Abstract: A post-fabrication debug and on-line error checking framework for 2D- and 3D-ICs with integrated memories is described. A design-for-debug (DfD) architecture can include, for an IC with on-chip memory, a debug module connected to a functional bus of the IC. The debug module receives trace data for an interval, generates compact signatures based on the received data, and compares these signatures to expected signatures. Intervals containing erroneous trace data can be identified by the debug module and stored in on-chip memory. A single iteration of signal tracing for debug testing between automated test equipment and the IC is possible.

Abstract: A design for test (DfT) architecture is provided that enables pre-bond parametric testing of through-silicon vias (TSVs). A grouping of N number of input/output (I/O) segments are configured to receive a test signal in a feedback loop, where each I/O segment includes one or more buffers (or inverters) and a TSV connected at one end to the one or more buffers. The TSV acts as a shunt-connected capacitor—when defect free—and includes a load resistance when the TSV contains a defect. Each I/O segment can also include one or two multiplexers to control whether the I/O segment receives a test or functional signal and, optionally, whether the I/O segment is bypassed or included in the ring oscillator. The varying loads caused by the defects cause variations in the delay across the buffers (or inverters) of an I/O segment that can be detected in the output signal.

Abstract: Multi-layer integrated circuits having isolation cells for layer testing and related methods are disclosed. According to an aspect, an integrated circuit includes multiple isolation cells. Example isolation cells include, but are not limited to, electronic fuses and tri-state flip-flops. The integrated circuit also includes a first layer having first and second sets of electronic components, the first set of electronic components being operatively connected to the second set of electronic components via the isolation cells. Further, the integrated circuit includes multiple transmission gates associated with the isolation cells. The integrated circuit also includes a second layer having electrical circuitry operatively connected to the electronic components of the first layer. The electrical circuitry is configured to apply test patterns to the electronic components of the first layer.

Abstract: Multi-layer integrated circuits having isolation cells for layer testing and related methods are disclosed. According to an aspect, an integrated circuit includes first and second layers that each have one or more electronic components. One or more electronic components of each layer can be electrically connected by a first via and a second via. The integrated circuit also includes an isolation cell operatively connected between the first via and the second via. The isolation cell is configured to controllably break electrical connection between the first via and the second via subsequent to testing of the at least one electronic component of the second layer. Example isolation cells include, but are not limited to, electronic fuses and tri-state flip-flops.

Abstract: Monolithic three-dimensional integration can achieve higher device density compared to 3D integration using through-silicon vias. A test solution for M3D integrated circuits (ICs) is based on dedicated test layers inserted between functional layers. A structure includes a first functional layer having first functional components of the IC with first test scan chains and a second functional layer having second functional components of the IC with second test scan chains. A dedicated test layer is located between the first functional layer and the second functional layer. The test layer includes an interface register controlling signals from a testing module to one of the first test scan chains and the second test scan chains, and an instruction register connected to the interface register. The instruction register processes testing instructions from the testing module. Inter-layer vias connect the first functional components, the second functional components, and the testing module through the test layer.

Abstract: Embedded processor-based self-test and diagnosis using the compressed test data is described for ICs having on-chip memory. Techniques for compressing the test data before the compressed test data is transferred to a device under test (DUT) are also described. A modified LZ77 algorithm can be used to compress strings of test data in which don't care bits are handled by assigning a value to the don't care bits according to a longest match in the window as the data is being encoded. The compressed test data can be decompressed at the DUT using a software program transferred by the automated test equipment (ATE) to the DUT with the compressed test data. Decompression and diagnostics can be carried out at the DUT using an embedded processor and the on-chip memory. Results from the diagnostics can be read by the ATE.

Abstract: Embedded processor-based self-test and diagnosis using the compressed test data is described for ICs having on-chip memory. Techniques for compressing the test data before the compressed test data is transferred to a device under test (DUT) are also described. A modified LZ77 algorithm can be used to compress strings of test data in which don't care bits are handled by assigning a value to the don't care bits according to a longest match in the window as the data is being encoded. The compressed test data can be decompressed at the DUT using a software program transferred by the automated test equipment (ATE) to the DUT with the compressed test data. Decompression and diagnostics can be carried out at the DUT using an embedded processor and the on-chip memory. Results from the diagnostics can be read by the ATE.

Abstract: Embedded processor-based self-test and diagnosis using the compressed test data is described for ICs having on-chip memory. Techniques for compressing the test data before the compressed test data is transferred to a device under test (DUT) are also described. A modified LZ77 algorithm can be used to compress strings of test data in which don't care bits are handled by assigning a value to the don't care bits according to a longest match in the window as the data is being encoded. The compressed test data can be decompressed at the DUT using a software program transferred by the automated test equipment (ATE) to the DUT with the compressed test data. Decompression and diagnostics can be carried out at the DUT using an embedded processor and the on-chip memory. Results from the diagnostics can be read by the ATE.

Abstract: Multi-layer integrated circuits having isolation cells for layer testing and related methods are disclosed. According to an aspect, an integrated circuit includes first and second layers that each have one or more electronic components. One or more electronic components of each layer can be electrically connected by a first via and a second via. The integrated circuit also includes an isolation cell operatively connected between the first via and the second via. The isolation cell is configured to controllably break electrical connection between the first via and the second via subsequent to testing of the at least one electronic component of the second layer. Example isolation cells include, but are not limited to, electronic fuses and tri-state flip-flops.

Abstract: A post-fabrication debug and on-line error checking framework for 2D- and 3D-ICs with integrated memories is described. A design-for-debug (DfD) architecture can include, for an IC with on-chip memory, a debug module connected to a functional bus of the IC. The debug module receives trace data for an interval, generates compact signatures based on the received data, and compares these signatures to expected signatures. Intervals containing erroneous trace data can be identified by the debug module and stored in on-chip memory. A single iteration of signal tracing for debug testing between automated test equipment and the IC is possible.

Abstract: A post-fabrication debug and on-line error checking framework for 2D- and 3D-ICs with integrated memories is described. A design-for-debug (DfD) architecture can include, for an IC with on-chip memory, a debug module connected to a functional bus of the IC. The debug module receives trace data for an interval, generates compact signatures based on the received data, and compares these signatures to expected signatures. Intervals containing erroneous trace data can be identified by the debug module and stored in on-chip memory. A single iteration of signal tracing for debug testing between automated test equipment and the IC is possible.

Abstract: A design for test (DfT) architecture is provided that enables pre-bond parametric testing of through-silicon vias (TSVs). A grouping of N number of input/output (I/O) segments are configured to receive a test signal in a feedback loop, where each I/O segment includes one or more buffers (or inverters) and a TSV connected at one end to the one or more buffers. The TSV acts as a shunt-connected capacitor—when defect free—and includes a load resistance when the TSV contains a defect. Each I/O segment can also include one or two multiplexers to control whether the I/O segment receives a test or functional signal and, optionally, whether the I/O segment is bypassed or included in the ring oscillator. The varying loads caused by the defects cause variations in the delay across the buffers (or inverters) of an I/O segment that can be detected in the output signal.

Abstract: A design for test (DfT) architecture is provided that enables pre-bond parametric testing of through-silicon vias (TSVs). A grouping of N number of input/output (I/O) segments are configured to receive a test signal in a feedback loop, where each I/O segment includes one or more buffers (or inverters) and a TSV connected at one end to the one or more buffers. The TSV acts as a shunt-connected capacitor—when defect free—and includes a load resistance when the TSV contains a defect. Each I/O segment can also include one or two multiplexers to control whether the I/O segment receives a test or functional signal and, optionally, whether the I/O segment is bypassed or included in the ring oscillator. The varying loads caused by the defects cause variations in the delay across the buffers (or inverters) of an I/O segment that can be detected in the output signal.

Abstract: A print production system includes a dispatcher and a task-resource scheduler. The dispatcher sorts print requests for placement among a series of containers to identify relative priorities among all print requests in each container and then merges the containers together to produce a prioritized list of print requests among all containers. Upon release by the dispatcher of a top N print requests from the prioritized list, the scheduler converts the prioritized list into a task-resource schedule for print production.

Abstract: A post-fabrication debug and on-line error checking framework for 2D- and 3D-ICs with integrated memories is described. A design-for-debug (DfD) architecture can include, for an IC with on-chip memory, a debug module connected to a functional bus of the IC. The debug module receives trace data for an interval, generates compact signatures based on the received data, and compares these signatures to expected signatures. Intervals containing erroneous trace data can be identified by the debug module and stored in on-chip memory. A single iteration of signal tracing for debug testing between automated test equipment and the IC is possible.

Abstract: Systems and methods are provided for producing fluids with desired concentration factors. According to one embodiment, an arrangement of digital microfluidic (DMF) based electrode platforms are provided. The arrangement may be configured to carry out a sequence of mix steps that may demand storage of resultant fluid mixtures produced in intermediate mix steps. Such sequences of mix steps may be desirable as a result of the decreased demand for initial fluid samples, and reduced wastage.

Abstract: Embedded processor-based self-test and diagnosis using the compressed test data is described for ICs having on-chip memory. Techniques for compressing the test data before the compressed test data is transferred to a device under test (DUT) are also described. A modified LZ77 algorithm can be used to compress strings of test data in which don't care bits are handled by assigning a value to the don't care bits according to a longest match in the window as the data is being encoded. The compressed test data can be decompressed at the DUT using a software program transferred by the automated test equipment (ATE) to the DUT with the compressed test data. Decompression and diagnostics can be carried out at the DUT using an embedded processor and the on-chip memory. Results from the diagnostics can be read by the ATE.

Abstract: Systems and methods are provided for producing fluids with desired concentration factors from the given supply of any two concentration factors, one greater than the target CF and one less than the target CF, of the same fluid. According to one embodiment, a method is provided that stores intermediate waste droplets from a sequence of mix and split steps and repeats certain steps of the sequence using the stored intermediate waste droplets. Such a method may produce additional target CF droplets faster than repeating the entire sequence. In another embodiment, a method of volumetric error resilient target CF droplet generation has been described, and includes reusing the stored intermediate waste droplets and involves a collection of capacitive sensing circuits associated with some electrode platforms.

Abstract: A print production system includes a dispatcher and a task-resource scheduler. The dispatcher sorts print requests for placement among a series of containers to identify relative priorities among all print requests in each container and then merges the containers together to produce a prioritized list of print requests among all containers. Upon release by the dispatcher of a top N print requests from the prioritized list, the scheduler converts the prioritized list into a task-resource schedule for print production.

Abstract: A three dimensional (3D) stacked integrated circuit (IC) design-for-Testing (DfT) die-level wrapper boundary register having a bypass mode and design-level DfT delay recovery techniques are provided. Die wrappers that contain boundary registers at the interface between dies can be inserted into 3D ICs where the boundary registers include a gated scan flop with a bypass line passing the functional input to a through-silicon-via (TSV) in a manner avoiding the clocked stages of the gated scan flop during functional operation. A retiming process can be applied during design layout using a simulation/routing tool or standalone program to recover the additional delay added to the TSV paths by the DfT insertion. Retiming can be performed at both die and stack level, and in further embodiments, logic redistribution across adjacent dies of the stack can be performed for further delay optimization.