Abstract: An object of the present invention is to provide a negative electrode which attains excellent Ohmic contact with an n-type gallium nitride-based compound semiconductor layer and which resists deterioration in characteristics which would be caused by heating. Another object of the invention is to provide a gallium nitride-based compound semiconductor light-emitting device having the negative electrode.

Abstract: An object of the present invention is to provide a negative electrode which attains excellent Ohmic contact with an n-type gallium nitride-based compound semiconductor layer, which resists deterioration in characteristics which would be caused by heating, and which can be produced at high efficiency. Another object of the invention is to provide a gallium nitride-based compound semiconductor light-emitting device having the negative electrode.

Abstract: The present invention is a high-frequency current essentially of M—X—Y, where M is Fe, Co, and/or Ni, X is an element other than M or Y, and Y is F, N, and/or O. The maximum value ??max of the loss factor ?? of this material exists at 100 MHz to 10 GHz. A relative bandwidth bwr is not greater than 200% where the relative bandwidth bwr is obtained between two frequencies at which the value of ?? is 50% of ??max and normalizing the frequency bandwidth at the center frequency.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (?m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).

Abstract: In a heat-shrinkable tube (1) having a tubular member which is shrinkable in response to heat and has a cylindrical surface, a thin film is formed on at least a part of the cylindrical surface. The thin film is made of a magnetic loss material which has a high magnetic loss characteristic. The thin film has a first phase comprising a first one of Fe, Co, and Ni and has a second phase comprising an insulator containing at least one element other than Fe, Co, and Ni.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).

Abstract: In a display device (70, 70A, 80-80G, 90-90F) having a display window (73, 81, 93), a magnetic loss layer or layer (75, 75A, 88-88C, 97-97C) is formed on at least a part of a principal surface of the display window. The magnetic loss layer may be a granular magnetic thin layer which is, for example, made of a magnetic substance of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The magnetic loss layer may be formed in any one selected from mat, lattice, stripe, and speck fashions. The magnetic loss layer may be formed in a mesh fashion.

Abstract: There is provided a composite magnetic tape which can be easily applied irrespective of the inside or outside of an electronic equipment, prevent radiation of undesired electromagnetic waves from the inside of the equipment and reflection into the inside of the equipment, and shield electromagnetic noise from the outside of the equipment. The tape may be in the form of an adhesive tape or a self-welding tape. The tape is constituted of a composite magnetic layer formed by dispersing soft magnetic powder into an organic binding agent. Alternatively, it may have a stacked structure of a composite magnetic layer and a conductor layer.

Abstract: In a display device (70, 70A, 80-80G, 90-90F) having a display window (73, 81, 93), a magnetic loss layer or layer (75, 75A, 88-88C, 97-97C) is formed on at least a part of a principal surface of the display window. The magnetic loss layer may be a granular magnetic thin layer which is, for example, made of a magnetic substance of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The magnetic loss layer may be formed in any one selected from mat, lattice, stripe, and speck fashions. The magnetic loss layer may be formed in a mesh fashion.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).

Abstract: In an electronic component (11) comprising an electronic circuit or a circuit element in a metallic case including a case (13) and a cover (39), a magnetic thin film (51) made of a magnetic loss material is provided on at least one part of an inner wall surface of the metallic case. In the magnetic loss material, its composition is represented by M-X—Y, wherein M denotes at least one of Fe, Co and Ni, X denotes at least one of elements other than M and Y, and Y denotes at least one of F, N and O. The maximum value &mgr;″max of an imaginary part &mgr;″, which is an imaginary number component of a complex permeability of the magnetic loss material, exists within a frequency range from 100 MHz to 10 GHz.

Abstract: In a connector having at least one contact (3a,3b) held by an insulator (2a), a high-frequency current suppressor (4a,4b) is provided on the contact or the insulator. The high-frequency current suppressor serves to attenuate a high-frequency current flowing through the contact and having a frequency within a frequency band between several tens MHz and several GHz.

Abstract: For improving a noise characteristic of a printed circuit board excellent in noise characteristic, a magnetic prepreg formed by impregnating a magnetic paint composed of soft magnetic powder and thermosetting resin into a glass cloth is used as a prepreg constituting the printed circuit board. It is preferable that the soft magnetic powder is metal powder being essentially flat. Further, it is preferable that a main component of the thermosetting resin is epoxy resin.

Abstract: In a heat-shrinkable tube (1) having a tubular member which is shrinkable in response to heat and has a cylindrical surface, a thin film is formed on at least a part of the cylindrical surface. The thin film is made of a magnetic loss material which has a high magnetic loss characteristic. The thin film has a first phase comprising a first one of Fe, Co, and Ni and has a second phase comprising an insulator containing at least one element other than Fe, Co, and Ni.

Abstract: In an electronic component (11) comprising an electronic circuit or a circuit element in a metallic case comprising a case (13) and a cover (39), a magnetic thin film (51) made of a magnetic loss material is provided on at least one part of an inner wall surface of the metallic case. In the magnetic loss material, its composition is represented by M—X—Y, wherein M denotes at least one of Fe, Co and Ni, X denotes at least one of elements other than M and Y, and Y denotes at least one of F, N and O. The maximum value &mgr;″max of an imaginary part &mgr;″, which is an imaginary number component of a complex permeability of the magnetic loss material, exists within a frequency range from 100 MHz to 10 GHz.

Abstract: In a display device (70, 70A, 80-80G, 90-90F) having a display window (73, 81, 93), a magnetic loss layer or layer (75, 75A, 88-88C, 97-97C) is formed on at least a part of a principal surface of the display window. The magnetic loss layer may be a granular magnetic thin layer which is, for example, made of a magnetic substance of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The magnetic loss layer may be formed in any one selected from mat, lattice, stripe, and speck fashions. The magnetic loss layer may be formed in a mesh fashion.

Abstract: An EMI countermeasure component is provided relative to an active element, which does not deteriorate a circuit function of the active element, but has a sufficient shielding effect against permeation of electromagnetic waves radiated to the exterior, and further suppresses a malfunction or the like due to mutual interferences between peripheral components or an electromagnetic induction to a signal line. The EMI countermeasure component is made of a composite magnetic body including soft magnetic powder having oxide films on the surfaces thereof and an organic binding agent, and extinguishes undesired high frequency electromagnetic radiation as heat due to its complex permeability.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).

Abstract: A thin electromagnetic interference suppressing body effective for electromagnetic interference suppression at a microwave band. As a material of the electromagnetic interference suppressing body, there is provided a composite magnetic body formed by bonding powder made of a semi-hard magnetic material by an organic bonding agent and having a high magnetic loss at the microwave band. As the semi-hard magnetic material, a metallic magnetic body, such as Fe--Co--Mo alloy, Co--Fe--Nb alloy or Fe--Co--V alloy, or an oxide magnetic body, such as .gamma.-Fe.sub.2 O.sub.3 or Co--Ti substituted Ba ferrite, can be used. Further, as an example of the organic bonding agent, polyurethane resin can be cited.

Abstract: In an optical fiber cable, for effectively suppressing undesired radiant noise propagating in a reinforcing wire or generated from the reinforcing wire without providing an electromagnetic shielding member apart from the optical fiber cable, a buffer layer and an outer jacket of an LAP sheath covering the reinforcing wire being a tension member forming the optical fiber cable are constituted by composite magnetic bodies, respectively, composed of soft magnetic powder and organic binding agents. It is preferable that the soft magnetic powder is powder being essentially flat.