Patents by Inventor Kristopher J. Erickson
Kristopher J. Erickson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220234289Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form 1) a three-dimensional (3D) printed object and a container structure to form part of the 3D printed object. The container structure expels a payload when a predetermined condition is met. The additive manufacturing system also includes a payload distributor to place the payload in the container structure. A controller of the additive manufacturing system controls formation of the 3D printed object and the container structure.Type: ApplicationFiled: July 19, 2019Publication date: July 28, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: William J. Allen, Melanie Martin Citta, John C. Greeven, Kristopher J. Erickson, Jarrid Wittkopf, Temiloluwa Adegoke
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Patent number: 11396129Abstract: A device includes a coater, a dispenser, and a treatment portion. The coater is to coat, layer-by-layer, a build material relative to a build pad to form a 3D object. The dispenser is to at least dispense a fluid including a first at least potentially electrically conductive material. In at least some selected locations of an external surface of the 3D object. The treatment portion is to treat the 3D object to substantially increase electrically conductivity on the external surface of the 3D object at the at least some selected locations.Type: GrantFiled: April 18, 2017Date of Patent: July 26, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Thomas C. Anthony, Lihua Zhao
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Patent number: 11383301Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.Type: GrantFiled: February 1, 2019Date of Patent: July 12, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Krzysztof Nauka, Thomas Anthony, Lihua Zhao, Howard S. Tom
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Patent number: 11338363Abstract: At a print temperature, a layer (having a predetermined height) of metal build material particles is formed. Also at the print temperature, a fluid containing metal nanoparticles is selectively applied to at least a portion of the layer, and at a fluid loading that wets the portion through the predetermined height without saturating the portion. The metal nanoparticles are exposed to a sintering temperature that is higher than the print temperature and at least 500° below a melting point of the metal build material particles using a predetermined number of heating events taking place at a predetermined speed or for a predetermined time, and separated by a predetermined delay time, to bind the metal build material particles together to form a bound layer. A build material surface is cooled to or below the print temperature. The forming, selectively applying, exposing, and cooling are repeated to form a part precursor.Type: GrantFiled: June 28, 2017Date of Patent: May 24, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventor: Kristopher J. Erickson
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Patent number: 11338510Abstract: A three-dimensional (3D) printing device includes a first cylinder. The first cylinder may include a first plurality of holes defined therein. The 3D printing device may include a second cylinder interior and coaxial to the first cylinder that includes a second plurality of holes open to an interior of the first cylinder. The 3D printing device may also include a third cylinder interior to the first cylinder and exterior to the second cylinder, the third cylinder including a longitudinal cutout open to the first cylinder. The 3D printing device may include a supply tube open to the second cylinder, the supply tube to provide an amount of build material to an interior portion of the second cylinder.Type: GrantFiled: June 8, 2018Date of Patent: May 24, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Krzysztof Nauka, Thomas Anthony, Kristopher J. Erickson
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Publication number: 20220138374Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, a design file for the part. A modifier of the system receives user input modifying the design file and a transmitter transmits the modified design file for production of the part.Type: ApplicationFiled: June 18, 2019Publication date: May 5, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20220134651Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a placement device to embed at least a portion of a container structure into the 3D printed object. The container structure expels a payload when a predetermined condition is met. A controller of the additive manufacturing system controls additive manufacturing and placement of the portion of the container structure.Type: ApplicationFiled: July 19, 2019Publication date: May 5, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: William J. Allen, Melanie Martin Citta, John C. Greeven, Kristopher J. Erickson, Jarrid Wittkopf, Temiloluwa Adegoke
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Patent number: 11311942Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.Type: GrantFiled: January 29, 2016Date of Patent: April 26, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J Erickson, Krzysztof Nauka, Thomas Anthony, Lihua Zhao, Howard S Tom
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Publication number: 20220118694Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.Type: ApplicationFiled: December 23, 2021Publication date: April 21, 2022Inventors: Yan Zhao, Kristopher J. Erickson, Aja Hartman, Lihua Zhao, Sterling Chaffins, Kevin P. DeKam
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Publication number: 20220118707Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a scanner to read three-dimensional (3D) print information from a storage element to be embedded in a 3D printed object. The system also includes a controller. The controller 1) instructs an additive manufacturing device to form the 3D printed object based on the 3D print information stored in the storage element and 2) embeds the storage element into the 3D printed object.Type: ApplicationFiled: June 18, 2019Publication date: April 21, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20220097307Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device of the additive manufacturing system is to embed a sensing system into build material used to form the 3D printed object. The sensing system is to measure a manufacturing condition during formation of the 3D printed object. The additive manufacturing system also includes a controller to associate manufacturing condition with the 3D printed object.Type: ApplicationFiled: June 18, 2019Publication date: March 31, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20220097308Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device is to embed a storage element into the 3D printed object and a controller is to write data to the embedded storage element that relates to manufacturing conditions of the 3D printed object.Type: ApplicationFiled: June 18, 2019Publication date: March 31, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20220101411Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, sensor output data for the part. A transmitter of the system transmits a re-order request for the part based on the sensor output data.Type: ApplicationFiled: June 18, 2019Publication date: March 31, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J, Allen
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Publication number: 20220097305Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to 1) read an identifier from a three-dimensional (3D) System printed object that includes a storage element and 2) read a location of the 3D printed object within a build material bed. An extractor of the system extracts, based on the identifier, a post processing operation to execute on the 3D printed object. A controller of the system controls a post processing operation based on extracted post processing operation information and the location.Type: ApplicationFiled: June 18, 2019Publication date: March 31, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20220097306Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier from a storage element associated with a part. An extractor of the system extracts, based on the identifier, lifecycle conditions specific to the part. A controller of the system alters manufacturing operations based on extracted lifecycle conditions for the part.Type: ApplicationFiled: June 18, 2019Publication date: March 31, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20220083748Abstract: In one example in accordance with the present disclosure, a system is described. The system includes at least one directional antenna to 1) emit energy waves towards a mass in which an object is disposed and 2) receive reflected signals from a resonator disposed on the object as the mass is moved relative to the directional antenna. The system also includes a controller to, based on received reflected signals, determine a pose of the object within the mass.Type: ApplicationFiled: April 12, 2019Publication date: March 17, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: M. Anthony Lewis, William J. Allen, Douglas Pederson, Jarrid Wittkopf, Kristopher J. Erickson, Robert lonescu
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Publication number: 20220072773Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes a build material distributor to deposit layers of powdered build material onto a bed to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to interrupt printing of the 3D printed object and to resume printing of the 3D printed object. The additive manufacturing system also includes a heat source to, during an interruption in printing, maintain a temperature of a top surface of the powdered build material between a solidification temperature and a melting temperature for the build material.Type: ApplicationFiled: May 28, 2019Publication date: March 10, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Aja Hartman, Lihua Zhao
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Publication number: 20220040918Abstract: In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.Type: ApplicationFiled: April 29, 2019Publication date: February 10, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jarrid A. Wittkopf, Kristopher J. Erickson, Lihua Zhao
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Publication number: 20220019193Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a movement device to move a mass with an object disposed therein. A receiver of the system receives accelerometer data from at least one accelerometer disposed within the mass in which the object is disposed. A controller of the system determines a pose of the object within the mass based on received accelerometer data.Type: ApplicationFiled: April 12, 2019Publication date: January 20, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: M. Anthony Lewis, William J. Allen, Kristopher J. Erickson, Jarrid Wittkopf, Robert lonescu, Douglas Pederson
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Publication number: 20210362232Abstract: A three-dimensional (3D) printing device may include a pulsed electromagnetic radiation source; a build platform to maintain a number of layers of build material thereon and receive pulsed electromagnetic radiation from the pulsed electromagnetic radiation source; a micromirror array to selectively direct the pulsed electromagnetic radiation from the pulsed electromagnetic radiation source to the build material on the build platform; and a coolant tank with coolant therein to cool the micromirror array.Type: ApplicationFiled: July 31, 2018Publication date: November 25, 2021Inventors: Krzysztof Nauka, Seongsik Chang, Kristopher J. Erickson