Patents by Inventor Krishnakanth V. Sistla
Krishnakanth V. Sistla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11899615Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.Type: GrantFiled: January 27, 2023Date of Patent: February 13, 2024Assignee: Intel CorporationInventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z Chrysos, John R. Ayers, Dheeraj R. Subbareddy
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Publication number: 20230359263Abstract: Apparatuses, methods and storage medium associated with current control for a multicore processor are disclosed herein. In embodiments, a multicore processor may include a plurality of analog current comparators, each analog current comparator to measure current utilization by a corresponding one of the cores of the multicore processor. The multicore processor may include one or more processors, devices, and/or circuitry to cause the cores to individually throttle based on measurements from the corresponding analog current comparators. In some embodiments, a memory device of the multicore processor may store instructions executable to operate a plurality power management agents to determine whether to send throttle requests based on a plurality of histories of the current measurements of the cores, respectively.Type: ApplicationFiled: July 17, 2023Publication date: November 9, 2023Inventors: Alexander Gendler, Efraim Rotem, Nir Rosenzweig, Krishnakanth V. Sistla, Ashish V. Choubal, Ankush Varma
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Publication number: 20230315143Abstract: A processing device includes a plurality of processing cores, a control register, associated with a first processing core of the plurality of processing cores, to store a first base clock frequency value at which the first processing core is to run, and a power management circuit to receive a base clock frequency request comprising a second base clock frequency value, store the second base clock frequency value in the control register to cause the first processing core to run at the second base clock frequency value, and expose the second base clock frequency value on a hardware interface associated with the power management circuit.Type: ApplicationFiled: June 5, 2023Publication date: October 5, 2023Inventors: Vasudevan Srinivasan, Krishnakanth V. Sistla, Corey D. Gough, Ian M. Steiner, Nikhil Gupta, Vivek Garg, Ankush Varma, Sujal A. Vora, David P. Lerner, Joseph M. Sullivan, Nagasubramanian Gurumoorthy, William J. Bowhill, Venkatesh Ramamurthy, Chris MacNamara, John J. Browne, Ripan Das
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Patent number: 11762449Abstract: Apparatuses, methods and storage medium associated with current control for a multicore processor are disclosed herein. In embodiments, a multicore processor may include a plurality of analog current comparators, each analog current comparator to measure current utilization by a corresponding one of the cores of the multicore processor. The multicore processor may include one or more processors, devices, and/or circuitry to cause the cores to individually throttle based on measurements from the corresponding analog current comparators. In some embodiments, a memory device of the multicore processor may store instructions executable to operate a plurality power management agents to determine whether to send throttle requests based on a plurality of histories of the current measurements of the cores, respectively.Type: GrantFiled: December 28, 2021Date of Patent: September 19, 2023Assignee: Intel CorporationInventors: Alexander Gendler, Efraim Rotem, Nir Rosenzweig, Krishnakanth V. Sistla, Ashish V. Choubal, Ankush Varma
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Publication number: 20230251702Abstract: A method and apparatus to monitor architecture events is disclosed. The architecture events are linked together via a push bus mechanism with each architectural event having a designated time slot. There is at least one branch of the push bus in each core. Each branch of the push bus may monitor one core with all the architectural events. All the data collected from the events by the push bus is then sent to a power control unit.Type: ApplicationFiled: February 3, 2023Publication date: August 10, 2023Applicant: Tahoe Research, Ltd.Inventors: Yen-Cheng LIU, P. Keong OR, Krishnakanth V. SISTLA, Ganapati SRINIVASA
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Patent number: 11703906Abstract: A processing device includes a plurality of processing cores, a control register, associated with a first processing core of the plurality of processing cores, to store a first base clock frequency value at which the first processing core is to run, and a power management circuit to receive a base clock frequency request comprising a second base clock frequency value, store the second base clock frequency value in the control register to cause the first processing core to run at the second base clock frequency value, and expose the second base clock frequency value on a hardware interface associated with the power management circuit.Type: GrantFiled: November 5, 2021Date of Patent: July 18, 2023Assignee: Intel CorporationInventors: Vasudevan Srinivasan, Krishnakanth V. Sistla, Corey D. Gough, Ian M. Steiner, Nikhil Gupta, Vivek Garg, Ankush Varma, Sujal A. Vora, David P. Lerner, Joseph M. Sullivan, Nagasubramanian Gurumoorthy, William J. Bowhill, Venkatesh Ramamurthy, Chris MacNamara, John J. Browne, Ripan Das
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Publication number: 20230169032Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.Type: ApplicationFiled: January 27, 2023Publication date: June 1, 2023Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
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Patent number: 11586579Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.Type: GrantFiled: October 28, 2021Date of Patent: February 21, 2023Assignee: Intel CorporationInventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
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Patent number: 11567896Abstract: In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.Type: GrantFiled: June 30, 2020Date of Patent: January 31, 2023Assignee: Intel CorporationInventors: Ankush Varma, Krishnakanth V. Sistla, Guy G. Sotomayor, Andrew D. Henroid, Robert E. Gough, Tod F. Schiff
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Patent number: 11543868Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.Type: GrantFiled: June 11, 2020Date of Patent: January 3, 2023Assignee: Intel CorporationInventors: Tessil Thomas, Robin A. Steinbrecher, Sandeep Ahuja, Michael Berktold, Timothy Y. Kam, Howard Chin, Phani Kumar Kandula, Krishnakanth V. Sistla
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Patent number: 11372464Abstract: An apparatus is provided which comprises: a controller to allocate, to a component, a resource budget selected from a plurality of quantization levels; and a circuitry to adaptively update the plurality of quantization levels.Type: GrantFiled: September 28, 2017Date of Patent: June 28, 2022Assignee: Intel CorporationInventors: Fuat Keceli, Frederico Ardanaz, Jonathan M. Eastep, Ankush Varma, Krishnakanth V. Sistla
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Publication number: 20220197361Abstract: Apparatuses, methods and storage medium associated with current control for a multicore processor are disclosed herein. In embodiments, a multicore processor may include a plurality of analog current comparators, each analog current comparator to measure current utilization by a corresponding one of the cores of the multicore processor. The multicore processor may include one or more processors, devices, and/or circuitry to cause the cores to individually throttle based on measurements from the corresponding analog current comparators. In some embodiments, a memory device of the multicore processor may store instructions executable to operate a plurality power management agents to determine whether to send throttle requests based on a plurality of histories of the current measurements of the cores, respectively.Type: ApplicationFiled: December 28, 2021Publication date: June 23, 2022Inventors: Alexander Gendler, Efraim Rotem, Nir Rosenzweig, Krishnakanth V. Sistla, Ashish V. Choubal, Ankush Varma
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Publication number: 20220129031Abstract: A processing device includes a plurality of processing cores, a control register, associated with a first processing core of the plurality of processing cores, to store a first base clock frequency value at which the first processing core is to run, and a power management circuit to receive a base clock frequency request comprising a second base clock frequency value, store the second base clock frequency value in the control register to cause the first processing core to run at the second base clock frequency value, and expose the second base clock frequency value on a hardware interface associated with the power management circuit.Type: ApplicationFiled: November 5, 2021Publication date: April 28, 2022Inventors: Vasudevan Srinivasan, Krishnakanth V. Sistla, Corey D. Gough, Ian M. Steiner, Nikhil Gupta, Vivek Garg, Ankush Varma, Sujal A. Vora, David P. Lerner, Joseph M. Sullivan, Nagasubramanian Gurumoorthy, William J. Bowhill, Venkatesh Ramamurthy, Chris MacNamara, John J. Browne, Ripan Das
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Patent number: 11294852Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.Type: GrantFiled: June 30, 2020Date of Patent: April 5, 2022Assignee: Intel CorporationInventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
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Patent number: 11294749Abstract: Examples include techniques to collect crash data for a computing system following a catastrophic error. Examples include a management controller gathering error information from components of a computing system that includes a central processing unit (CPU) coupled with one or more companion dice following the catastrophic error. The management controller to gather the error information via a communication link coupled between the management controller, the CPU and the one or more companion dice.Type: GrantFiled: December 30, 2017Date of Patent: April 5, 2022Assignee: Intel CorporationInventors: Ramamurthy Krithivas, Anand K. Enamandram, Eswaramoorthi Nallusamy, Russell J. Wunderlich, Krishnakanth V. Sistla
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Patent number: 11256657Abstract: In one embodiment, an apparatus includes an interconnect to couple a plurality of processing circuits. The interconnect may include a pipe stage circuit coupled between a first processing circuit and a second processing circuit. This pipe stage circuit may include: a pipe stage component having a first input to receive a signal via the interconnect and a first output to output the signal; and a selection circuit having a first input to receive the signal from the first output of the pipe stage component and a second input to receive the signal via a bypass path, where the selection circuit is dynamically controllable to output the signal received from the first output of the pipe stage component or the signal received via the bypass path. Other embodiments are described and claimed.Type: GrantFiled: March 26, 2019Date of Patent: February 22, 2022Assignee: Intel CorporationInventors: Tejpal Singh, Yedidya Hilewitz, Ankush Varma, Yen-Cheng Liu, Krishnakanth V. Sistla, Jeffrey Chamberlain
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Publication number: 20220050805Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.Type: ApplicationFiled: October 28, 2021Publication date: February 17, 2022Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
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Patent number: 11237615Abstract: Apparatuses, methods and storage medium associated with current control for a multicore processor are disclosed herein. In embodiments, a multicore processor may include a plurality of analog current comparators, each analog current comparator to measure current utilization by a corresponding one of the cores of the multicore processor. The multicore processor may include one or more processors, devices, and/or circuitry to cause the cores to individually throttle based on measurements from the corresponding analog current comparators. In some embodiments, a memory device of the multicore processor may store instructions executable to operate a plurality power management agents to determine whether to send throttle requests based on a plurality of histories of the current measurements of the cores, respectively.Type: GrantFiled: March 31, 2020Date of Patent: February 1, 2022Assignee: Intel CorporationInventors: Alexander Gendler, Efraim Rotem, Nir Rosenzweig, Krishnakanth V. Sistla, Ashish V. Choubal, Ankush Varma
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Patent number: 11221857Abstract: The present invention relates to a platform power management scheme. In some embodiments, a platform provides a relative performance scale using one or more parameters to be requested by an OSPM system.Type: GrantFiled: April 18, 2019Date of Patent: January 11, 2022Assignee: Intel CorporationInventors: Guy M. Therien, Paul S. Diefenbaugh, Anil Aggarwal, Andrew D. Henroid, Jeremy J. Shrall, Efraim Rotem, Krishnakanth V. Sistla, Eliezer Weissmann
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Patent number: 11194373Abstract: Various embodiments comprise prioritizing frequency allocations in thermally- or power-constrained computing devices. Computer elements may be assigned ‘weights’ based on their priorities. The computer elements with higher weights may receive higher frequency allocations to assure they receive priority in processing more quickly. The computer elements with lower weights may receive lower frequency allocations and suffer a slowdown in their processing. Elements with the same weight may be grouped together for the purpose of frequency allocation.Type: GrantFiled: April 20, 2020Date of Patent: December 7, 2021Assignee: Intel CorporationInventors: Asma Al-Rawi, Federico Ardanaz, Jonathan M. Eastep, Nikhil Gupta, Ankush Varma, Krishnakanth V. Sistla, Ian M. Steiner