Patents by Inventor Koji Imai

Koji Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7753488
    Abstract: An ink-jet recording apparatus includes an ink supplying member which has an ink storage section, an exhaust section, and a space portion formed between the ink storage section and the exhaust section, an ink-jet head, and two flexible flat cables (FPC) which are drawn in mutually opposite directions from the ink-jet head. One FPC is wired by passing along a side of the ink supplying member, opposite to the exhaust section, and the other FPC is wired by passing through the space portion. Since the FPC is wired avoiding the ink supplying member and the exhaust section, it is possible to eliminate adhering of ink to the FPC, and to eliminate a waste of FPC wiring. Moreover, it is possible to reduce a cost, and to uniformize electrical characteristics of the two flexible flat cables.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: July 13, 2010
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Koji Imai
  • Patent number: 7654654
    Abstract: An ink jet printer head including a cavity unit; an piezoelectric actuator; and a wiring substrate. The piezoelectric actuator includes pairs of first common electrode connection pads and pairs of first individual electrode connection pads which are provided on an outer surface thereof such that the two first common electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to a first reference point on the outer surface and the two first individual electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to the first reference point.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: February 2, 2010
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Atsushi Ito, Koji Imai
  • Patent number: 7570494
    Abstract: A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wires that connect to one of the terminal lands of each of the recording elements. A first common voltage wire connects the other terminal lands of each of the recording elements to a common potential. A drive circuit is attached to the flexible printed circuit board to drive the recording head via the feeder wires. The other end of the flexible printed circuit board is connected to another circuit board used by the recording apparatus.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: August 4, 2009
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Shigeru Suzuki, Yasuhiro Kato, Tomoyuki Kubo, Koji Imai
  • Patent number: 7536762
    Abstract: A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic component on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the electronic component and the tin-plated first terminal; forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step; and bonding the second terminal having the copper-tin alloy formed on its surface to a terminal of another board by means of a thermosetting conductive adhesive.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: May 26, 2009
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Koji Imai, Yuji Shinkai
  • Publication number: 20090096842
    Abstract: A liquid droplet jetting apparatus includes: a liquid droplet jetting head which jets liquid droplets when an actuator is driven; and a wiring member via which a drive signal is outputted to a surface electrode formed in the actuator. The wiring member includes a substrate, a wire provided on the substrate, and a covering member having an insulating property and covering the wire. The wire has an electrode land which is stacked on the surface electrode to be connected to the surface electrode, and the covering member has a first covering layer in which a first opening to expose the electrode land therein is formed and a second covering layer having a second opening communicating with the first opening and covering the first covering layer. The surface electrode and the electrode land are connected in a state that an electroconductive material is interposed therebetween through the first and second openings.
    Type: Application
    Filed: October 16, 2008
    Publication date: April 16, 2009
    Inventors: Tomoyuki Kubo, Koji Imai
  • Patent number: 7467468
    Abstract: A method for manufacturing an ink-jet head includes the step of forming, in a substrate, through holes respectively corresponding to conductors on one face of the substrate and each having its diameter increasing from the one face toward the other face of the substrate. Here, the through holes are formed in such a manner as to satisfy R>d/2+t/tan ?, where: d represents a width of an opening of the through hole on the one face; ? represents an angle of inclination of a sidewall defining the through hole with respect to the one face; R represents a shortest distance from the center of the through hole to a periphery of an electrode that neighbors an electrode corresponding to the through hole; and t represents a thickness of the substrate.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: December 23, 2008
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Koji Imai
  • Publication number: 20080256792
    Abstract: A terminal insertion apparatus having a wire holding unit holding two wires, each wire having a terminal, a connector holding unit holding a connector housing having at least two holes for receiving terminals, and a terminal insertion head is disclosed. The terminal insertion head has a wire gripping unit having a first holder and a second holder. The first holder and second holder are movable in a vertical direction toward and away from the wire holding unit and are movable in a horizontal direction toward and away from the connector holding unit. The first holder has an outer grip and an inner grip that together hold one of the two wires while the second holder has an outer grip and an inner grip that together hold the remaining of the two wires.
    Type: Application
    Filed: December 6, 2007
    Publication date: October 23, 2008
    Inventors: Koji Imai, Minoru Abe, Jun Funakawa, Koichi Nakajima, Daisuke Toma, Hirohide Miyazaki
  • Patent number: 7438372
    Abstract: There is disclosed a drive circuit of a driver device for a recording head of a recording apparatus, which receives a print data signal so as to drive each of a plurality of recording elements of the recording head in accordance with the print data signal. The print data signal including a selecting signal for selecting one of a plurality of waveform signals representing respective recording modes, and a non-selecting signal. The drive circuit comprises an outputting portion which outputs the selecting signal included in the print data signal, with the selecting signal associated with the corresponding recording element, and a non-selecting signal utilizing portion which uses the non-selecting signal for a purpose other than the selection of one of the waveform signals.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: October 21, 2008
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Koji Imai
  • Publication number: 20080253091
    Abstract: An electronic device includes an FPC, a circuit chip arranged on the flexible flat cable, a heat sink arranged on the circuit chip to release a heat of the circuit chip, and an elastic member arranged on a lower surface of the FPC. The upper surface of the FPC is large enough to cover a contact surface of the circuit chip. The elastic member does not overlap with an apex portion of the circuit chip, but overlaps with the circuit chip at an inner side of the apex portion. Therefore the elastic member does not press the FPC against the apex portion of the circuit chip. Accordingly, the FPC at a position corresponding to an apex of the circuit chip is suppressed from being distorted, and there is no fear of breaking of wire and exfoliation of the circuit chip.
    Type: Application
    Filed: April 8, 2008
    Publication date: October 16, 2008
    Applicant: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Yasuhiro Kato, Shigeru Suzuki, Koji Imai
  • Publication number: 20080246788
    Abstract: In a switch provided in a driver device and connected to a driver, a terminal and a lever is separated from each other (in the separated state) when a predetermined electric potential is not applied to a gate electrode. When a predetermined electric potential is applied to the gate electrode, the lever of the corresponding switch is deformed by electrostatic force between the gate electrode and the lever and comes into contact with the terminal, and thus the terminals are connected with the lever (in the contact state). A plurality of drivers are connected to the terminals of two or more of switches, respectively, and, when a driving potential is outputted from a driver, the driving potential is applied to a surface individual electrode connected to the switch in the contact state.
    Type: Application
    Filed: March 10, 2008
    Publication date: October 9, 2008
    Applicant: Brother Kogyo Kabushiki Kaisha
    Inventors: Toru Yamashita, Koji Imai
  • Publication number: 20080155816
    Abstract: A sealing member fitting apparatus includes a sealing member transfer device that switches between a sealing member receiving position where the sealing member transfer device faces a sealing member holding device provided with a hollow sealing member and a sealing member fitting position where the sealing member transfer device faces an electrical wire clamping device. The sealing member transfer device receives the sealing member in the sealing member receiving position and fits the sealing member on a covering end portion of the electrical wire in the sealing member fitting position. An electrical wire insertion guide device is disposed between the sealing member transfer device and the electrical wire clamping device and is slidable along the electrical wire from a lead-out member to the covering end portion. The sealing member transfer device positions a central axis of the covering end portion substantially coaxially with a central axis of the sealing member.
    Type: Application
    Filed: December 20, 2007
    Publication date: July 3, 2008
    Inventors: Yuji Ikeda, Koji Imai, Minoru Abe, Jun Funakawa, Koichi Nakajima, Daisuke Toma, Hirohide Miyazaki
  • Patent number: 7370943
    Abstract: A plurality of lands and a plurality of conducting wires connected independently to each land are formed on one side surface of an insulating substrate of a flexible printed circuit board. Through-holes are formed through the insulating substrate for exposing the lands to the other side surface. Solder is provided in the through-holes. The solder connects the lands to the head terminals on an inkjet head, which is located facing the other side surface of the insulating substrate. The insulating substrate separates the solder from areas between the conducting wires and from areas between the lands, thereby preventing short circuits from occurring when manufacturing the connecting structure with a low tolerance grade.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: May 13, 2008
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Koji Imai, Shuhei Hiwada
  • Publication number: 20080063242
    Abstract: The present invention aims at providing a biometric identification system and a biometric identification method capable of improving accuracy of verification in a biometric identification by registering plural pieces of bioinformation suitable for the verification.
    Type: Application
    Filed: October 21, 2005
    Publication date: March 13, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Koji IMAI, Takayuki TASHIRO, Toshinari SUO
  • Publication number: 20080050601
    Abstract: Applying liquid for hard coating that is made of organic silane compounds, the fine particles of composite mainly based on titanium-oxide, which also includes zirconium-oxide and silicon-oxide etc., dicyandiamide, itaconic acid, and Co(II) acetylacetonate compound on plastic lenses in order to form a hard coating layer after hardening.
    Type: Application
    Filed: August 28, 2007
    Publication date: February 28, 2008
    Inventors: Noboru Otani, Tomoko Shimizu, Koji Imai
  • Publication number: 20070263053
    Abstract: An ink-jet recording apparatus includes an ink supplying member which has an ink storage section, an exhaust section, and a space portion formed between the ink storage section and the exhaust section, an ink-jet head, and two flexible flat cables (FPC) which are drawn in mutually opposite directions from the ink-jet head. One FPC is wired by passing along a side of the ink supplying member, opposite to the exhaust section, and the other FPC is wired by passing through the space portion. Since the FPC is wired avoiding the ink supplying member and the exhaust section, it is possible to eliminate adhering of ink to the FPC, and to eliminate a waste of FPC wiring. Moreover, it is possible to reduce a cost, and to uniformize electrical characteristics of the two flexible flat cables.
    Type: Application
    Filed: May 11, 2007
    Publication date: November 15, 2007
    Inventor: Koji Imai
  • Patent number: 7284841
    Abstract: A common joining electrode and arrays of island-shaped individual joining electrodes are formed on a substrate of a flexible flat cable, which is connected to a recording head. The common joining electrode extends in the X direction along the periphery of the cable board. The individual joining electrodes are arranged in a staggered manner in a region surrounded by the common joining electrode. The wiring of the individual joining electrodes is patterned so that the gap between the common joining electrode and a wiring connected a nearest individual joining electrode to the common joining electrode is larger than the gap between the common joining electrode and the nearest individual joining electrode. In locations where wirings are closed to one another, it is possible to realize a fine wiring density without excessively narrowing the gaps between adjoining wirings and between the wirings and the side edges of the common joining electrode.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: October 23, 2007
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Koji Imai, Atsushi Ito
  • Publication number: 20070236544
    Abstract: An ink jet printer head including a cavity unit; an piezoelectric actuator; and a wiring substrate. The piezoelectric actuator includes pairs of first common electrode connection pads and pairs of first individual electrode connection pads which are provided on an outer surface thereof such that the two first common electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to a first reference point on the outer surface and the two first individual electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to the first reference point.
    Type: Application
    Filed: March 28, 2007
    Publication date: October 11, 2007
    Inventors: Atsushi Ito, Koji Imai
  • Patent number: 7213912
    Abstract: An ink jet printer head including a cavity unit; an piezoelectric actuator; and a wiring substrate. The piezoelectric actuator includes pairs of first common electrode connection pads and pairs of first individual electrode connection pads which are provided on an outer surface thereof such that the two first common electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to a first reference point on the outer surface and the two first individual electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to the first reference point.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: May 8, 2007
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Atsushi Ito, Koji Imai
  • Patent number: 7210756
    Abstract: A driving apparatus for at least one recording head comprises a first waveform signal receiver, a first drive signal provider, a first delay circuit, and a second drive signal provider. The first waveform signal receiver receives, through signal lines, a plurality of waveform signals representing various recording modes. The first drive signal provider generates drive signals on the basis of the plurality of waveform signals received by the first waveform signal receiver, and supplies the drive signals to one of recording element groups included in the at least one recording head. The first delay circuit delays the waveform signals received by the first waveform signal receiver. The second drive signal provider generates drive signals on the basis of the waveform signals delayed by the first delay circuit, and supplies the drive signals to another recording element group.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: May 1, 2007
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Koji Imai
  • Patent number: 7166529
    Abstract: A method of electrically connecting a wiring member to a plurality of electrodes which respectively correspond to a plurality of recording elements of a recording head, the wiring member including a plurality of wire portions and a plurality of terminal portions each of which is connected to the corresponding wire portion, the method including: forming convex bumps by using a conductive solder, respectively on the plurality of terminal portions; and connecting the plurality of terminal portions and the plurality of electrodes respectively to one another via the respective convex bumps by heating and melting the convex bumps at a predetermined temperature with the convex bumps pressed respectively onto the plurality of electrodes with a predetermined load, wherein the connecting the plurality of terminal portions and the plurality of electrodes is carried out such that the predetermined load and the predetermined temperature are decreased with an increase in a height of the convex bumps.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: January 23, 2007
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Koji Imai, Yuji Shinkai