Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: In a vacuum prober, a head plate is arranged on a prober chamber. A stage, first moving mechanism, recessed chamber, and sealing member are provided in the prober chamber. The stage is arranged below a probe card. The first moving mechanism vertically moves the stage in at least the Z direction. The recessed chamber has a bottom portion and side portion. A lower camera, an upper camera, and the stage are operated to obtain data for alignment. When the upper end of the side portion of the recessed chamber comes into tight contact with the lower surface of the sealing member and a vacuum mechanism evacuates the recessed chamber, a vacuum chamber is formed. As the chamber has a small capacity, the time required for evacuation can be shortened.

Abstract: A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.

Abstract: A dicing method, integrated circuit element testing method, substrate holding apparatus, and adhesive film are disclosed. A first adhesive film 22 in which the adhesion is reduced by ultraviolet radiation is stretched inside a ring-like frame 21 larger than a wafer size, and a wafer W is adhered on the first adhesion film 22. A second adhesive film 4 in which the adhesion of the two surfaces is reduced by heating is adhered on a plate-like jig 3. After the first film is adhered on the second film, dicing is performed. Since the wafer is adhered to the jig, the relative positions of chips do not shift from each other. This makes it possible to load the wafer together with the jig into a testing apparatus and align electrode pads of the chips with a probe. This allows, e.g., collective testing of a plurality of chips.

Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: An inspection stage including a chuck top, a rectangular Z base, an X stage, a Y stage, and a Z axis elevating mechanism. The chuck top is used for mounting a wafer W. The Z base is provided with the chuck top and is vertically movable. The X stage elevatingly supports the Z base and is movable in an X direction. The Y stage movably supports the X stage in the X direction and is movable in a Y direction. The Z axis elevating mechanism is provided at each of the four corners of the Z base in such a manner as to surround the chuck top.

Abstract: Disclosed is a method of inspecting the electrical characteristics of a to-be-inspected object formed on a wafer under the state that the wafer chuck having the wafer placed thereon is overdriven by a lift mechanism, wherein measured is the sinking amount of the wafer chuck caused by the needle load applied from a plurality of probes of a probe card to the wafer chuck. Also disclosed are a needle load measuring method for measuring the applied needle load from the sinking amount, a needle load setting method, and a needle load detecting mechanism.

Abstract: Disclosed is a probe card comprising a probe having at thin film-like frame-like base section formed along the lower circumferential surface of an imaginary pyramid having at least a pyramidal top portion, a contact terminal section formed along the outer circumferential surface of the top portion of the imaginary pyramid, and at least one thin film-like joining section having a predetermined shape and serving to join the contact terminal section to the base section. The probe having a triangular pyramidal or conical shape as required.

Abstract: An inspection stage including a chuck top, a rectangular Z base, an X stage, a Y stage, and a Z axis elevating mechanism. The chuck top is used for mounting a wafer W. The Z base is provided with the chuck top and is vertically movable. The X stage elevatingly supports the Z base and is movable in an X direction. The Y stage movably supports the X stage in the X direction and is movable in a Y direction. The Z axis elevating mechanism is provided at each of the four corners of the Z base in such a manner as to surround the chuck top.

Abstract: Disclosed are a holding mechanism of a contactor and an automatic renewing mechanism of a contactor provided with the holding mechanism of the contactor. The contactor holding mechanism includes a frame (11) fixed to a performance board (P), a plurality of latch mechanisms (13) for holding the contactor inside the frame, and a suction fixing mechanism (14) for fixing the contactor held by the latch mechanisms inside the frame by a vacuum suction force. The automatic renewing mechanism of the contactor includes a holding mechanism (10) for detachably holding the contactor, and a delivery mechanism (16) for delivering the contactor (12) to and from the holding mechanism.

Abstract: Disclosed is a method of inspecting the electrical characteristics of a to-be-inspected object formed on a wafer under the state that the wafer chuck having the wafer placed thereon is overdriven by a lift mechanism, wherein measured is the sinking amount of the wafer chuck caused by the needle load applied from a plurality of probes of a probe card to the wafer chuck. Also disclosed are a needle load measuring method for measuring the applied needle load from the sinking amount, a needle load setting method, and a needle load detecting mechanism.

Abstract: An inspection stage including a chuck top, a rectangular Z base, an X stage, a Y stage, and a Z axis elevating mechanism. The chuck top is used for mounting a wafer W. The Z base is provided with the chuck top and is vertically movable. The X stage elevatingly supports the Z base and is movable in an X direction. The Y stage movably supports the X stage in the X direction and is movable in a Y direction. The Z axis elevating mechanism is provided at each of the four corners of the Z base in such a manner as to surround the chuck top.

Abstract: An inspection stage has the following a chuck top on which an object to be examined is mounted, a Z base for which the chuck top is provided and which is vertically movable, an X stage which supports the Z base to be vertically movable and which is movable in an X direction, and a Y stage which supports the X stage to be movable in the X direction and which is movable in a Y direction. The Z base is held and supported by three Z shaft lift mechanisms and is vertically movable. The inspection stage is applicable to an inspection stage.

Abstract: A probing card is disclosed which checks the electrical characteristic of a plurality of electrical elements (for example, IC chips) by contacting probes with electrode pads of the IC chips formed on an object (for example, a wafer) to be checked. The probe has a prismatic projection provided on a substrate, a spacer fixed to a top end face of the prismatic projection, a volute-like plate having one end fixed to the spacer and having an elasticity and a probe pin fixed to the other end of the volute-like plate. The other end side of the volute-like plate is formed as a free end.

Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Abstract: An inspection stage comprises a chuck top, a rectangular Z base, an X stage, a Y stage, and a Z axis elevating mechanism. The chuck top is used for mounting a wafer W. The Z base is provided with the chuck top and is vertically movable. The X stage elevatingly supports the Z base and is movable in an X direction. The Y stage movably supports the X stage in the X direction and is movable in a Y direction. The Z axis elevating mechanism is provided at each of the four corners of the Z base in such a manner as to surround the chuck top.