Patents by Inventor Krishnakanth V. Sistla

Krishnakanth V. Sistla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11169560
    Abstract: A processing device includes a plurality of processing cores, a control register, associated with a first processing core of the plurality of processing cores, to store a first base clock frequency value at which the first processing core is to run, and a power management circuit to receive a base clock frequency request comprising a second base clock frequency value, store the second base clock frequency value in the control register to cause the first processing core to run at the second base clock frequency value, and expose the second base clock frequency value on a hardware interface associated with the power management circuit.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: November 9, 2021
    Assignee: Intel Corporation
    Inventors: Vasudevan Srinivasan, Krishnakanth V. Sistla, Corey D. Gough, Ian M. Steiner, Nikhil Gupta, Vivek Garg, Ankush Varma, Sujal A. Vora, David P. Lerner, Joseph M. Sullivan, Nagasubramanian Gurumoorthy, William J. Bowhill, Venkatesh Ramamurthy, Chris Macnamara, John J. Browne, Ripan Das
  • Patent number: 11144108
    Abstract: A method and apparatus to monitor architecture events is disclosed. The architecture events are linked together via a push bus mechanism with each architectural event having a designated time slot. There is at least one branch of the push bus in each core. Each branch of the push bus may monitor one core with all the architectural events. All the data collected from the events by the push bus is then sent to a power control unit.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: October 12, 2021
    Assignee: INTEL CORPORATION
    Inventors: Yen-Cheng Liu, P. Keong Or, Krishnakanth V. Sistla, Ganapati Srinivasa
  • Publication number: 20210064110
    Abstract: In an embodiment, a processor includes a power control unit, a master processing engine, a set of slave processing engines, and a voltage regulator. The master processing engine is to, in response to a receipt of a change message from the power control unit, control the voltage regulator to adjust a voltage level provided to the master processing engine and the set of slave processing engines. Other embodiments are described and claimed.
    Type: Application
    Filed: August 27, 2018
    Publication date: March 4, 2021
    Inventors: Alexander Gendler, Krishnakanth V. Sistla, Ankush Varma, Ariel Szapiro
  • Publication number: 20210064117
    Abstract: A method and apparatus to monitor architecture events is disclosed. The architecture events are linked together via a push bus mechanism with each architectural event having a designated time slot. There is at least one branch of the push bus in each core. Each branch of the push bus may monitor one core with all the architectural events. All the data collected from the events by the push bus is then sent to a power control unit.
    Type: Application
    Filed: November 13, 2020
    Publication date: March 4, 2021
    Inventors: Yen-Cheng LIU, P. Keong OR, Krishnakanth V. SISTLA, Ganapati SRINIVASA
  • Patent number: 10877530
    Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: December 29, 2020
    Assignee: Intel Corporation
    Inventors: Tessil Thomas, Robin A. Steinbrecher, Sandeep Ahuja, Michael Berktold, Timothy Y. Kam, Howard Chin, Phani Kumar Kandula, Krishnakanth V. Sistla
  • Publication number: 20200333867
    Abstract: Apparatuses, methods and storage medium associated with current control for a multicore processor are disclosed herein. In embodiments, a multicore processor may include a plurality of analog current comparators, each analog current comparator to measure current utilization by a corresponding one of the cores of the multicore processor. The multicore processor may include one or more processors, devices, and/or circuitry to cause the cores to individually throttle based on measurements from the corresponding analog current comparators. In some embodiments, a memory device of the multicore processor may store instructions executable to operate a plurality power management agents to determine whether to send throttle requests based on a plurality of histories of the current measurements of the cores, respectively.
    Type: Application
    Filed: March 31, 2020
    Publication date: October 22, 2020
    Inventors: Alexander Gendler, Efraim Rotem, Nir Rosenzweig, Krishnakanth V. Sistla, Ashish V. Choubal, Ankush Varma
  • Publication number: 20200334196
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Publication number: 20200334193
    Abstract: In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: Ankush Varma, Krishnakanth V. Sistla, Guy G. Sotomayor, Andrew D. Henroid, Robert E. Gough, Tod F. Schiff
  • Publication number: 20200319693
    Abstract: Various embodiments comprise prioritizing frequency allocations in thermally- or power-constrained computing devices. Computer elements may be assigned ‘weights’ based on their priorities. The computer elements with higher weights may receive higher frequency allocations to assure they receive priority in processing more quickly. The computer elements with lower weights may receive lower frequency allocations and suffer a slowdown in their processing. Elements with the same weight may be grouped together for the purpose of frequency allocation.
    Type: Application
    Filed: April 20, 2020
    Publication date: October 8, 2020
    Applicant: Intel Corporation
    Inventors: Asma Al-Rawi, Federico Ardanaz, Jonathan M. Eastep, Nikhil Gupta, Ankush Varma, Krishnakanth V. Sistla, Ian M. Steiner
  • Patent number: 10795853
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20200311018
    Abstract: In one embodiment, an apparatus includes an interconnect to couple a plurality of processing circuits. The interconnect may include a pipe stage circuit coupled between a first processing circuit and a second processing circuit. This pipe stage circuit may include: a pipe stage component having a first input to receive a signal via the interconnect and a first output to output the signal; and a selection circuit having a first input to receive the signal from the first output of the pipe stage component and a second input to receive the signal via a bypass path, where the selection circuit is dynamically controllable to output the signal received from the first output of the pipe stage component or the signal received via the bypass path. Other embodiments are described and claimed.
    Type: Application
    Filed: March 26, 2019
    Publication date: October 1, 2020
    Inventors: Tejpal Singh, Yedidya Hilewitz, Ankush Varma, Yen-Cheng Liu, Krishnakanth V. Sistla, Jeffrey Chamberlain
  • Publication number: 20200301490
    Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.
    Type: Application
    Filed: June 11, 2020
    Publication date: September 24, 2020
    Inventors: Tessil Thomas, Robin A. Steinbrecher, Sandeep Ahuja, Michael Berktold, Timothy Y. Kam, Howard Chin, Phani Kumar Kandula, Krishnakanth V. Sistla
  • Patent number: 10761579
    Abstract: In one embodiment, a system includes: a plurality of compute nodes to couple in a chassis; a first shared power supply to provide a baseline power level to the plurality of compute nodes; and an auxiliary power source to provide power to one or more of the plurality of compute nodes during operation at a higher power level than the baseline power level. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: September 1, 2020
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Vasudevan Srinivasan, Eugene Gorbatov, Andrew D. Henroid, Barnes Cooper, David W. Browning, Guy M. Therien, Neil W. Songer, Krishnakanth V. Sistla, James G. Hermerding, II
  • Publication number: 20200272513
    Abstract: In an embodiment, a processor includes a plurality of processing engines (PEs) to execute threads, and a guide unit. The guide unit is to: monitor execution characteristics of the plurality of PEs and the threads; generate a plurality of PE rankings, each PE ranking including the plurality of PEs in a particular order; and store the plurality of PE rankings in a memory to be provided to a scheduler, the scheduler to schedule the threads on the plurality of PEs using the plurality of PE rankings. Other embodiments are described and claimed.
    Type: Application
    Filed: January 13, 2020
    Publication date: August 27, 2020
    Inventors: Avinash N. Ananthakrishnan, Vijay Dhanraj, Russell J. Fenger, Vivek Garg, Eugene Gorbatov, Stephen H. Gunther, Monica Gupta, Efraim Rotem, Krishnakanth V. Sistla, Guy M. Therien, Ankush Varma, Eliezer Weissmann
  • Patent number: 10706004
    Abstract: In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Krishnakanth V. Sistla, Guy G. Sotomayor, Andrew D. Henroid, Robert E. Gough, Tod F. Schiff
  • Patent number: 10627885
    Abstract: Various embodiments comprise prioritizing frequency allocations in thermally- or power-constrained computing devices. Computer elements may be assigned ‘weights’ based on their priorities. The computer elements with higher weights may receive higher frequency allocations to assure they receive priority in processing more quickly. The computer elements with lower weights may receive lower frequency allocations and suffer a slowdown in their processing. Elements with the same weight may be grouped together for the purpose of frequency allocation.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: April 21, 2020
    Assignee: Intel Corporation
    Inventors: Asma Al-Rawi, Federico Ardanaz, Jonathan M. Eastep, Nikhil Gupta, Ankush Varma, Krishnakanth V. Sistla, Ian M. Steiner
  • Patent number: 10613611
    Abstract: Apparatuses, methods and storage medium associated with current control for a multicore processor are disclosed herein. In embodiments, a multicore processor may include a plurality of analog current comparators, each analog current comparator to measure current utilization by a corresponding one of the cores of the multicore processor. The multicore processor may include one or more processors, devices, and/or circuitry to cause the cores to individually throttle based on measurements from the corresponding analog current comparators. In some embodiments, a memory device of the multicore processor may store instructions executable to operate a plurality power management agents to determine whether to send throttle requests based on a plurality of histories of the current measurements of the cores, respectively.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: April 7, 2020
    Assignee: Intel Corporation
    Inventors: Alexander Gendler, Efraim Rotem, Nir Rosenzweig, Krishnakanth V. Sistla, Ashish V. Choubal, Ankush Varma
  • Patent number: 10545793
    Abstract: In an embodiment, a processor includes a plurality of processing engines (PEs) to execute threads, and a guide unit. The guide unit is to: monitor execution characteristics of the plurality of PEs and the threads; generate a plurality of PE rankings, each PE ranking including the plurality of PEs in a particular order; and store the plurality of PE rankings in a memory to be provided to a scheduler, the scheduler to schedule the threads on the plurality of PEs using the plurality of PE rankings. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: January 28, 2020
    Assignee: Intel Corporation
    Inventors: Avinash N. Ananthakrishnan, Vijay Dhanraj, Russell J. Fenger, Vivek Garg, Eugene Gorbatov, Stephen H. Gunther, Monica Gupta, Efraim Rotem, Krishnakanth V. Sistla, Guy M. Therien, Ankush Varma, Eliezer Weissmann
  • Publication number: 20190384348
    Abstract: A processing device includes a plurality of processing cores, a control register, associated with a first processing core of the plurality of processing cores, to store a first base clock frequency value at which the first processing core is to run, and a power management circuit to receive a base clock frequency request comprising a second base clock frequency value, store the second base clock frequency value in the control register to cause the first processing core to run at the second base clock frequency value, and expose the second base clock frequency value on a hardware interface associated with the power management circuit.
    Type: Application
    Filed: February 24, 2017
    Publication date: December 19, 2019
    Inventors: Vasudevan SRINIVASAN, Krishnakanth V. SISTLA, Corey D. GOUGH, Ian M. STEINER, Nikhil GUPTA, Vivek GARG, Ankush VARMA, Sujal A. VORA, David P. LERNER, Joseph M. SULLIVAN, Nagasubramanian GURUMOORTHY, William J. BOWHILL, Venkatesh RAMAMURTHY, Chris MACNAMARA, John J. BROWNE, Ripan DAS
  • Patent number: 10509455
    Abstract: A method is provided for controlling a link. This may include determining a condition of a first device coupled to the link, receiving, at the first device, a request for a specific link state from a second device coupled to the link, and determining a power state of the link based on the determined condition of the first device.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: December 17, 2019
    Assignee: Intel Corporation
    Inventors: Corey D. Gough, Ian M. Steiner, Krishnakanth V. Sistla