Abstract: Embodiments for forming a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a gate stack structure formed on the substrate. The semiconductor device structure also includes gate spacers formed on sidewalls of the gate stack structure. The semiconductor device structure further includes an isolation structure formed in the substrate and a source/drain stressor structure formed adjacent to the isolation structure. The source/drain stressor structure includes a capping layer which is formed along the (311) and (111) crystal orientations.

Abstract: A methodology and circuits for integrated circuit design are provided. A first electronic design file for an integrated circuit is provided. The first electronic design file for the integrated circuit has a timing measurement circuit thereon. Based on the first electronic design file, a number of integrated circuits are manufactured. These manufactured integrated circuits have respective timing measurement circuits arranged at predetermined locations thereon. The timing measurement circuits are used to measure a number of respective timing delay values, which are subject to manufacturing variation, on the integrated circuits. The measured timing delay values are used to set how an auto-place and route tool arranges blocks in a second electronic design file, which is routed after the timing delay values are measured, to account for any measured manufacturing variation.

Abstract: A multi-mode thin film deposition apparatus including a reaction chamber, a carrying seat, a showerhead, an inert gas supplying source, a first gas inflow system and a second gas inflow system is provided. The carrying seat is disposed in the reaction chamber. The showerhead has a gas mixing room and gas holes disposed at a side of the gas mixing room. The gas mixing room is connected to the reaction chamber through the plurality of gas holes which faces the carrying seat. The first gas inflow system is connected to the reaction chamber and supplies a first process gas during a first thin film deposition process mode. The inert gas supplying source is connected to the gas mixing room for supplying an inert gas. The second gas inflow system is connected to the gas mixing room to supply a second process gas during a second thin film deposition process mode.

Abstract: A multi-mode thin film deposition apparatus including a reaction chamber, a carrying seat, a showerhead, an inert gas supplying source, a first gas inflow system and a second gas inflow system is provided. The carrying seat is disposed in the reaction chamber. The showerhead has a gas mixing room and gas holes disposed at a side of the gas mixing room. The gas mixing room is connected to the reaction chamber through the plurality of gas holes which faces the carrying seat. The first gas inflow system is connected to the reaction chamber and supplies a first process gas during a first thin film deposition process mode. The inert gas supplying source is connected to the gas mixing room for supplying an inert gas. The second gas inflow system is connected to the gas mixing room to supply a second process gas during a second thin film deposition process mode.

Abstract: Provided is a monolithic stacked integrated circuit (IC). The IC includes a first layer over a substrate and a second layer over the first layer. The first layer includes a first plurality of circuit elements where a first portion of the first plurality of circuit elements has defects. The second layer includes a second plurality of circuit elements. The IC further includes interconnect elements coupling the first portion to a second portion of the second plurality of circuit elements for mitigating the defects.

Abstract: A proximal posterior tibial plateau locking compression plate is revealed. This locking compression plate mainly includes a fixing plate and a pressing head having at least one threaded fixing hole and bent forward from the fixing plate. At least one lateral threaded fixing hole is arranged along the two sides the fixing plate and a plurality of lower threaded fixing holes is disposed on the fixing plate, extending downward. The threaded fixing hole on the pressing head, each lateral threaded fixing hole and each lower threaded fixing hole are mounted with a threaded fastener. Thereby the fractured bone fragments on the rear side of the proximal tibia, including those avulsed by the posterior cruciate ligament, are reduced anatomically and fixated rigidly. This locking compression plate not only allows the surgical staff to treat the fractured bone conveniently but also enables the patient to regain their pre-injury activities smoothly.

Abstract: An electronic device includes a base, a display, and a connecting assembly. The connecting assembly includes a pivoting member and a sliding member. The sliding member includes an installation plate and a sliding portion. A first end of the pivoting member is secured to the display. A second end of the pivoting member is pivotably mounted to the installation plate. The base defines an opening slot. The sliding portion is slideably received in the opening slot. The sliding member is slideable relative to the base to slide the display relative to the base via the pivoting member when the sliding portion is slid in the slot.

Abstract: An electronic device includes a base and a cover. The base includes a sliding member slidably mounted thereon. The cover is pivotally mounted on the sliding member. A bobbin is rotatably mounted on the cover. A transmission line is sleeved around the bobbin. One end of the transmission line is connected to the cover, and another end of the transmission line is connected to the base. A position of the cover relative to the base is adjustable by sliding the sliding member on the base, and the transmission line wraps on or off the bobbin when the sliding member slides on the base.

Abstract: An electronic device includes a base and a cover. The base includes a sliding member slidably mounted thereon. The cover includes a touch screen. The cover is pivotally mounted on the sliding member. The cover is rotated to be substantially parallel to the base. The sliding member slides along the base to slide the cover along the base.

Abstract: A method comprises selecting a region from a layout pattern of an integrated circuit, wherein the region comprises a plurality of functional units, and wherein the functional units are not coupled to each other through a variety of connection components, identifying hot spots in the region using a first threshold and inserting a plurality of decoupling capacitors adjacent to the hot spots.

Abstract: A method for fabricating a compound semiconductor epitaxial structure includes the following steps. Firstly, a first compound epitaxial layer is formed on a substrate. Then, a continuous epitaxial deposition process is performed to form a second compound epitaxial layer on the first compound epitaxial layer, so that the second compound epitaxial layer has a linearly-decreased concentration gradient of metal. Afterwards, a semiconductor material layer is formed on the second compound epitaxial layer.

Abstract: A method comprises selecting a region from a layout pattern of an integrated circuit, wherein the region comprises a plurality of functional units, and wherein the functional units are not coupled to each other through a variety of connection components, identifying hot spots in the region using a first threshold and inserting a plurality of decoupling capacitors adjacent to the hot spots.

Abstract: A method for fabricating a compound semiconductor epitaxial structure includes the following steps. Firstly, a first compound epitaxial layer is formed on a substrate. Then, a continuous epitaxial deposition process is performed to form a second compound epitaxial layer on the first compound epitaxial layer, so that the second compound epitaxial layer has a linearly-decreased concentration gradient of metal. Afterwards, a semiconductor material layer is formed on the second compound epitaxial layer.

Abstract: A signal transmission device is provided. The signal transmission device comprises a linked unit, a switch button, a data connector and a cover. The linked unit includes a first shaft, a second shaft, a first elastomer and a second elastomer. The switch button is attached/disposed on the linked unit. The data connector rotates and expands according to the first shaft and the first elastomer. The cover has a storage device to accommodate and cover the data connector. The cover rotates and expands according to the second shaft and the second elastomer.

Abstract: An interposer element in a multidimensional integrated circuit with stacked elements has one or more conductors, especially power supply lines, coupled through decoupling networks defining low impedance shunts for high frequency signals to ground. The interposer has successive tiers including silicon, metal and dielectric deposition layers. The decoupling network for a conductor has at least one and preferably two reactive transmission lines. A transmission line has an inductor in series with the conductor and parallel capacitances at the inductor terminals. The inductors are formed by traces in spaced metal deposition layers forming coil windings and through vias connecting between layers to permit conductor crossovers. The capacitances are formed by MOScaps in the interposer layers. An embodiment has serially coupled coils with capacitances at the input, output and junction between the coils, wherein the coils are magnetically coupled to form a transformer.

Abstract: A circuit including a first switch receiving an input reference voltage, a second switch receiving an input testing voltage, the first switch and the second switch are electrically connected in parallel. The circuit further includes a first capacitor electrically connected in series with the first switch and the second switch. The circuit further includes a feedback stage comprising a feedback inverter electrically connected in parallel with a feedback switch, where the feedback stage is electrically connected in series with the first capacitor. The circuit further includes a first inverter electrically connected in series to the feedback stage, and a third switch electrically connected in series with the first inverter. The circuit further includes a second inverter electrically connected in parallel to a third inverter, the second inverter and the third inverter are electrically connected in series to the third switch, and the third inverter outputs a first output signal.

Abstract: A signal transmission device is provided. The signal transmission device comprises a linked unit, a switch button, a data connector and a cover. The linked unit includes a first shaft, a second shaft, a first elastomer and a second elastomer. The switch button is attached/disposed on the linked unit. The data connector rotates and expands according to the first shaft and the first elastomer. The cover has a storage device to accommodate and cover the data connector. The cover rotates and expands according to the second shaft and the second elastomer.

Abstract: A low power consumption analog-to-digital converter (ADC) is provided. The switched capacitor circuit and the operational amplifier of the pipelined stage within the present low power consumption ADC are designed to close loop, and the operational amplifier is operated at the incomplete settling of the linear settling, namely, the operational amplifier is not operated at the slew state. Therefore, the pipelined stage would not produce signal dependent distortion, such that the gain error produced by the operational amplifier could be seen as a constant gain error.

Abstract: A low power consumption analog-to-digital converter (ADC) is provided. The switched capacitor circuit and the operational amplifier of the pipelined stage within the present low power consumption ADC are designed to close loop, and the operational amplifier is operated at the incomplete settling of the linear settling, namely, the operational amplifier is not operated at the slew state. Therefore, the pipelined stage would not produce signal dependent distortion, such that the gain error produced by the operational amplifier could be seen as a constant gain error.

Abstract: A snap hook has a body, a sliding latch, a resilient element, a swivel and a connector. The body has a shaft and a hook. The shaft is tubular and has an upper end and a lower end. The hook is connected to and extends from the upper end of the shaft. A guide slot is defined longitudinally the shaft and communicates with the lower end of the shaft. Accordingly, no sharp edges are formed near the sliding latch so a person opening the snap hook will not be injured. In addition, assembling the snap hook is easy.