresh circuit and a plurality of memory cells which are connected between a data input line and a data output line, a plurality of read/write command signal lines and a plurality of word selection lines provided for respective semiconductor memory cells. Each semiconductor memory cell comprises serially connected first p-channel MOS transistor and a second n-channel MOS transistor having gate electrodes connected to the read/write command signal line and the data input line respectively, a third p-channel MOS transistor connected between the data output line and the word selection line and having a gate electrode connected to the node between the first and second transistors, and a parasitic capacitance connected to the node between the first and second transistors for storing data.