Patents by Inventor Kristopher J. Erickson
Kristopher J. Erickson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11760010Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.Type: GrantFiled: December 23, 2021Date of Patent: September 19, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Yan Zhao, Kristopher J. Erickson, Aja Hartman, Lihua Zhao, Sterling Chaffins, Kevin P. DeKam
-
Patent number: 11759996Abstract: An example system includes a three-dimensional (3D) printer to generate a 3D object and a surface feature formation arrangement to receive the 3D object. The 3D object has at least one surface with a layer of at least partly uncured material. The surface feature formation arrangement includes a controller and a heat source. The controller is to operate the heat source to selectively apply heat to the at least one surface of the 3D object. The heat from the heat source is to transform the at least partly uncured material to form a selected feature on the at least one surface.Type: GrantFiled: April 27, 2018Date of Patent: September 19, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Anthony McLennan, Lihua Zhao
-
Patent number: 11738508Abstract: In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.Type: GrantFiled: November 17, 2017Date of Patent: August 29, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Kevin P DeKam, Kristopher J Erickson, Cory J Ruud, Jami Ryan Barone, Ruhua Cai, Anthony J Galvan
-
Publication number: 20230264414Abstract: In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.Type: ApplicationFiled: April 10, 2023Publication date: August 24, 2023Inventors: Kristopher J. ERICKSON, Thomas ANTHONY, Howard S. TOM, Sivapackia GANAPATHIAPPAN, Lihua ZHAO, Krzysztof NAUKA
-
Patent number: 11697153Abstract: The present disclosure is drawn to a material set including a powder bed material and a binder fluid. The powder bed material can be from 80 wt % to 100 wt % metal particles having a metal core and a thin metal layer on the core, and the metal particles having a D50 particle size distribution value ranging from 4 ?m to 150 ?m and the thin metal layer having an average thickness from 20 nm to 2 ?m. The binder fluid can adhere a first portion of the powder bed material relative to a second portion of the powder bed material not in contact with the binder fluid.Type: GrantFiled: June 1, 2018Date of Patent: July 11, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Krzysztof Nauka, John Samuel Dilip Jangam, Kristopher J. Erickson
-
Publication number: 20230191696Abstract: According to an example, a composition may include a high melt temperature build material in the form of a powder; a first low melt temperature binder in the form of a powder; and a second low melt temperature binder in the form of a powder; and in which the first low melt temperature binder melts at a temperature that is different from the second low melt temperature binder.Type: ApplicationFiled: February 11, 2023Publication date: June 22, 2023Inventors: Krzysztof Nauka, Kristopher J. Erickson, Howard S. Tom, Lihua Zhao
-
Patent number: 11648731Abstract: In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.Type: GrantFiled: October 29, 2015Date of Patent: May 16, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Thomas Anthony, Howard S. Tom, Sivapackia Ganapathiappan, Lihua Zhao, Krzysztof Nauka
-
Publication number: 20230130339Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to form a 3D printed capacitor on a body of the 3D printed object. The controller does this by controlling deposition of a conductive agent to form electrodes of the 3D printed capacitor and by controlling deposition of a dielectric agent in a dielectric region between the electrodes of the 3D printed capacitor.Type: ApplicationFiled: April 20, 2020Publication date: April 27, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jarrid WITTKOPF, Kristopher J. ERICKSON, Eric LUNA-RAMIREZ, James W. STASIAK
-
Patent number: 11577454Abstract: A three-dimensional printing system can include polymeric build material and jettable fluid(s). The polymeric build material can have an average particle size from 20 ?m to 150 ?m, a first melt viscosity, and a melting temperature from 75° C. to 350° C. In one example, the jettable fluid can include water, from 0.1 wt % to 10 wt % of electromagnetic radiation absorber, and from 10 wt % to 35 wt % of an organic solvent plasticizer. Contacting a first portion of a layer of the polymeric build material with the jettable fluid can provide an organic solvent plasticizer loading from 2 wt % to 10 wt % based on the polymeric build material content. The first melt viscosity of the polymeric build material at the first portion can be reduced and the melting temperature of the polymeric build material at the first portion can be decreased by 3° C. to 15° C.Type: GrantFiled: March 15, 2018Date of Patent: February 14, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Paul Olubummo, Aja Hartman, Lihua Zhao
-
Patent number: 11511479Abstract: A device includes a carriage movable relative to a build pad along a bi-directional travel path and supporting at least a radiation source and an applicator to selectively apply a plurality of fluid agents, including first fluid agents to affect a first material property. A timing and order of operation of the radiation source and the applicator, with the carriage, is to maintain first and second portions of a 3D object under formation within at least one selectable temperature range despite a first total volume of the first fluid agents for application onto the first portion of the 3D object being substantially greater than a second total volume of second fluid agents for application onto the second portion of the 3D object.Type: GrantFiled: July 10, 2017Date of Patent: November 29, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Aja Hartman, Adekunle Olubummo, Kristopher J. Erickson, Lihua Zhao, Howard S. Tom
-
Patent number: 11498269Abstract: Example post-print processing of three dimensional (3D) printed objects are disclosed. An example system includes an energy source to apply energy to a selected portion of an outer surface of a 3D printed object. The energy provided by the energy source is to cause a polymer of the selected portion to melt and reflow. The selected portion and a non-selected portion of the outer surface to form a pattern on the outer surface of the 3D printed object. A controller to direct the energy of the energy source to the selected portion of the outer surface.Type: GrantFiled: April 30, 2018Date of Patent: November 15, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Anthony William McLennan, Lihua Zhao
-
Publication number: 20220355543Abstract: A three-dimensional printing method can include iteratively applying polymer build material as individual layers; based on a three-dimensional object model, selectively jetting an electromagnetic radiation absorber and a translucency-modulating plasticizer onto individual layers of the polymer build material; and exposing the powder bed to electromagnetic energy to selectively fuse portions of individual layers of the polymer build material together to form a three-dimensional object. The polymer build material can include from about 60 wt % to 100 wt % polymeric particles having an average particle size from about 10 ?m to about 150 ?m and a degree of crystallinity from about 2% to about 60%, to a powder bed. At the locations where the polymer build material includes jetted translucency-modulating plasticizer, the three-dimensional object can exhibit an optical transmittance from about 5% to about 80%.Type: ApplicationFiled: July 15, 2019Publication date: November 10, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Melanie M. Gottwals, Ingeborg Tastl, Aja Hartman, Adekunle Olubummo
-
Publication number: 20220331867Abstract: According to an example, a green body may include from about 1 wt. % to about 20 wt. % of a metal nanoparticle binder and a build material powder, wherein the metal nanoparticle binder is selectively located within an area of the green body to impart a strength greater than about 3 MPa.Type: ApplicationFiled: July 5, 2022Publication date: October 20, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Kristopher J. Erickson, Thomas C. Anthony
-
Publication number: 20220314535Abstract: A device includes a coater, a dispenser, and a treatment portion. The coater is to coat, layer-by-layer, a build material relative to a build pad to form a 3D object. The dispenser is to at least dispense a fluid including a first at least potentially electrically conductive material in at least some selected locations of an external surface of the 3D object. The treatment portion is to treat the 3D object to substantially increase electrically conductivity on the external surface of the 3D object at the at least some selected locations.Type: ApplicationFiled: June 17, 2022Publication date: October 6, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Thomas C. ANTHONY, Lihua ZHAO
-
Publication number: 20220281165Abstract: A system for forming a multiple layer object, the system including: a spreader to form a layer of polymer particles, the polymer particles having a melting temperature (Tm) of at least 250° C.; a fluid ejection head to selectively deposit a first fusing agent on a first portion of the layer and selectively deposit a second fusing agent on a second portion of the layer, wherein the fluid ejection head does not deposit the fusing agent on a third portion of the layer; and a heat source to heat the first portion and second portion, wherein the first portion is part of the multiple layer object and the second portion is not part of the multiple layer object and the second portion raises a temperature of polymer particles in a subsequent layer.Type: ApplicationFiled: May 25, 2022Publication date: September 8, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Kristopher J. Erickson, Lihua Zhao
-
Patent number: 11413687Abstract: According to an example, a green body may include from about 1 wt. % to about 20 wt. % of a metal nanoparticle binder and a build material powder, wherein the metal nanoparticle binder is selectively located within an area of the green body to impart a strength greater than about 3 MPa.Type: GrantFiled: July 31, 2017Date of Patent: August 16, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Thomas C. Anthony
-
Patent number: 11413815Abstract: A system for forming a multiple layer object, the system including: a spreader to form a layer of polymer particles, the polymer particles having a melting temperature (Tm) of at least 250° C.; a fluid ejection head to selectively deposit a first fusing agent on a first portion of the layer and selectively deposit a second fusing agent on a second portion of the layer, wherein the fluid ejection head does not deposit the fusing agent on a third portion of the layer; and a heat source to heat the first portion and second portion, wherein the first portion is part of the multiple layer object and the second portion is not part of the multiple layer object and the second portion raises a temperature of polymer particles in a subsequent layer.Type: GrantFiled: April 21, 2017Date of Patent: August 16, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Lihua Zhao
-
Publication number: 20220234289Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form 1) a three-dimensional (3D) printed object and a container structure to form part of the 3D printed object. The container structure expels a payload when a predetermined condition is met. The additive manufacturing system also includes a payload distributor to place the payload in the container structure. A controller of the additive manufacturing system controls formation of the 3D printed object and the container structure.Type: ApplicationFiled: July 19, 2019Publication date: July 28, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: William J. Allen, Melanie Martin Citta, John C. Greeven, Kristopher J. Erickson, Jarrid Wittkopf, Temiloluwa Adegoke
-
Patent number: 11396129Abstract: A device includes a coater, a dispenser, and a treatment portion. The coater is to coat, layer-by-layer, a build material relative to a build pad to form a 3D object. The dispenser is to at least dispense a fluid including a first at least potentially electrically conductive material. In at least some selected locations of an external surface of the 3D object. The treatment portion is to treat the 3D object to substantially increase electrically conductivity on the external surface of the 3D object at the at least some selected locations.Type: GrantFiled: April 18, 2017Date of Patent: July 26, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Thomas C. Anthony, Lihua Zhao
-
Patent number: 11383301Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.Type: GrantFiled: February 1, 2019Date of Patent: July 12, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Krzysztof Nauka, Thomas Anthony, Lihua Zhao, Howard S. Tom