Abstract: In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.

Abstract: A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.

Abstract: A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Abstract: A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic substrate. The single-sided conductor pattern films are laminated on the ceramic substrate. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board. During the heat and press treatment, respective single-sided conductor pattern films and the ceramic substrate bond together while the interlayer connection is obtained between the conductor patterns as well as between the conductor pattern and the printed conductor pattern.

Abstract: Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

Abstract: A rectifier of an automotive alternator includes a heat sink that has fitting holes, in each of which one rectifying element is fitted, and a major surface on which the fitting holes open. The heat sink also has substantially annular ribs, each of which is formed on the major surface around a corresponding one of the fitting holes. Each of the ribs has a first portion, which lies in an area on the major surface where a minimum distance between an inner edge of the heat sink defining the corresponding fitting hole and an outer edge of the heat sink defining an outline of the heat sink is smaller, and a second portion that lies in an area on the major surface where a minimum distance between the inner and outer edges is larger. The first portion has a greater protruding height from the major surface than the second portion.

Abstract: A sound generation device is composed of a main unit and a game cartridge storing a sound generation program. The game cartridge includes an XY-axes acceleration sensor for detecting a tilt in two respective directions of a game device housing. When a button of the main unit is pressed, a CPU of in the main unit reads waveform data corresponding to one syllable in lyrics from human voice sound waveform data stored in a program ROM, changes a frequency and an amplitude of the waveform data in accordance with the obtained amounts of tilts in two directions, and outputs the processed waveform data from a loudspeaker as a sound. Thus, it is possible to provide a sound generation device capable of outputting a sound by changing its pitch and volume.

Abstract: A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers is formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

Abstract: A wireless LAN system if formed by a base station, mobile stations and a controller. The controller receives a frame over wireless media, and a frame analyzer analyzes the received frame. A determination section determines whether or not the frame received at a predicted time based on the rule of frame for a service on a layer higher than a media access control layer is an intended frame based on results from the frame analyzer. A frame transmitter sends out a frame containing a field specifying the duration of the frame to be transmitted to a destination station that should be given the first priority to transmit on a wireless uplink and downlink, based on the determination that the frame received is not in conformity with the rule of frame.

Abstract: In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.

Abstract: In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.

Abstract: A game apparatus functioning as a stereo enhancement apparatus includes a CPU, and the CPU generates sound signals of stereo sounds required for the game. The CPU adjusts volumes of stereo sounds simultaneously played from respective sound sources on the basis of pan of the respective sound sources, and mixes the plurality of stereo sounds whose volumes have been adjusted to generate a stereo sound of two channels. Next, the stereo sound including an L channel sound signal (Lin) and an R channel sound signal (Rin) that have been mixed is divided into two systems, and then, a stereo enhancement signal (Lin?Rin) is generated. Then, the stereo enhancement signal is delayed, an added signal obtained by adding the delayed stereo enhancement signal to the Lin is generated, and a subtracted signal obtained by subtracting the delayed stereo enhancement signal from the Rin is generated. Then, the added signal is output from a speaker for L channel, and the subtracted signal is output from a speaker for R channel.

Abstract: A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.

Abstract: A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.

Abstract: An index picture as a still picture obtained by summarizing the contents of a moving picture, which is generated by using a video browser technique can be formed in various modes. A plurality of kinds of generating modes for generating an index picture by summarizing the contents of a moving picture are prepared, any of the modes is selected, and a generating process is performed in the selected mode. It enables an index picture to be generated in a proper form according to the property, use, and the like of a moving picture material.

Abstract: A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

Abstract: An absorbent article which can be thin without decreasing absorption capability and strength. An absorbent body having a pulp fiber and a super absorbent polymer, in which a content of the super absorbent polymer is not less than 55% by weight, is provided. The absorbent body may be covered with a top sheet which is liquid permeable and uses a non-woven fabric.

Abstract: A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.

Abstract: A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.

Abstract: A slip ring apparatus includes a pair of slip rings electrically insulated from each other and disposed coaxially, a pair of electric conductive elements for providing electric connection between the pair of slip rings and a field coil of an automotive alternator, and an insulating member for holding the pair of slip rings and the pair of electric conductive elements. The electric conductive elements have at least one deformation absorbing portion for absorbing a deformation of the electric conductive elements.