Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: The present invention is provided to quickly and efficiently inspect a plurality of CCD sensors. In the present invention, a plurality of openings is formed in a circuit board of a probe card. A plurality of vertical-type probe pins is connected to a lower surface of the circuit board. A guide board is installed at the lower surface of the circuit board, and respective probe pins are inserted into respective guide holes of the guide board. The guide board is made of a transparent glass board. During an inspection, inspection light emitted from a test head passes through the openings of the circuit board and the guide board, so that it is irradiated onto the plurality of CCD sensors on the substrate. Since the plurality of probe pins can be arranged at a narrow pitch without blocking the inspection light, adjacent CCD sensors on the substrate can be inspected simultaneously.

Abstract: A dicing method, integrated circuit chip testing method, substrate holding apparatus, and adhesive film are disclosed. A first adhesive film 22 in which the adhesion is reduced by ultraviolet radiation is stretched inside a ring-like frame 21 larger than a wafer size, and a wafer W is adhered on the first adhesion film 22. A second adhesive film 4 in which the adhesion of the two surfaces is reduced by heating is adhered on a plate-like jig 3. After the first film is adhered on the second film, dicing is performed. Since the wafer is adhered to the jig, the relative positions of chips do not shift from each other. This makes it possible to load the wafer together with the jig into a testing apparatus and align electrode pads of the chips with a probe. This allows, e.g., collective testing of a plurality of chips.

Abstract: An object of the present invention is to finely conduct an inspection of high integration devices by making it possible to form guide holes in a support plate of a probe card in a narrower pitch than in the conventional case of forming the guide holes in a support plate of the same area, and to broaden a range of options for an elastic member which works to urge a probe pin. The present invention has a circuit board and a support plate being placed under the circuit board and supporting the probe pin. In the guide hole formed in the support plate, the probe pin composed of an elastic portion and a pin portion is inserted, and a rip of the pin portion protrudes downward from the support plate. The guide hole has a quadrangular horizontal sectional shape.

Abstract: The present invention is provided to quickly and efficiently inspect a plurality of CCD sensors. In the present invention, a plurality of openings is formed in a circuit board of a probe card. A plurality of vertical-type probe pins is connected to a lower surface of the circuit board. A guide board is installed at the lower surface of the circuit board, and respective probe pins are inserted into respective guide holes of the guide board. The guide board is made of a transparent glass board. During an inspection, inspection light emitted from a test head passes through the openings of the circuit board and the guide board, so that it is irradiated onto the plurality of CCD sensors on the substrate. Since the plurality of probe pins can be arranged at a narrow pitch without blocking the inspection light, adjacent CCD sensors on the substrate can be inspected simultaneously.

Abstract: A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.

Abstract: An object of the present invention is to make it possible that a probe for testing electrical characteristics of an object to be tested is easily attached to a support member such as a contactor. A through hole is formed in the contactor. In the probe, a fitting/locking portion which can be fitted in this through hole is formed. The fitting/locking portion is formed to penetrate the through hole of the contactor and to be locked in the contactor in a state that a tip thereof is in contact with a connecting terminal of a printed wiring board. The fitting/locking portion itself is locked in the contactor by hooking a locking portion thereof to an end face on an upper side of the through hole.

Abstract: A large number of fine and deep holes are fanned in a glass substrate with high positional and dimensional accuracy. With a use of an etching of a photolithography technique, a large number of fine holes are formed in a silicon substrate. Hole forming pins are stood in the holes. The silicon substrate is held by a holding member of a hole forming apparatus. The glass substrate is housed in a container having an opened upper surface. The container is heated, and the glass substrate housed in the container is melted. The silicon substrate is lowered using the holding member, and the hole forming pins are inserted into the glass substrate. Thereafter, the container is cooled, and the glass substrate is solidified while having the hole forming pins inserted therein. The glass substrate is taken out from the container, the hole forming pins are dissolved in an aqua regia to thereby form the holes in the glass substrate.

Abstract: An object of the present invention is to finely conduct an inspection of high integration devices by making it possible to form guide holes in a support plate of a probe card in a narrower pitch than in the conventional case of forming the guide holes in a support plate of the same area, and to broaden a range of options for an elastic member which works to urge a probe pin. The present invention has a circuit board and a support plate being placed under the circuit board and supporting the probe pin. In the guide hole formed in the support plate, the probe pin composed of an elastic portion and a pin portion is inserted, and a rip of the pin portion protrudes downward from the support plate. The guide hole has a quadrangular horizontal sectional shape.

Abstract: An object of the present invention is to make it possible that a probe for testing electrical characteristics of an object to be tested is easily attached to a support member such as a contactor. A through hole is formed in the contactor. In the probe, a fitting/locking portion which can be fitted in this through hole is formed. The fitting/locking portion is formed to penetrate the through hole of the contactor and to be locked in the contactor in a state that a tip thereof is in contact with a connecting terminal of a printed wiring board. The fitting/locking portion itself is locked in the contactor by hooking a locking portion thereof to an end face on an upper side of the through hole.

Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: A probe is disclosed, comprising a beam, which has a front end, an intermediate portion and a base end. The leading end is a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe. The probe includes a substantially trapezoidal contactor, which is fixed to the leading end of the beam.

Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.

Abstract: A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.

Abstract: In a vacuum prober, a head plate is arranged on a prober chamber. A stage, first moving mechanism, recessed chamber, and sealing member are provided in the prober chamber. The stage is arranged below a probe card. The first moving mechanism vertically moves the stage in at least the Z direction. The recessed chamber has a bottom portion and side portion. A lower camera, an upper camera, and the stage are operated to obtain data for alignment. When the upper end of the side portion of the recessed chamber comes into tight contact with the lower surface of the sealing member and a vacuum mechanism evacuates the recessed chamber, a vacuum chamber is formed. As the chamber has a small capacity, the time required for evacuation can be shortened.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.