Patents by Inventor Koji Kondo
Koji Kondo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250091995Abstract: The present invention provides a crystal of 6-(3-chloro-2-fluorobenzyl)-1-[(S)-1-hydroxymethyl-2-methylpropyl]-7-methoxy-4-oxo-1,4-dihydroquinoline-3-carboxylic acid, which shows a particular powder X-ray diffraction pattern of a characteristic diffraction peaks at diffraction angles 2?(°) as measured by powder X-ray diffractometry. The crystal of the present invention is superior in physical and chemical stability.Type: ApplicationFiled: April 12, 2024Publication date: March 20, 2025Applicant: Japan Tobacco Inc.Inventors: Motohide SATOH, Takahisa MOTOMURA, Takashi MATSUDA, Kentaro KONDO, Koji ANDO, Koji MATSUDA, Shuji MIYAKE, Hideto UEHARA
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Publication number: 20240349430Abstract: A wiring substrate includes insulating layers including a first insulating layer and a second insulating layer, conductive layers including a first conductive layer including a pad and a second conductive layer, a coating film covering the first conductive layer including the pad and improving adhesion between the first conductive layer and the second insulating layer, and a via conductor formed in a through hole penetrating through the second insulating layer and the coating film on the pad and connecting the pad and the second conductive layer. The pad has a surface formed such that a root mean square roughness of the surface is in a range of 0.10 ?m to 0.23 ?m, and a peeling part is formed between the pad and the second insulating layer such that the peeling part is formed within 15 ?m around an outer edge of the through hole on the surface of the pad.Type: ApplicationFiled: April 10, 2024Publication date: October 17, 2024Applicant: IBIDEN CO., LTD.Inventors: Kentaro WADA, Koji KONDO, Kenji KUNIEDA, Masashi UMETSU, Yuta OKAGA
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Patent number: 12104099Abstract: A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.Type: GrantFiled: July 7, 2021Date of Patent: October 1, 2024Assignee: DENSO CORPORATIONInventors: Masami Saito, Koji Kondo, Hirotaka Miyano
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Publication number: 20240040692Abstract: A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer. The conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 ?m or less.Type: ApplicationFiled: July 25, 2023Publication date: February 1, 2024Applicant: IBIDEN CO., LTD.Inventors: Kentaro WADA, Koji KONDO, Kenji KUNIEDA, Masashi UMETSU, Yuta OKAGA
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Publication number: 20230292448Abstract: A printed wiring board includes an insulating layer, a first conductor layer formed on the insulating layer, an adhesive layer formed on the first conductor layer, a resin insulating layer formed on the insulating layer such that the adhesive layer is formed between the first conductor layer and the resin insulating layer, and a second conductor layer formed on the resin insulating layer. The first conductor layer is formed such that the first conductor layer has a smooth upper surface and a smooth side surface and that the adhesive layer has a smooth film formed on the smooth upper and side surfaces, and a protruding part protruding from the smooth film.Type: ApplicationFiled: March 10, 2023Publication date: September 14, 2023Applicant: IBIDEN CO., LTD.Inventors: Kentaro WADA, Koji KONDO
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Patent number: 11642997Abstract: A cup holder that can prevent malfunction and generation of abnormal noise due to adhesion of liquid or other foreign matter is provided. The cup holder (1) includes a holder main body (2) for accommodating a container therein, and arms (3) each including an upper arm piece (10), a lower arm piece (11), and a hinge joint (12) connecting a lower end of the upper arm piece (10) to an upper end of the lower arm piece (11). The arm is an integrally molded product made of a resin material, and the hinge joint (12) is a thin-walled hinge formed by a thin-walled portion thereof.Type: GrantFiled: August 19, 2020Date of Patent: May 9, 2023Assignee: NIFCO INC.Inventor: Koji Kondo
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Publication number: 20220402418Abstract: A cup holder that can prevent malfunction and generation of abnormal noise due to adhesion of liquid or other foreign matter is provided. The cup holder (1) includes a holder main body (2) for accommodating a container therein, and arms (3) each including an upper arm piece (10), a lower arm piece (11), and a hinge joint (12) connecting a lower end of the upper arm piece (10) to an upper end of the lower arm piece (11). The arm is an integrally molded product made of a resin material, and the hinge joint (12) is a thin-walled hinge formed by a thin-walled portion thereof.Type: ApplicationFiled: August 19, 2020Publication date: December 22, 2022Inventor: Koji KONDO
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Publication number: 20210332267Abstract: A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.Type: ApplicationFiled: July 7, 2021Publication date: October 28, 2021Inventors: Masami SAITO, Koji KONDO, Hirotaka MIYANO
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Publication number: 20210138763Abstract: A bonded structure has a first bonded member with a first bonding surface, a second bonded member with a second bonding surface, and a bonding resin layer containing a polymer, disposed between the first bonding surface and the second bonding surface. The polymer in the bonding resin layer has polymer main chains oriented in an intersecting direction that intersects with the first bonding surface and the second bonding surface. The intersecting direction preferably extends along the thickness direction of the bonding resin layer. A heat exchanger has the bonded structure, and the first bonded member serves as a tubular member, and the second bonded member serves as a heat dissipation fin.Type: ApplicationFiled: January 15, 2021Publication date: May 13, 2021Inventors: Masami SAITO, Koji KONDO, Masashi TOTOKAWA, Hirotaka MIYANO, Yoshitake SUGANUMA, Kenichi YAGI, Yuichi KATO, Kunio MORI, Katsuhito MORI, Taiga HANDA
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Publication number: 20210095498Abstract: A lock apparatus includes a lid configured to turn to open and close an opening of a box; a rod switchable between a locked position where a tip of the rod projects to outside of the lid and an unlocked position where the tip is retracted to inside of the lid; and a guide member attached to the inside of the lid and configured to slidably support the rod. The lid includes one of an engaging portion and an engaged portion, and the guide member includes another of the engaging portion and the engaged portion. The engaging portion and the engaged portion are configured to move the guide member in a direction intersecting a lid opening and closing direction to thereby fix and press-fit to each other without rattle.Type: ApplicationFiled: September 2, 2020Publication date: April 1, 2021Inventor: Koji KONDO
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Patent number: 10715016Abstract: A winding device includes a winding core configured to take up a wire, wherein the winding core includes an inner winding core configured to be rotated by a rotating part and an outer winding core configured to surround the inner winding core and rotate together with the inner winding core.Type: GrantFiled: September 11, 2017Date of Patent: July 14, 2020Assignee: NITTOKU CO., LTD.Inventors: Ryuto Tominaga, Koji Kondo
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Patent number: 10690480Abstract: A signal waveform of an estimation signal and a signal waveform of the reflected light intensity signal are coordinated with each other such that a time point when a film thickness is equal to zero in the signal waveform of the estimation signal and a base point in the signal waveform of the reflected light intensity signal coincide with each other. A film thickness corresponding to that estimated value of a signal intensity of a reflected light which corresponds to a film thickness range corresponding to a time range in the signal waveform of the estimation signal and coincides with the signal intensity of the reflected light at a desired time point is set as a film thickness of a thin film at the desired time point.Type: GrantFiled: July 10, 2018Date of Patent: June 23, 2020Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Koji Kondo, Naoto Okada, Hirokatsu Aramaki, Katsuya Iwamoto
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Patent number: 10293732Abstract: A container holder (10, 90) includes a main body (20) formed with a recess (21) having an open top defined therein for receiving a container, a swing member (40) rotatably supported by the main body so as to be swung into and out of the recess, a roller (50) supported by the swing member so as to be rotated around a prescribed rotational center line (B) by a container engaging the roller as the container is pushed into and pulled out of the recess, and a biasing member (60) urging the swing member into projecting into the recess, wherein the swing member is provided with an inclined surface (47) extending from a part thereof located outward of an outer periphery (53) of the roller, above the roller and outward of the recess to a part thereof located directly above or inward of the rotational center line of the roller.Type: GrantFiled: May 6, 2016Date of Patent: May 21, 2019Assignee: Honda Motor Co., Ltd.Inventors: Kei Inoue, Kozo Kobayashi, Koji Kondo
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Publication number: 20190115813Abstract: A winding device includes a winding core configured to take up a wire, wherein the winding core includes an inner winding core configured to be rotated by a rotating part and an outer winding core configured to surround the inner winding core and rotate together with the inner winding core.Type: ApplicationFiled: September 11, 2017Publication date: April 18, 2019Applicant: NITTOKU ENGINEERING CO., LTD.Inventors: Ryuto TOMINAGA, Koji KONDO
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Patent number: 10262794Abstract: A method includes bending back a wire fed to a first end side of a magnetic pole in a winding position by guiding the wire from a first end side to a second end side of a multi-pole armature, so that a first extending portion, a second extending portion, and an arc portion are formed. The first extending portion and the second extending portion are continuous via the arc portion. The first extending portion and the second extending portion are parallel to each other. The first extending portion and second extending portion are simultaneously inserted into slots on both sides of one or more of the magnetic poles in the winding position by moving the wire in a radial direction of the multi-pole armature. The slots are parallel to each other. The bending back the wire step and the simultaneous insertion step are performed repeatedly.Type: GrantFiled: October 4, 2017Date of Patent: April 16, 2019Assignee: NITTOKU ENGINEERING CO., LTD.Inventor: Koji Kondo
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Publication number: 20190017807Abstract: A signal waveform of an estimation signal and a signal waveform of the reflected light intensity signal are coordinated with each other such that a time point when a film thickness is equal to zero in the signal waveform of the estimation signal and a base point in the signal waveform of the reflected light intensity signal coincide with each other. A film thickness corresponding to that estimated value of a signal intensity of a reflected light which corresponds to a film thickness range corresponding to a time range in the signal waveform of the estimation signal and coincides with the signal intensity of the reflected light at a desired time point is set as a film thickness of a thin film at the desired time point.Type: ApplicationFiled: July 10, 2018Publication date: January 17, 2019Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Koji KONDO, Naoto OKADA, Hirokatsu ARAMAKI, Katsuya IWAMOTO
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Patent number: 10164506Abstract: A winding device including radially disposed nozzles of a same number as the number of teeth, a plurality of the nozzles simultaneously drawing out a wire to corresponding slots between respective teeth to simultaneously wind the wire between predetermined two slots that correspond to a respective one of the nozzles, includes a wire drawing and cutting mechanism configured to draw out the wire from a single spool and cut the drawn-out wire at a predetermined length, a wire storing mechanism configured to dispose the wire of the predetermined length obtained by the wire drawing and cutting mechanism in a radial manner and store the wire to a same number as that of the plurality of nozzles, and a wire conveyance mechanism configured to convey the radially disposed plurality of wires from the wire storing mechanism, to the plurality of nozzles.Type: GrantFiled: June 20, 2014Date of Patent: December 25, 2018Assignees: NITTOKU ENGINEERING CO., LTD., MITSUBA CORPORATIONInventors: Koji Kondo, Ryo Kato, Tetsuya Nara, Kenichi Aramaki
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Patent number: D1060422Type: GrantFiled: June 9, 2023Date of Patent: February 4, 2025Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Hibiki Ikegami, Koji Kawai, Hiroki Kondo
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Patent number: D1063983Type: GrantFiled: June 9, 2023Date of Patent: February 25, 2025Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Hibiki Ikegami, Koji Kawai, Hiroki Kondo
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Patent number: D1067940Type: GrantFiled: March 30, 2023Date of Patent: March 25, 2025Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Hibiki Ikegami, Koji Kawai, Hiroki Kondo