Abstract: A swaged heat includes a fin base having an outer periphery, and formed with a first fin insert groove and a second fin insert groove interposing a swage portion of a bi-forked shape in between, a first fin fixed to the first fin insert groove of the fin base using the swage portion, a second fin fixed to the second fin insert groove of the fin base using the swage portion, a panel having an opening portion, and placed on the outer periphery of the fin base. The thickness of the outer periphery is smaller than that of the fin base.

Abstract: An assembled battery comprises: multiple cells 30 each having external terminals including a negative electrode terminal 50 and a positive electrode terminal; a bus bar 40 which connects the external terminal of one of two adjacent cells 30 and that of the other thereof; an electrically-conductive connecting member 70 which connects the external terminal and the bus bar 40 by welding to the external terminal and the bus bar 40; a welding portion 80 welded to the bus bar 40 and the connecting member 70; and a welding portion 82 welded to the external terminal and the connecting member 70. The connecting member 70 comprises an intervening portion 70b connected to the welding portion 80, and a main body portion 70a extending from the intervening portion 70b to the welding portion 82. The intervening portion 70b has a thickness that is smaller than that of the main body portion 70a.

Abstract: A swaged heat includes a fin base having an outer periphery, and formed with a first fin insert groove and a second fin insert groove interposing a swage portion of a bi-forked shape in between, a first fin fixed to the first fin insert groove of the fin base using the swage portion, a second fin fixed to the second fin insert groove of the fin base using the swage portion, a panel having an opening portion, and placed on the outer periphery of the fin base. The thickness of the outer periphery is smaller than that of the fin base.

Abstract: A water jacket core (10) includes a base part (11) and is provided with an intermediate female thread part (15) in that base within a region surrounded by tangent lines (18, 19) that are parallel to a center line (17) passing through the centers of a plurality of bore pin insertion bores (12) for forming cylinder bores and are in contact with the bore pin insertion bores and by an intermediate position for the adjacent bore pin insertion bores.

Abstract: Disclosed is a cast pin equipped with circular grooves which are provided at any location. The cast pin (10) is equipped with: an outer tube (11) in the shape of a hollow body the tip of which is closed; an inner tube (20) inserted into the outer tube (11); and a cooling medium pipe (30) that is inserted into the inner tube (20) and supplies a cooling medium to the interior of the inner tube (20). Three circular grooves (22) are formed at prescribed intervals in the longitudinal direction, for example, on the outer circumferential surface (21) of the inner tube (20). The circular grooves (22) are formed in the outer circumferential surface (21) by applying a cutting tool from the radial outward direction of the inner tube (20).

Abstract: A water jacket core (10) includes a base part (11) and is provided with an intermediate female thread part (15) in that base within a region surrounded by tangent lines (18, 19) that are parallel to a center line (17) passing through the centers of a plurality of bore pin insertion bores (12) for forming cylinder bores and are in contact with the bore pin insertion bores and by an intermediate position for the adjacent bore pin insertion bores.

Abstract: An assembled battery comprises: multiple cells 30 each having external terminals including a negative electrode terminal 50 and a positive electrode terminal; a bus bar 40 which connects the external terminal of one of two adjacent cells 30 and that of the other thereof; an electrically-conductive connecting member 70 which connects the external terminal and the bus bar 40 by welding to the external terminal and the bus bar 40; a welding portion 80 welded to the bus bar 40 and the connecting member 70; and a welding portion 82 welded to the external terminal and the connecting member 70. The connecting member 70 comprises an intervening portion 70b connected to the welding portion 80, and a main body portion 70a extending from the intervening portion 70b to the welding portion 82. The intervening portion 70b has a thickness that is smaller than that of the main body portion 70a.

Abstract: Disclosed is a cast pin equipped with circular grooves which are provided at any location. The cast pin (10) is equipped with: an outer tube (11) in the shape of a hollow body the tip of which is closed; an inner tube (20) inserted into the outer tube (11); and a cooling medium pipe (30) that is inserted into the inner tube (20) and supplies a cooling medium to the interior of the inner tube (20). Three circular grooves (22) are formed at prescribed intervals in the longitudinal direction, for example, on the outer circumferential surface (21) of the inner tube (20). The circular grooves (22) are formed in the outer circumferential surface (21) by applying a cutting tool from the radial outward direction of the inner tube (20).

Abstract: Four cavities are arranged on a concentric circle “C” with respect to the center “O” of a flow divider and a gate sleeve. Each of the cavities is connected to a sleeve stamp portion through each of four die side runners and each of four stamp side runners formed in a radial direction and separated from the neighboring runners. A semicircular arc-shaped reservoir is provided between the lower half side of the flow divider and the lower half side of the gate sleeve. This reservoir is connected to the sleeve stamp portion. A semi-solidified layer formed by pouring the molten metal into a sleeve is filled into the reservoir, so that the molten metal from which the semi-solidified layer is separated can be filled directly from each of the stamp side runners via the die side runners into each of the cavities evenly and simultaneously.

Abstract: A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A first insulating layer having an opening is provided on one main surface of an insulating resin layer which is a substrate, and an electrode portion, whose top portion protrudes above the top surface of the first insulating layer, is formed in the opening. A second insulating layer is provided on top of the first insulating layer in the periphery of the top portion of the first electrode portion; the second insulting layer is located slightly apart from the top portion of the first electrode portion. The first electrode portion is shaped such that the top portion is formed by a curved surface or formed by a curved surface and a plane surface smoothly connected to the curved surface.

Abstract: An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.

Abstract: A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved.

Abstract: Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

Abstract: A method of manufacturing a circuit apparatus includes forming a plurality of pierced holes in a metal substrate. A first wiring layer is formed on one side of the metal substrate via a first insulating layer, and a second wiring layer is formed on the other side of the metal substrate via a second insulating layer. A conductor layer is formed in at least some of the plurality of pierced holes to establish a connection between the first wiring layer and the second wiring layer. A circuit element is connected to the first wiring layer on the one side of the metal substrate. When a plurality of pierced holes are formed, protrusions are formed on a surface of the metal substrate at least along either edge of each of the pierced holes provided with the conductor layer to protrude in a convex manner from the surface of the metal substrate.

Abstract: A casting die assembly which does not produce any burrs includes a stationary die and a movable die that are clamped in a condition in which a slide core is caused to move toward a center of a movable die, and a back surface of a protrusion of the slide core contacts a stopper section provided on a frame section. The stopper section is subjected to the pressure applied to the slide core during a casting operation. Since the stopper section is provided on part of the frame section, which is integrally formed on the periphery of the stationary die, the stopper section is not caused to retreat or deform by the casting pressure and as a result, the slide core is not moved and burrs are not produced.

Abstract: The object of the present invention is to provide a casting method capable of simultaneously attaining the shortening of cycle time and the improvement in casting quality. The pressure allowing the molten metal level to go up to the positions of from P0 to P4 is applied to the molten metal within a molten metal reservoir 1. Then, the pressure of P4 is maintained for a predetermined time. During this time, the molten metal which comes into contact with an upper die 4 is cooled earlier than the molten metal being in contact with another die. Through this cooling the molten metal shrinks. However, since the pressure of P4 is maintained, the molten metal is supplied from the lower side to a shrunk portion, so as not to cause shrinkage cavity or underfill.

Abstract: A semiconductor device is of a PoP structure such that first electrode portions provided in a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. The first electrode has a first conductor having the same thickness as that of a wiring layer provided in an insulating layer, a second conductor formed on the first conductor, a gold plating layer provided on the second conductor.

Abstract: A semiconductor device is of a PoP structure such that first electrode portions provided on a first device mounting board constituting a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. A first insulating layer having an opening is provided on one main surface of an insulating resin layer which is a substrate, and an electrode portion, whose top portion protrudes above the top surface of the first insulating layer, is formed in the opening. A second insulating layer is provided on top of the first insulating layer in the periphery of the top portion of the first electrode portion; the second insulting layer is located slightly apart from the top portion of the first electrode portion. The first electrode portion is shaped such that the top portion is formed by a curved surface or formed by a curved surface and a plane surface smoothly connected to the curved surface.

Abstract: An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.