Abstract: A touch sensor includes a substrate, a first touch conductive layer (TCL), a first auxiliary conductive layer (ACL), a second touch conductive layer, and a second auxiliary conductive layer. The first TCL has a first touch conductive trail pattern (TCTP). The first ACL has a lower sheet resistance than the first TCL and a first auxiliary conductive trail pattern (ACTP). The second TCL has a second TCTP. The second ACL has a lower sheet resistance than the second touch conductive layer and a second ACTP. The first and second TCTPs and the first and second ACTPs jointly constitute a touch sensor.

Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.

Abstract: A method includes transferring a wafer over a wafer stage on a wafer table. The wafer table includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket and a second bracket, and a stopper. The second sliding member is movable along a first direction, in which the first sliding member is coupled to a track of the second sliding member, the first sliding member being movable along a second direction vertical to the first direction. The first bracket and the second bracket are connected by a leaf spring. The method includes moving the wafer stage toward the edge of the table body, such that the wafer stage pushes the first cable outwardly, such that the leaf spring is moved toward a first protective film on a surface of the stopper facing the leaf spring.

Abstract: An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.

Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.

Abstract: A photonic integrated circuit includes a substrate, an interconnection layer, and a plurality of silicon waveguides. The interconnection layer is over the substrate. The interconnection layer includes a seal ring structure and an interconnection structure surrounded by the seal ring structure. The seal ring structure has at least one recess from a top view. The recess concaves towards the interconnection structure. The silicon waveguides are embedded in the substrate.

Abstract: A reliability evaluation method for a multi-state distributed network system is provided. The network system includes a network topology of Internet of Things (IoT) devices, edge servers, cloud servers, transmission nodes and transmission arcs. The capacity of the transmission arc is regarded as a random multi-state. The data generated by the IoT devices are transmitted to the edge servers. After processing and compression by the edge servers, the data are transmitted to the cloud servers for calculation. System reliability is defined as the probability that a specific amount of data can be successfully transferred from the IoT devices to the cloud servers. Algorithms are used to calculate the transmission mechanism between the IoT devices, the edge servers, and the cloud servers, evaluate the quality and reliability of multi-state distributed network systems, and further serve as an indicator of system management. Sensitivity analysis is also used to improve quality.

Abstract: A bolster is provided and includes a bottom plate including a side plate extending upwards from a side of the bottom plate and a holding portion bending inwards from an edge of the side plate, a pillar vertically provided on the bottom plate and adjacent to the holding portion, and a torsion bar including two end portions and a main body portion, where one of the two end portions is fixed in the pillar and restricted by the holding portion, and the main body portion is restricted by the side plate. The bolster can effectively reduce warpage and deformation of the bottom plate.

Abstract: A method forming an image sensor includes: providing a substrate including a plurality of sensing portions; forming a color filter layer on the substrate; forming a micro-lens material layer on the color filter layer; and forming a hard mask pattern on the micro-lens material layer, wherein the hard mask pattern has a first gap and a second gap larger than the first gap. The method includes reflowing the hard mask pattern into a plurality of dome shapes; transferring the plurality of dome shapes into the micro-lens material layer to form a plurality of micro-lenses; and forming a top film conformally on the plurality of micro-lenses.

Abstract: A reliability evaluation method for a multi-state distributed network system is provided. The network system includes a network topology of Internet of Things (IoT) devices, edge servers, cloud servers, transmission nodes and transmission arcs. The capacity of the transmission arc is regarded as a random multi-state. The data generated by the IoT devices are transmitted to the edge servers. After processing and compression by the edge servers, the data are transmitted to the cloud servers for calculation. System reliability is defined as the probability that a specific amount of data can be successfully transferred from the IoT devices to the cloud servers. Algorithms are used to calculate the transmission mechanism between the IoT devices, the edge servers, and the cloud servers, evaluate the quality and reliability of multi-state distributed network systems, and further serve as an indicator of system management. Sensitivity analysis is also used to improve quality.

Abstract: A glass structure includes a glass substrate, a first sensing layer, a second sensing layer, a signal wire layer and an insulative layer. Each of the two sensing layers is formed by a metal oxide conductive film electrically connected onto a metal mesh and has sensing columns and isolation columns which insulatively separate the sensing columns. An end of each of the sensing columns is provided with a contact connected to the signal wire layer. Conductive material of each isolation column is divided into disconnected insulative areas. The insulative layer is adhesively disposed between the first and second sensing layers. The sensing columns of the first sensing layers are orthogonal to the second sensing columns on the second sensing layer to constitute a capacitive sensing unit array.

Abstract: Innovations in range asymmetric number system (“RANS”) coding and decoding are described herein. Some of the innovations relate to hardware implementations of RANS decoding that organize operations in two phases, which can improve the computational efficiency of RANS decoding. Other innovations relate to adapting RANS encoding/decoding for different distributions or patterns of values for symbols. For example, RANS encoding/decoding can adapt by switching a default symbol width (the number of bits per symbol), adjusting symbol width on a fragment-by-fragment basis for different fragments of symbols, switching between different static probability models on a fragment-by-fragment basis for different fragments of symbols, and/or selectively flushing (or retaining) the state of a RANS decoder on a fragment-by-fragment basis for different fragments of symbols. In many cases, such innovations can improve compression efficiency while also providing computationally efficient performance.

Abstract: A transparent heating film includes: a base layer, being a transparent film with a dielectric property; a resistance layer, being a transparent conductive film with a surface resistivity between 60 and 150 ?/sq, and disposed on the base layer; an electrode layer, having an electrode circuit pattern which is formed by a mesh crossed with conductive wires, a mesh density of the electrode circuit pattern being between 1 and 25 mesh/mm2, and the electrode circuit pattern electrically connecting with at least one local area of the resistance layer; and a protection layer, being a transparent film with a dielectric property, and completely covering the electrode layer and the resistance layer. The invention can completely planarly and evenly heat up to rapidly defog and locally adjust heating degree.

Abstract: A method includes transferring a wafer over a wafer stage on a wafer table. The wafer table includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket and a second bracket, and a stopper. The second sliding member is movable along a first direction, in which the first sliding member is coupled to a track of the second sliding member, the first sliding member being movable along a second direction vertical to the first direction. The first bracket and the second bracket are connected by a leaf spring. The method includes moving the wafer stage toward the edge of the table body, such that the wafer stage pushes the first cable outwardly, such that the leaf spring is moved toward a first protective film on a surface of the stopper facing the leaf spring.

Abstract: Innovations in range asymmetric number system (“RANS”) coding and decoding are described herein. Some of the innovations relate to hardware implementations of RANS decoding that organize operations in two phases, which can improve the computational efficiency of RANS decoding. Other innovations relate to adapting RANS encoding/decoding for different distributions or patterns of values for symbols. For example, RANS encoding/decoding can adapt by switching a default symbol width (the number of bits per symbol), adjusting symbol width on a fragment-by-fragment basis for different fragments of symbols, switching between different static probability models on a fragment-by-fragment basis for different fragments of symbols, and/or selectively flushing (or retaining) the state of a RANS decoder on a fragment-by-fragment basis for different fragments of symbols. In many cases, such innovations can improve compression efficiency while also providing computationally efficient performance.

Abstract: The method includes the steps of: a) dividing a large-scale touch sensing pattern to be manufactured into multiple divisional patterns and producing multiple photomasks corresponding to the multiple divisional patterns; b) providing a substrate with a conductive layer; c) disposing a photoresist layer on the conductive layer; d) a first exposure process: forming an exposing divisional pattern and multiple first targets the photoresist layer; e) an adjacent exposure process: forming an adjacent exposing divisional pattern and multiple second targets, and adjacently connecting the adjacent exposing divisional pattern and the exposing divisional pattern originally on the photoresist layer; f) repeating the adjacent exposure process to form multiple adjacent exposing divisional patterns until a complete exposing pattern has been assembled; g) performing a developing process to the photoresist layer; and h) etching the conductive layer to form the large-scale touch sensing pattern on the conductive layer.

Abstract: A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.

Abstract: A touch sensor includes a substrate, a first touch conductive layer (TCL), a first auxiliary conductive layer (ACL), a second touch conductive layer, and a second auxiliary conductive layer. The first TCL has a first touch conductive trail pattern (TCTP). The first ACL has a lower sheet resistance than the first TCL and a first auxiliary conductive trail pattern (ACTP). The second TCL has a second TCTP. The second ACL has a lower sheet resistance than the second touch conductive layer and a second ACTP. The first and second TCTPs and the first and second ACTPs jointly constitute a touch sensor.