Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract: A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive reliability. A core substrate (21) including ad core pattern (12, 13), which has a pad (101, 111), is first prepared. Then, a laminated plate is formed by laminating an insulating layer (22) on the surface of the core substrate. Afterward, a surface pattern (11) is formed on the surface of the laminated plate. Further, the conductive hole (30, 31) is formed by irradiating a laser beam at the laminated plate. The bottom opening of the conductive hole (30, 31) is covered by the pad (101, 111).

Abstract: This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 &mgr;m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract: A printed circuit board 1 providing superior adhesion between a substrate 2 and a conductor pattern 3 and preventing damage of the substrate 2. The width c of the bottom surface 310 of the conductor pattern 3 is greater than the width d of the top surface 320. Accordingly, the conductor pattern 3 has a trapezoidal cross-section. The two side surfaces 315 of a lower portion 31 of the conductor pattern 3 are coated by a solder resist. The two side surfaces 325 at the upper portion 32 of the conductor pattern 3 are exposed from the solder resist 4. A solder ball 6 engages the two side surfaces 325.

Abstract: An electronic component mounting base board has an insulating substrate provided with a conductor circuit and a mount portion for an electronic component, and a heat slug adhered to the insulating substrate, wherein the heat slug is comprised of a flat main body and a projection portion extending vertically from a side face of the main body, and provided with a slit deforming portion absorbing deformation of the insulating substrate.

Abstract: A printed wiring board which has a conductor circuit (12) on an insulating substrate (10) and a surface insulating layer (14) formed on the surface of the substrate (10) including the surface of the conductor circuit (12). Part of the conductor circuit (12) has an exposed conductor section (120) having an exposed surface, and a surface insulating layer (140) around the conductor section (120) forms a recessed section at the same level of the surface of the conductor section (120) or lower than the surface. It is preferable to form a black or white solder resist layer on the surface insulating layer.

Abstract: A plurality of side-surface patterns 11 and 12 are disposed on the wall surfaces of a mount opening portion 2 for mounting electronic parts thereat. The mount opening portion includes projection portions 21 that project toward an interior thereof from the wall surfaces thereof. End portions of the respective side-surface patterns 11 and 12 extend to the side surfaces of the projection portions 21. Also, a plurality of side-surface patterns can be provided on the wall surfaces of the mount opening portion by etching the side-surface pattern non-formation portions of the conductive layer formed on the entirety of the wall surfaces of the mount opening portion in a state where the side-surface pattern formation portions are coated with a side-surface pattern resist film made of a negative photosensitive resin. With this structure, the side-surface patterns can be prevented from being peeled off, and side-surface patterns having a plurality of potentials can be readily formed.

Abstract: An electronic component mounting base board comprises an insulating substrate provided with a mounting portion for mounting an electronic component and a heat-sink plate disposed on an lower surface of the insulating substrate, in which the insulating substrate is provided with a wiring pattern for signal or power, a grounding pattern and a grounding hole, and the grounding hole is provided on its inner wall with a metal plated film for electrically connecting to the grounding pattern and a solder is filled in an inside of the grounding hole for electrically connecting to the heat-sink plate.

Abstract: An electronic circuit substrate excellent in reliability, which comprises a porous ceramic sintered body with film devices such as a conductive circuit, a resistor and a capacitor directly formed on a surface thereof. A resin is filled in the pores of the porous ceramic sintered body, and the bottom surface of the film devices are fit into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state. A method of producing the aforesaid electronic circuit substrate comprises the steps of forming film devices directly on a surface of a porous ceramic sintered body. Then, filling the pores of the porous ceramic sintered body with a resin so as to fit the under surface of the film devices into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedge state.

Abstract: A sliding material made of a sintered silicon carbide having open pores of a three dimensional network structure, the open pores present at a rate of 5 to 40 percent by volume, with the open pores being impregnated with a lubricant, where the lubricant is selected from a group of lubricants consisting of fluorine-type oils and silicone-type oils.

Abstract: A thermal storage unit has a thermal storage material which performs heat exchange through a fluid filled in a thermal storage body arranged within a vessel having an opening communicated to outside. The thermal storage body is a porous ceramic molding which contains the thermal storage medium.

Abstract: In a valve provided with a fixed valve body (13) forming a passage of a fluid and a movable valve body (14) arranged relatively movably in contact with this fixed valve body (13), in order to smooth the sliding between the fixed valve body (13) and movable valve body (14) over a long period, the sliding surface part of at least either of the above mentioned fixed valve body (13) and movable valve body (14) is formed of a ceramic compound charged with a lubricant in the open pores of a sintered ceramic body having open pores of a three-dimensional network structure. Thereby, the fluid passage can be connected and disconnected always lightly and stably by the operation of an operating lever (17) and the sliding of the fixed valve body (13) and movable valve body (14) in close contact with each other can be maintained over a long period to prevent the fluid from leaking out.

Abstract: A heat-resistant composite body comprising a composite body of silicon carbide and metallic silicon, the metallic silicon existing in the porous silicon carbide sintered body. The silicon carbide particles constituting the silicon carbide sintered carbide sintered body have an average particle diameter of 5 .mu.m or less, and at least a part of the silicon carbide particles is present in the sintered body in the form of porous secondary particles bonded together. The interconnected pores comprise (i) a group of fine pores having a pore diameter of 3 .mu.m or less, constituted of fine crystalline silicon carbide particles having an average diameter of 5 .mu.m or less and (ii) a group of relatively coarse pores having a pore diameter of from 15 to 40 .mu.m, constituted of porous secondary particles which are bonded to have an average particle diameter of from 40 .mu.m to 150 .mu.m and have a particle size distribution such that 60% by weight or more of particles are included in .+-.

Abstract: A process for preparing a heat-resistant composite body, comprising forming silicon carbide crystal powder into a molded product, sintering the molded product in a non-oxidizing atmosphere, and thereafter filling with metallic silicon the inside of permeable voids of said porous body obtained by sintering. Powder having an average particle diameter of 5 .mu.m or less is used as said silicon carbide crystals to form it into secondary particles having an average particle diameter of from 40 to 150 .mu.m and such a particle size distribution that 60% by weight or more of particles are included in .+-.20% of the average particle diameter. This is followed by pressure molding to form a molded product using a molding pressure such that said granular secondary particles collapse at their surface areas to mutually bond there and at the same time the insides thereof remain uncollapsed, and also the molded product may have a bulk specific density of from 1.1 to 2.0 g/cm.sup.3.

Abstract: A porous silicon carbide sinter and its production process, the sinter consisting mainly of silicon carbide and having a three-dimensional network structure composed mainly of silicon carbide plate crystals having an average aspect ratio of 3 to 50 and an average length along the direction of the major axis of 0.5 to 1,000 .mu.m, wherein the open pores in the network structure have an average sectional area of 0.01 to 250,000 .mu.m.sup.2.

Abstract: A powder composition for producing sintered ceramic, which composition contains fluororesin powder which has not been used in the prior art as one of the materials constituting a molding assistant to be blended in the composition. With this composition, it is possible to produce a high-density green molding with few molding defects under a relatively low molding pressure. The invention also provides a process for producing such a composition.

Abstract: In a method of producing a silicon carbide sintered compact comprising steps of placing silicon carbide fines, a sintering additive and a shaping additive as required into a dispersing medium solution to form a supensoid, sieving operation on said suspensoid, forming a green shape from powders obtained in said sieving operation, and pressureless sintering process; an improvement characterized is that solid content comprising said silicon carbide fines and sintering additive is limited within a range of 10-50% by volume to said suspensoid, and that in the sieving operation, the suspensoid is passed through a sieve having an opening less than 65 .mu.m under a pressure differential between before and after the sieve to remove coarse particles in the silicon carbide fines, sintering additive and others to form silicon carbide sintered compact having a high strength.