Abstract: Second individual electrodes are formed and arranged in zigzag in two rows on one surface of a flexible sheet, and wirings connected to the second individual electrodes are arranged to pass between adjacent second individual electrodes of the other row. Formed on the other surface of the flexible sheet are electrode connection sections to be connected to the second individual electrodes through through-holes going through the flexible sheet. The electrode connection section has an area larger than the second individual electrode and is connected to an external electrode through solder.

Abstract: A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wires that connect to one of the terminal lands of each of the recording elements. A first common voltage wire connects the other terminal lands of each of the recording elements to a common potential. A drive circuit is attached to the flexible printed circuit board to drive the recording head via the feeder wires. The other end of the flexible printed circuit board is connected to another circuit board used by the recording apparatus.

Abstract: A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wires that connect to one of the terminal lands of each of the recording elements. A first common voltage wire connects the other terminal lands of each of the recording elements to a common potential. A drive circuit is attached to the flexible printed circuit board to drive the recording head via the feeder wires. The other end of the flexible printed circuit board is connected to another circuit board used by the recording apparatus.

Abstract: A method for stripping an electrical comprises the steps of: positioning the seal on the electrical wire in a position removed a specified distance in an axial direction from a front-end surface of the electrical wire; cutting a cover of the electrical wire by pressing cutting blades against the cover of the electrical wire between the seal and the front-end surface of the electrical wire; removing a cut portion of the cover by moving the cutting blades toward the front-end surface; cutting a core wire of the electrical wire by pressing the cutting blades against the core wire of the electrical wire between the seal and the front-end surface of the electrical wire; and moving the seal in the axial direction toward the front-end surface of the electrical wire to position the seal in the vicinity of a front-end surface of a remainder of the cover.

Abstract: A plurality of lands and a plurality of conducting wires connected independently to each land are formed on one side surface of an insulating substrate of a flexible printed circuit board. Through-holes are formed through the insulating substrate for exposing the lands to the other side surface. Solder is provided in the through-holes. The solder connects the lands to the head terminals on an inkjet head, which is located facing the other side surface of the insulating substrate. The insulating substrate separates the solder from areas between the conducting wires and from areas between the lands, thereby preventing short circuits from occurring when manufacturing the connecting structure with a low tolerance grade.

Abstract: A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic component on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the electronic component and the tin-plated first terminal; forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step; and bonding the second terminal having the copper-tin alloy formed on its surface to a terminal of another board by means of a thermosetting conductive adhesive.

Abstract: A wiring pattern having a plurality of terminal lands and leads independently respectively connected therewith is formed on one face of an insulator of a flexible wiring substrate. The insulator is provided with through-holes whereby the terminal lands are exposed on the other side. The terminal lands are electrically connected and fixed on the other face of the insulator by joining with the head terminals of the inkjet head with conductive adhesive, through the through-holes. Isolation between the leads and terminal lands arranged on the one side thereof from the conductive adhesive is provided by the insulator.

Abstract: A plurality of lands and a plurality of conducting wires connected independently to each land are formed on one side surface of an insulating substrate of a flexible printed circuit board. Through-holes are formed through the insulating substrate for exposing the lands to the other side surface. Solder is provided in the through-holes. The solder connects the lands to the head terminals on an inkjet head, which is located facing the other side surface of the insulating substrate. The insulating substrate separates the solder from areas between the conducting wires and from areas between the lands, thereby preventing short circuits from occurring when manufacturing the connecting structure with a low tolerance grade.

Abstract: A method of electrically connecting a wiring member to a plurality of electrodes which respectively correspond to a plurality of recording elements of a recording head, the wiring member including a plurality of wire portions and a plurality of terminal portions each of which is connected to the corresponding wire portion, the method including: forming convex bumps by using a conductive solder, respectively on the plurality of terminal portions; and connecting the plurality of terminal portions and the plurality of electrodes respectively to one another via the respective convex bumps by heating and melting the convex bumps at a predetermined temperature with the convex bumps pressed respectively onto the plurality of electrodes with a predetermined load, wherein the connecting the plurality of terminal portions and the plurality of electrodes is carried out such that the predetermined load and the predetermined temperature are decreased with an increase in a height of the convex bumps.

Abstract: A method for manufacturing an ink-jet head includes the step of forming, in a substrate, through holes respectively corresponding to conductors on one face of the substrate and each having its diameter increasing from the one face toward the other face of the substrate. Here, the through holes are formed in such a manner as to satisfy R>d/2+t/tan ?, where: d represents a width of an opening of the through hole on the one face; ? represents an angle of inclination of a sidewall defining the through hole with respect to the one face; R represents a shortest distance from the center of the through hole to a periphery of an electrode that neighbors an electrode corresponding to the through hole; and t represents a thickness of the substrate.

Abstract: A device for driving a recording head comprises select data input elements, a waveform signal selector, and a drive signal supplier. To the select data input elements, select data sets corresponding to recording elements included in the recording head are inputted in a serial manner. Each one of the select data sets indicates which one among waveform signals is to be employed for a corresponding recording element in a single printing cycle. The waveform signal selector selects, for each of the recording elements, one among the waveform signals on the basis of a corresponding one among the select data sets inputted to the select data input. The drive signal supplier supplies, based on the selected waveform signal, a drive signal to each of the recording elements. The number of the select data input elements is greater than the number of bits included in each of the select data sets.

Abstract: There is disclosed a drive circuit of a driver device for a recording head of a recording apparatus, which receives a print data signal so as to drive each of a plurality of recording elements of the recording head in accordance with the print data signal. The print data signal including a selecting signal for selecting one of a plurality of waveform signals representing respective recording modes, and a non-selecting signal. The drive circuit comprises an outputting portion which outputs the selecting signal included in the print data signal, with the selecting signal associated with the corresponding recording element, and a non-selecting signal utilizing portion which uses the non-selecting signal for a purpose other than the selection of one of the waveform signals.

Abstract: An ink jet printer head including a cavity unit; an piezoelectric actuator; and a wiring substrate. The piezoelectric actuator includes pairs of first common electrode connection pads and pairs of first individual electrode connection pads which are provided on an outer surface thereof such that the two first common electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to a first reference point on the outer surface and the two first individual electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to the first reference point.

Abstract: To provide an underbody sound damping structure capable of damping stone chipping with a low cost. An underbody sound damping structure for motor vehicles, characterized by having an acryl-epoxy type heat-cured layer on the coating surface of a steel panel coated with a primer.

Abstract: A driving apparatus for at least one recording head comprises a first waveform signal receiver, a first drive signal provider, a first delay circuit, and a second drive signal provider. The first waveform signal receiver receives, through signal lines, a plurality of waveform signals representing various recording modes. The first drive signal provider generates drive signals on the basis of the plurality of waveform signals received by the first waveform signal receiver, and supplies the drive signals to one of recording element groups included in the at least one recording head. The first delay circuit delays the waveform signals received by the first waveform signal receiver. The second drive signal provider generates drive signals on the basis of the waveform signals delayed by the first delay circuit, and supplies the drive signals to another recording element group.

Abstract: An ink jet recording apparatus in which after each purging operation, a wiping operation is performed, and then a preliminary ejection is performed. In the preliminary ejection operation, a preliminary ejection by a small dot waveform is performed, and then a preliminary ejection by a larger dot waveform than the small dot waveform is performed.

Abstract: An ink jet printer stores a waveform and tables. The tables list voltages in correspondence with each of a predetermined number of consecutive ejection operations from start of a scan row. Each of the plurality of tables corresponds to a different plurality of simultaneously fired actuators. The stored waveform is modified to match the voltage listed in correspondence with the next ink ejection operation in the table that corresponds to the number of actuators that will be simultaneously fired in the next ink ejection operation. Voltage is applied to actuators of a print head based on the modified waveform.

Abstract: A plurality of lands and a plurality of conducting wires connected independently to each land are formed on one side surface of an insulating substrate of a flexible printed circuit board. Through-holes are formed through the insulating substrate for exposing the lands to the other side surface. Solder is provided in the through-holes. The solder connects the lands to the head terminals on an inkjet head, which is located facing the other side surface of the insulating substrate. The insulating substrate separates the solder from areas between the conducting wires and from areas between the lands, thereby preventing short circuits from occurring when manufacturing the connecting structure with a low tolerance grade.

Abstract: An adhesive/sealant which is curable by radiation exposure composition having at least one of adhesive and sealant properties and comprising a radiation polymerizable vinyl material, a polymerization initiator for radiation polymerization of the vinyl material, a thermosetting epoxy-containing material and a heat-activatable hardener for the epoxy-containing material.

Abstract: An ink jet printer stores a waveform and tables. The tables list voltages in correspondence with each of a predetermined number of consecutive ejection operations from start of a scan row. Each of the plurality of tables corresponds to a different plurality of simultaneously fired actuators. The stored waveform is modified to match the voltage listed in correspondence with the next ink ejection operation in the table that corresponds to the number of actuators that will be simultaneously fired in the next ink ejection operation. Voltage is applied to actuators of a print head based on the modified waveform.