Abstract: In a semiconductor integrated circuit device, a plurality of electrode pads for external connection are arranged in a zigzag pattern. Some electrode pads of the electrode pads of the plurality of I/O cells which are closer to a side of the semiconductor chip, each have an end portion closer to the side of the semiconductor chip, the end portion being set at the same position as that of an end portion of the corresponding I/O cell. A power source-side protective circuit and a ground-side protective circuit against discharge of static electricity are provided with the power source-side protective circuit being closer to the scribe region. A distance between a center position of one of the electrode pads and the ground-side protective circuit of the corresponding I/O cell and a distance between a center position of the other one electrode pad and the ground-side protective circuit of the corresponding I/O cell are both short and are substantially equal between each I/O cell.

Abstract: A developer accommodating container, comprising: an accommodating portion provided with a falling inlet; an optical portion which forms a light path inside the accommodating portion; a space portion which is provided in the middle of the light path and capable of accumulating the developer accommodated in the accommodating portion; a casing portion which has a cover portion covering the space portion not to flow in the developer to the space portion except a surface of the opposite side which is formed the falling inlet seeing from the space portion, and that has a introducing inlet which can introduce the developer to the space portion from upper position than at least a bottom of the space portion, and that has a discharge outlet which can discharge the developer at a lower position than the space portion.

Abstract: A process of pre-heating treatment is performed such that steel sheets or plates as working materials are heated by a heating unit provided ahead of a rotational tool moving in a welding direction to precisely control the surface temperature, area, position and the like of a heating region in the process of pre-heating treatment when performing friction stir welding on structural steel.

Abstract: A friction stir welding method for welding steel sheets together includes a heating device disposed ahead of a rotating tool in an advancing direction that preheats an unwelded portion before the welding thereof by the rotating tool and at the time of preheating, the surface temperature distribution in a direction perpendicular to the advancing direction in a position at which the welding by the rotating tool is initiated is set such that given that TAc1 is the Ac1 point of a steel sheet, the maximum temperature (TU) thereof is 0.6×TAc1<TU<1.8×TAc1, and given that L is the width of the heating region exceeding a temperature (TL)=0.6×TAc1, 0.3×d?L?2.0×d is satisfied with a diameter (d) of the shoulder.

Abstract: A friction stir welding method for steel sheets includes inserting a rotating tool into an unwelded portion where two or more steel sheets are overlapped or butted together; moving the rotating tool along portions to be welded while rotating the tool so that a softened portion is formed in the steel sheets by friction heat generated between the rotating tool and the steel sheets, and the steel sheets are welded together by utilizing a plastic flow generated by the softened portion being stirred; and preheating the unwelded portion before welding by the rotating tool by a pair of heating devices disposed over and under the unwelded portion and ahead of the rotating tool in the advancing direction to enable high speed welding without the risk of generation of welding defects and damage to the welding tool.

Abstract: In a semiconductor integrated circuit device, a plurality of electrode pads for external connection are arranged in a zigzag pattern. Some electrode pads of the electrode pads of the plurality of I/O cells which are closer to a side of the semiconductor chip, each have an end portion closer to the side of the semiconductor chip, the end portion being set at the same position as that of an end portion of the corresponding I/O cell. A power source-side protective circuit and a ground-side protective circuit against discharge of static electricity are provided with the power source-side protective circuit being closer to the scribe region. A distance between a center position of one of the electrode pads and the ground-side protective circuit of the corresponding I/O cell and a distance between a center position of the other one electrode pad and the ground-side protective circuit of the corresponding I/O cell are both short and are substantially equal between each I/O cell.

Abstract: Provided are a sheet feeding apparatus and an image forming apparatus, which can set a sheet feeding interval to be short. The controller determines whether a sheet surface height of an uppermost sheet becomes a predetermined sheet surface height, based on a detection signal from a lower limit detection sensor, when a pickup roller abuts the uppermost sheet. When determining that the sheet surface height of the uppermost sheet becomes the predetermined sheet surface height, the controller feeds a predetermined number of sheets without performing detection by the lower limit detection sensor, and then controls a motor such that the uppermost sheet is located with an appropriate range by lifting a tray when feeding a next sheet.

Abstract: When it is tried to detect a microscopic defect, it is desired that the width of the above-mentioned illuminated region in the minor axis direction should be short. In the related art, although an illuminated region is formed by converging light by some means, it is not easy to form an illuminated region with a narrower width. This is because various aberrations possessed by optical elements themselves used for convergence, aberrations possessed by other optical elements disposed on optical paths, assembly errors, and the like have undesired influence on the formation of linear illumination. In the related art, sufficient consideration has not been paid to the above points. The present invention is characterized in that it includes a system for changing the wavefront of light.

Abstract: In a semiconductor integrated circuit device, a plurality of electrode pads for external connection are arranged in a zigzag pattern. Some electrode pads of the electrode pads of the plurality of I/O cells which are closer to a side of the semiconductor chip, each have an end portion closer to the side of the semiconductor chip, the end portion being set at the same position as that of an end portion of the corresponding I/O cell. A power source-side protective circuit and a ground-side protective circuit against discharge of static electricity are provided with the power source-side protective circuit being closer to the scribe region. A distance between a center position of one of the electrode pads and the ground-side protective circuit of the corresponding I/O cell and a distance between a center position of the other one electrode pad and the ground-side protective circuit of the corresponding I/O cell are both short and are substantially equal between each I/O cell.

Abstract: A toner supply device includes a toner cartridge, a cartridge driving source, a toner detection sensor, a conveyance member which conveys toner, and a rotating member driving source which drives the conveyance member. In addition, a driving controller controls the rotating member driving source, and a controller controls a series of replenishment operations of the toner cartridge based on a detection result of the toner detection sensor. The series of replenishment operations of the toner cartridge is controlled based on information about driving of the conveyance member, which is acquired at every predetermined period after starting the series of replenishment operations.

Abstract: In a semiconductor integrated circuit device, a plurality of electrode pads for external connection are arranged in a zigzag pattern. Some electrode pads of the electrode pads of the plurality of I/O cells which are closer to a side of the semiconductor chip, each have an end portion closer to the side of the semiconductor chip, the end portion being set at the same position as that of an end portion of the corresponding I/O cell. A power source-side protective circuit and a ground-side protective circuit against discharge of static electricity are provided with the power source-side protective circuit being closer to the scribe region. A distance between a center position of one of the electrode pads and the ground-side protective circuit of the corresponding I/O cell and a distance between a center position of the other one electrode pad and the ground-side protective circuit of the corresponding I/O cell are both short and are substantially equal between each I/O cell.

Abstract: When it is tried to detect a microscopic defect, it is desired that the width of the above-mentioned illuminated region in the minor axis direction should be short. In the related art, although an illuminated region is formed by converging light by some means, it is not easy to form an illuminated region with a narrower width. This is because various aberrations possessed by optical elements themselves used for convergence, aberrations possessed by other optical elements disposed on optical paths, assembly errors, and the like have undesired influence on the formation of linear illumination. In the related art, sufficient consideration has not been paid to the above points. The present invention is characterized in that it includes a system for changing the wavefront of light.

Abstract: In a welded joint manufactured by a method of resistance spot welding thin steel sheets, when the diameter of a nugget formed from the thin steel sheets is denoted by d, on a horizontal plane passing through a nugget surrounded by a corona bond, distribution of an amount of P in a region in the nugget surrounded by a closed curve at a distance d/100 from an end portion of a weld zone toward the inside of the nugget and a closed curve at a distance d/5 from the end portion of the weld zone toward the inside of the nugget is analyzed by area analysis, and the proportion of the region in terms of area in which the concentration m (mass %) of P is more than twice the concentration M (mass %) of P of a base metal composition is 5% or less.

Abstract: Provided is a method of resistance spot welding of welding a sheet set including a high strength steel sheet with which a high joint strength can be achieved even for a high Ceq material. A method of resistance spot welding a sheet set of two or more lapped steel sheets by weld the sheet set while clamping and pressing the sheet set between a pair of welding electrodes includes a first welding step of applying an weld current Im (kA) and forming a nugget having a nugget diameter d (mm) that satisfies the following inequality (1); a cooling step, subsequent to the foregoing first welding, of cooling the sheet set while continuing to press the sheet set; and a second welding step of performing two-step welding, 3×?tm?d?6×?tm??(1), where tm is the thickness (mm) of the thinnest one of the foregoing two or more steel sheets.

Abstract: In a semiconductor integrated circuit device, a plurality of electrode pads for external connection are arranged in a zigzag pattern. Some electrode pads of the electrode pads of the plurality of I/O cells which are closer to a side of the semiconductor chip, each have an end portion closer to the side of the semiconductor chip, the end portion being set at the same position as that of an end portion of the corresponding I/O cell. A power source-side protective circuit and a ground-side protective circuit against discharge of static electricity are provided with the power source-side protective circuit being closer to the scribe region. A distance between a center position of one of the electrode pads and the ground-side protective circuit of the corresponding I/O cell and a distance between a center position of the other one electrode pad and the ground-side protective circuit of the corresponding I/O cell are both short and are substantially equal between each I/O cell.

Abstract: In a semiconductor integrated circuit device, a plurality of electrode pads for external connection are arranged in a zigzag pattern. Some electrode pads of the electrode pads of the plurality of I/O cells which are closer to a side of the semiconductor chip, each have an end portion closer to the side of the semiconductor chip, the end portion being set at the same position as that of an end portion of the corresponding I/O cell. A power source-side protective circuit and a ground-side protective circuit against discharge of static electricity are provided with the power source-side protective circuit being closer to the scribe region. A distance between a center position of one of the electrode pads and the ground-side protective circuit of the corresponding I/O cell and a distance between a center position of the other one electrode pad and the ground-side protective circuit of the corresponding I/O cell are both short and are substantially equal between each I/O cell.

Abstract: Provided are a sheet feeding apparatus and an image forming apparatus, which can set a sheet feeding interval to be short. The controller determines whether a sheet surface height of an uppermost sheet becomes a predetermined sheet surface height, based on a detection signal from a lower limit detection sensor, when a pickup roller abuts the uppermost sheet. When determining that the sheet surface height of the uppermost sheet becomes the predetermined sheet surface height, the controller feeds a predetermined number of sheets without performing detection by the lower limit detection sensor, and then controls a motor such that the uppermost sheet is located with an appropriate range by lifting a tray when feeding a next sheet.

Abstract: A toner supply device includes: a toner cartridge; a cartridge driving source; a toner detection sensor; a conveyance member which conveys toner; a rotating member driving source which drives the conveyance member; a driving controller which controls the rotating member driving source; and a controller which controls a series of replenishment operations of the toner cartridge based on a detection result of the toner detection sensor, and controls whether to continue a series of replenishment operations of the toner cartridge based on information about driving of the conveyance member which is acquired at every predetermined period after the starting of the series of replenishment operations of the toner cartridge.

Abstract: A developer accommodating container, comprising: an accommodating portion provided with a falling inlet; an optical portion which forms a light path inside the accommodating portion; a space portion which is provided in the middle of the light path and capable of accumulating the developer accommodated in the accommodating portion; a casing portion which has a cover portion covering the space portion not to flow in the developer to the space portion except a surface of the opposite side which is formed the falling inlet seeing from the space portion, and that has a introducing inlet which can introduce the developer to the space portion from upper position than at least a bottom of the space portion, and that has a discharge outlet which can discharge the developer at a lower position than the space portion.

Abstract: In a conventional art, vibrations of compositions (for example, a Z-stage, a ?-stage, a wafer chuck, and a detection optical system mounted above a stage linear scale) within a device are not precisely fed back to a coordinate value.