Abstract: The present invention provides systems and methods for assembling an electronic assembly using an anisotropic conducting membrane (ACM) as a component interconnect and a substrate embossed with placement cavities or a positional fixture to facilitate component placement on the substrate in the electronic assembly. The fixture may comprise multiple layers of interconnects to improve routing density for the electronic assembly enclosed in a housing. An alignment chain may be used to monitor positional and contact integrity of the ACM interfaced components in a complex assembly. The systems and methods allow components to be detached for reuse. Interconnection elements or conduction pathways at the components can be used to interconnect a plurality of neighboring substrates over the ACM layers into a stacked electronic assembly.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

Abstract: A manufacturing method for manufacturing an electronic device is disclosed. Conductive elastomers comprising of various configurations and resistivity are coupled to contact pads of an electronic device. The conductive elastomers are also coupled to substrate contacts on a substrate, allowing the conductive elastomers to function as electrical connection from device to substrate as well as to embed one or more passive components at the contact pads of the electronic device.

Abstract: The present invention relates to a detection method to differentiate between egg-derived ingredients and chicken-derived ingredients (chicken parts/tissues, excluding eggs) in foods or other products and primer pairs and probes used for specifically detecting chicken in foods or products.

Abstract: The present invention relates to a detection method to differentiate between egg-derived ingredients and chicken-derived ingredients (chicken parts/tissues, excluding eggs) in foods or other products and primer pairs and probes used for specifically detecting chicken in foods or products.

Abstract: A dual-in-line adaptor for mounting an electronic assembly that requires validation includes a pair of substantially parallel pin strips mounted to a first side of a dual-in-line adaptor circuit board and a first land pattern on at least one of the first side and a second side of the dual-in-line adaptor circuit board. The second side opposing the first side and the first land pattern corresponding to a second land pattern on the electronic assembly that requires validation. A method for testing an electronic assembly that requires validation using a dual-in-line adaptor is also described.

Abstract: A new cytotoxic T lymphocyte (CTL) assay has been discovered using two cell lines that stably express either green fluorescent protein (GFP) or red fluorescent protein (DsRed), which are distinguishable by FACS, fluorescence microplate reader, or fluorescence microscopy. Using one cell line as a target (T) to present antigen and the other, at the same number, as an internal control (reference, R), a new CTL assay (named fluorolysometric (FL)-CTL assay) way developed based on cytolysis of these fluorescent protein-expressing targets detectable by FACS. This FL-CTL assay was further extended for use with a fluorescent microplate reader. This FL-CTL assay was reproducibly used to determine primary CTL activity at high sensitivity when compared to other conventional assays with in vivo activated T cells against different antigens. This new reliable, sensitive, convenient, and economical CTL assay has broad application potentials for experimental and clinical use in different antigen and effector-target systems.

Abstract: The present invention provides systems and methods for assembling an electronic assembly using an anisotropic conducting membrane (ACM) as a component interconnect and a substrate embossed with placement cavities or a positional fixture to facilitate component placement on the substrate in the electronic assembly. The fixture may comprise multiple layers of interconnects to improve routing density for the electronic assembly enclosed in a housing. An alignment chain may be used to monitor positional and contact integrity of the ACM interfaced components in a complex assembly. The systems and methods allow components to be detached for reuse. Interconnection elements or conduction pathways at the components can be used to interconnect a plurality of neighboring substrates over the ACM layers into a stacked electronic assembly.

Abstract: The present invention relates to a reference plasmid for use in specifically detecting the meat of pig, cattle, sheep, deer, horse and kangaroo. The reference plasmid can be used in rapidly identifying the species of meat and can be used in testing commercial meat products.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: A memory module contains a plurality of memory devices and receives control signals over a memory bus for accessing the memory devices. An adaptive buffering mechanism includes unregistered logic to electrically isolate the received control signals from one or more control drive signals. Register logic substantially synchronizes the control drive signals to a system clock to produce clocked control drive signals. A mode selection mechanism selectively outputs either the control drive signals or the clocked control drive signals to access the memory devices in accordance with a mode selection signal.

Abstract: A method for manufacturing ink-absorbing recording medium is provided. A glossy ink-absorbing recording medium can be made by the following steps: coating process P1, cationic aluminum oxide or a dispersing solution or a colloid solution which mainly includes a cationic aluminum oxide solution is applied on the base material to form a membrane layer; drying process P2, the membrane layer is dried or semi-dried; polyvinyl alcohol applying process P3, cationic polyvinyl alcohol is applied on the dried or semi-dried membrane layer; casting process P4, the membrane layer which is applied with cationic polyvinyl alcohol is cast.

Abstract: A memory module contains a plurality of memory devices and receives control signals over a memory bus for accessing the memory devices. An adaptive buffering mechanism includes unregistered logic to electrically isolate the received control signals from one or more control drive signals. Register logic substantially synchronizes the control drive signals to a system clock to produce clocked control drive signals. A mode selection mechanism selectively outputs either the control drive signals or the clocked control drive signals to access the memory devices in accordance with a mode selection signal.

Abstract: A phase-locked loop circuit having a programmable tuning voltage. As the input reference clock frequency is changed, the tuning voltage is changed accordingly to compensate for the propagation delay through the phase detector and thereby reduce discrepancies in the phase relationship between the input reference clock signal and the output clock signal at different frequencies. A set of compensation values corresponding to input reference clock frequencies are stored in a memory device. When the input reference clock frequency is changed, a corresponding compensation value is programmed to a digital-to-analog converter (DAC). The DAC outputs a voltage that is proportional to the value of the digital input to the DAC and can thus be used to regulate the tuning voltage of the PLL circuit so that the relationship of the input reference clock signal to the output clock signal remains stable with frequency changes.