Abstract: One embodiment provides a method, including: receiving, at a notch taskbar integrally coupled to an information handling device, an indication to perform an action, wherein the notch task bar is positioned adjacent to a notch of the information handling device; and performing, using a processor, the action Other aspects are described and claimed.

Abstract: An electronic device includes: a first processing circuit configured to detect voice from ambient sounds in first processing, and when detecting voice after a state of detecting no voice continues for a first period of time or longer, shift procedure to second processing; a second processing circuit configured to determine whether the voice detected from the ambient sound includes a specific word or not in the second processing, while being configured, when the specific word appears within a second period of time after the shifting to the second processing, to shift the procedure to third processing, and, when the specific word does not appear within the second period of time, not to shift the procedure to the third processing; and a third processing circuit configured to activate the specific function in the third processing.

Abstract: Devices, systems and methods for enabling voice access to a portable electronic device in a closed physical configuration with biometric authentication are disclosed. A device can have multiple physical configurations, including a closed configuration in which a display and/or user interface is not accessible. A biometric sensor disposed on an outer surface of the device in at least the closed configuration can be used to enable access to the device or secure functions of the device, via a voice engine or the like, even though the device is physically closed. In some embodiments, unsecure functions can be accessed via voice engine without use of the biometric sensor when the device is closed.

Abstract: An information processing apparatus, a control method, and a program can more accurately distinguish a vibration added to a chassis from the detected vibration. The information processing apparatus includes a first chassis in which at least one first vibration detecting unit is provided; a second chassis in which at least one second vibration detecting unit is provided, a face of the second chassis overlapping with a face of the first chassis; and a controller. The controller determines a contact state of the first chassis based on relative characteristics of a first vibration that is a vibration detected by the first vibration detecting unit with respect to a second vibration that is a vibration detected by the second vibration detecting unit.

Abstract: A flexible touch sensor comprises: a first sheet material that has a first major surface, and that has a cushioning property; a second sheet material that includes a conductive material, and that is disposed on the first major surface of the first sheet material; and a conductive wire that is disposed on the first major surface of the first sheet material, and that is sunk into the first sheet material.

Abstract: A voice assistant system includes a server apparatus performing voice assistant and a plurality of devices, in which the server apparatus and the devices are communicatively connected to each other. The plurality of devices each records the same user's speech through a microphone, and then transmits recorded data of the same user's speech to the server apparatus. The server apparatus receives the recorded data transmitted from each of the plurality of devices, and then voice-recognizes two or more of the received recorded data in accordance with a predetermined standard to thereby interpret the contents of the user's speech to perform the voice assistant.

Abstract: Methods and apparatus are provided that can provide automatic feature discovery for modular active digitizer pens. A system is provided comprising a digitizer display; and a processor configured to: receive a human interface device (HID) transaction when a digitizer pen is in proximity to the digitizer display, wherein the digitizer pen comprises a pen body attached to a removable function module that supports a modular feature; extract a module identifier (ID) from the HID transaction, wherein the module ID is associated with the removable function module; and display, on the digitizer display, an informational message that concerns the modular feature, wherein the informational message is associated with the module ID. One or more applications compatible with the modular feature may be displayed, and one or more configuration tasks may be automatically executed to enable the modular feature on the system.

Abstract: A personal computer providing power over Wi-Fi is provided, the personal computer comprising: a plurality of Wi-Fi antennas; and a processor configured to: determine a data activity level for the plurality of Wi-Fi antennas; in response to the determining of the data activity level, assign each of the plurality of Wi-Fi antennas to one of data transmission and power transmission, wherein the assigning is based on the data activity level; and send power packets using each of the plurality of Wi-Fi antennas that is assigned to power transmission.

Abstract: An electronic component package includes: a sealing resin layer; a metal member buried therein and including a die bond portion and a terminal electrode portion located outside the die bond portion; a ceramic substrate buried in the sealing resin layer; and an electronic component disposed on the die bond portion. When viewed in plan, the die bond portion and the ceramic substrate are partially overlapped to be in contact with each other, and the terminal electrode portion and the ceramic substrate are partially overlapped to be in contact with each other. The electronic component is electrically connected to the terminal electrode portion. The metal member includes a first plating layer and a second plating layer, and the average crystal grain diameter of the first plating layer is smaller than the average crystal grain diameter of the second plating layer.

Abstract: A stretchable flexible substrate according to one aspect of the present disclosure includes: an electronic component; a first insulating layer located around the electronic component and having first and second main surfaces facing each other; a first metal layer that is in contact with the first main surface; a second metal layer that is in contact with the second main surface and electrically connected to the electronic component; and a second insulating layer that seals the electronic component, first insulating layer, and second metal layer, in plan view, a curved wiring portion extending from a central portion made up of at least the electronic component, portions of the first insulating layer and first and second metal layers, the curved wiring portion being made up of at least other portions of the first insulating layer, first and second metal layers, and the curved wiring portion being curved at least partially.

Abstract: A flexible substrate is provided with: a stretchable sheet; a member located on the sheet; and a stretchable strip connected to the member, and located on the sheet. When the amount of extension of the sheet is equal to or less than a predetermined value, the sheet has a first elastic modulus, and when the amount of extension of the sheet exceeds the predetermined value, the sheet has a second elastic modulus that is greater than the first elastic modulus and greater than the elastic modulus of the strip.

Abstract: An electronic component package includes: a sealing resin layer; a metal member buried therein and including a die bond portion and a terminal electrode portion located outside the die bond portion; a ceramic substrate buried in the sealing resin layer; and an electronic component disposed on the die bond portion. When viewed in plan, the die bond portion and the ceramic substrate are partially overlapped to be in contact with each other, and the terminal electrode portion and the ceramic substrate are partially overlapped to be in contact with each other. The electronic component is electrically connected to the terminal electrode portion. The metal member includes a first plating layer and a second plating layer, and the average crystal grain diameter of the first plating layer is smaller than the average crystal grain diameter of the second plating layer.

Abstract: A method for manufacturing an electronic component package. The method includes (i) providing a package precursor in which an electronic component is embedded such that an electrode of the electronic component is exposed at a surface of a sealing resin layer; (ii) forming a first metal plating layer such that the first metal plating layer is in contact with the exposed surface of the electrode of the electronic component; (iii) disposing a metal foil in face-to-face spaced relationship with respect to the first metal plating layer; and (iv) forming a second metal plating layer. In step (iv), the second metal plating layer is formed so as to fill a clearance between the first metal plating layer and the metal foil, thereby integrating the metal foil, the first metal plating layer and the second metal plating layer with each other.

Abstract: An electronic component package according to one aspect of the present disclosure includes a metal pattern layer having a first principal surface and a second principal surface, an electronic component disposed on the first principal surface and electrically connected to the metal pattern layer, at least one metal member disposed on the first principal surface and electrically connected to the metal pattern layer, a sealing resin layer disposed on the first principal surface, the electronic component and the at least one metal member, and an insulating layer disposed on the second principal surface. The at least one metal member is thicker than the electronic component. In plan view, the at least one metal member is disposed on an area of the first principal surface, the area including an end of the first principal surface. The at least a part of the metal pattern layer is exposed from the insulating layer.

Abstract: A flexible touch sensor comprises: a first sheet material that has a first major surface, and that has a cushioning property; a second sheet material that includes a conductive material, and that is disposed on the first major surface of the first sheet material; and a conductive wire that is disposed on the first major surface of the first sheet material, and that is sunk into the first sheet material.

Abstract: A flexible substrate is provided with: a stretchable sheet; a member located on the sheet; and a stretchable strip connected to the member, and located on the sheet. When the amount of extension of the sheet is equal to or less than a predetermined value, the sheet has a first elastic modulus, and when the amount of extension of the sheet exceeds the predetermined value, the sheet has a second elastic modulus that is greater than the first elastic modulus and greater than the elastic modulus of the strip.

Abstract: To reduce an indication error at a peripheral part of an electromagnetic induction type coordinate detection device, sensor coils having a coil width of 21 pitches are arranged at a central part at intervals of 4 pitches. At a peripheral part, the coil width is shortened from sensor coil #5 to coil #1 sequentially so that the coil width of a sensor coil is shorter than a coil width of an inwardly adjacent sensor coil by 2 pitches. This enables the coil side pitch that is 1 all over the coil group 222, and an area enabling three-point supplementing can be enlarged from the conventional one. The sensor coils at the peripheral part have a coil pitch of 3, and so an indication error there can be reduced compared with the conventional case of coil pitch of 4 for two-point supplementing as well. Dummy wires required at the peripheral part conventionally can be eliminated.

Abstract: There is provided a light-emitting device comprising a light-emitting element. The light-emitting device of the present invention comprises an electrode part for the light-emitting element; a reflective layer provided on the electrode part; and the light-emitting element provided on the reflective layer such that the light-emitting element is in contact with at least a part of the reflective layer, wherein the light-emitting element and the electrode part are in an electrical connection with each other by mutual surface contact via the at least a part of the reflective layer, wherein the electrode part serves as a supporting layer for supporting the light-emitting element, and wherein the electrode part extends toward the outside of the light-emitting element and beyond the light-emitting element.

Abstract: A method for manufacturing an electronic component package comprises: (i) preparing a metal foil having opposed principal surface “A” for placement of an electronic component and principal surface “B”, and a through-hole located in an electronic component-placement region of surface “A”; (ii) placing the electronic component on the metal foil such that the electronic component is positioned in the electronic component-placement region, and an opening of the through-hole is capped with an electrode of the electronic component; (iii) forming a sealing resin layer on surface “A” such that the electronic component is covered with the sealing resin layer; and (iv) forming a metal plating layer on surface “B”. A dry plating process and a wet plating process are performed to form the metal plating layer in step (iv) such that the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated.

Abstract: A method detecting a battery capacity of a secondary battery, in which charging mode includes first mode including only ON state, and second mode including ON state and OFF state, the method includes: charging mode selection process of selecting the charging mode; internal resistance calculation process calculating internal resistance of secondary battery when ON state and OFF state are switched; remaining capacity calculation process calculating remaining capacity of secondary battery; remaining capacity variation amount calculation process calculating variation amount of remaining capacity from most recent full charge capacity calculation time; charged electricity amount calculation process of calculating amount of charged electricity in accordance with integrated value of current that flowed from point of time at which most recent full charge capacity is calculated; and full charge capacity detection process of detecting full charge capacity of secondary battery based on variation amount of remaining capac