Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: Disclosed herein is an apparatus for processing a predictive spatiotemporal query based on synthetic data. The apparatus includes a query-processing unit for analyzing a predictive spatiotemporal query of a user and returning a processing result, a machine-learning unit for training a machine-learning model in response to a request from the query-processing unit and generating synthetic spatiotemporal data based on the machine-learning model, and a data storage unit for storing raw spatiotemporal data and the generated synthetic spatiotemporal data, and the raw spatiotemporal data may be stored in the form of a table including an identifier column and a position column.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: A semiconductor package includes a semiconductor die and an encapsulant layer. A mark is formed on a surface of the encapsulant layer. A damage barrier layer is disposed between the mark and the semiconductor die. The damage barrier layer blocks the propagation of laser light used to form the mark from reaching the semiconductor die.

Abstract: A method for displaying a message in a messenger service by a user terminal is proposed. The method may include receiving the message from a server. The method may also include receiving a mask command for the message from the server when text information extracted from the message satisfies a preset condition. The method may further include displaying a mask message corresponding to the message in a chat room of the messenger service based on the mask command.

Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.

Abstract: A method of operating a memory device is provided. The method includes: receiving a first command from a controller; activating a page of a memory cell array based on the first command; reading data of the activated page; detecting an error from the read data; correcting the detected error to generate error correction data; writing back the error correction data to the activated page in based on the detected error being a single-bit error; and blocking write-back of the error correction data to the activated page based on the detected error being a multi-bit error.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: Proposed is an auto-flattening control method that is an auto-flattening control method for determining a minimum driving value of tension that is applied to a sample coupled at both sides to a moving unit and a winding unit, respectively. The auto-flattening control method includes a sample rotation step of rotating the winding unit at a preset reference angle, a setup value checking step of monitoring a rotation load that is applied to a sample by rotation of the winding unit, and a setting comparison step of comparing variations between an N-th (a natural number larger than 0) rotation load and an N-1-th rotation load for the rotation load that is monitored through the setup value checking step.

Abstract: A semiconductor package includes a package substrate, first and second semiconductor chips stacked on the package substrate and wire-bonded to the package substrate. The first semiconductor chip includes first differential pair signal pads, a first option signal pad, and a first signal path control circuit. The second semiconductor chip includes second differential pair signal pads, a second option signal pad, and a second signal path control circuit. The first signal path control circuit changes a signal path of one of the differential pair signals of the first semiconductor chip by a first control signal. The second signal path control circuit changes a signal path of one of the differential pair signals of the second semiconductor chip by a second control signal.

Abstract: A 360 degree folding jig performs actions similar to those of a product to which a sample is applied when conducting a durability test for the sample. The 360 degree folding jig includes a fixed plate module on which one side of a sample is supported, a folding plate module that is spaced apart from the fixed plate module and on which the other side of the sample is supported so as to be reciprocally movable, and a pair of rotation support modules respectively provided at each end of the mutually adjacent fixed plate module and the folding plate module, and configured to couple the folding plate module to the fixed plate module so that the folding plate module is in-folded or out-folded.

Abstract: A sample stretch test device includes a setup table and grip modules arranged with regular intervals along an edge of a virtual arrangement circle around a center of the setup table and configured to grip a sample to be tested, and further includes at least any one of grip driving modules coupled to the setup table and configured to slide the grip modules along normals of the virtual arrangement circle in a horizontal direction parallel with the sample, and a pressing module disposed under the setup table and configured to press the sample in a vertical direction perpendicular to the sample.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces. A plurality of internal electrodes is disposed inside the ceramic body, connected to the first and second surfaces, and have one ends connected to the third and fourth surfaces. First and second side margin parts are disposed on end portions of the internal electrodes connected to the first and second surfaces. The ceramic body includes an active portion forming capacitance by including the plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween. An average Sn content in a region adjacent to the side margin part of the active portion is greater than an average Sn content in a central region of the active portion.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: A semiconductor package includes a semiconductor die and an encapsulant layer. A mark is formed on a surface of the encapsulant layer. A damage barrier layer is disposed between the mark and the semiconductor die. The damage barrier layer blocks the propagation of laser light used to form the mark from reaching the semiconductor die.

Abstract: A sliding apparatus for durability evaluation of a flexible material includes a base unit having a folding space formed therethrough, a sliding unit which is coupled to the base unit to be slidably movable and to which one side of a flexible material to be evaluated is fixed, and a folding unit which is arranged to be apart from the sliding unit, to which the other side of the flexible material is fixed, and which rotates with respect to the sliding unit to in-fold or out-fold the flexible material in an unfolded state. The sliding unit changes the position of the bent portion formed in the flexible material as the sliding unit slidably moves on the base unit with the flexible material in an in-folded state or out-folded state.

Abstract: A rolling apparatus for evaluating durability of a flexible material includes a base unit, a rolling unit rotatably coupled to the base unit and around which the flexible material is wound, and a sliding unit which grips an end of the flexible material wound around the rolling unit and is spaced apart from the rolling unit to be slidably coupled to the base unit. The sliding unit is set to at least one of a preset speed and torque in the direction in which the flexible material is pulled, and at least one of the speed and torque of the rolling unit for an unrolling operation of the rolling unit and a rolling operation of the rolling unit is controlled such that the flexible material can maintain a flat state.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated with the dielectric layers interposed therebetween, and an external electrode disposed externally on the body and connected to one or more of the plurality of internal electrodes. One of the plurality of dielectric layers includes a barium titanate composition including a Sn component. One of the plurality of internal electrodes includes a Sn component. The one of the plurality of dielectric layers has a Sn content equal to at least twice a Sn content of the one of the plurality of internal electrodes adjacent to the one of the plurality of dielectric layers.