Abstract: A package that includes a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes at least one dielectric layer, a first plurality of high-density interconnects located in the at least one dielectric layer and through a first surface of the at least one dielectric layer; a second plurality of high-density interconnects located in the at least one dielectric.

Abstract: A package that includes a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer and a plurality of interconnects comprising a first via interconnect and a first trace interconnect, wherein the first via interconnect is directly coupled to the first trace interconnect. The first via interconnect is coupled to the first trace interconnect without an intervening pad interconnect between the first via interconnect and the first trace interconnect.

Abstract: The embodiments of the present application provide a battery cell, a method and system for manufacturing a battery cell, a battery and an electrical device. The battery cell includes: an electrode assembly, including a first tab and a second tab with opposite polarities; a casing for accommodating the electrode assembly, wherein the casing includes a cylinder body and a cover body connected to the cylinder body, the cylinder body is disposed around an outer periphery of the electrode assembly, the cover body is provided with an electrode lead-out hole, and at least part of the cover body is used for electrically connecting a first connecting member of the battery and the first tab; and an electrode terminal for electrically connecting a second connecting member of the battery and the second tab.

Abstract: A battery cell includes an electrode assembly including a first tab and a second tab located on two ends of the electrode assembly, respectively, in a first direction. The battery cell further includes a first electrode terminal and a second electrode terminal located on two sides of the electrode assembly, respectively, in the first direction, a first adapter configured to couple the first tab and the first electrode terminal, and a second adapter configured to couple the second tab and the second electrode terminal. The first adapter and the second adapter each comprise at least two non-bending portions and at least one bending portion each connecting two adjacent ones of the at least two non-bending portions. A number of the at least two non-bending portions of the second adapter is greater than a number of the at least two non-bending portions of the first adapter.

Abstract: A battery cell includes an electrode assembly, a housing, and an end cap. The electrode assembly includes a tab. The housing has an opening and includes a limit part, and is configured to accommodate the electrode assembly. The end cap includes a cap body and a convex part. The cap body is configured to cover the opening. In a thickness direction of the end cap, the cap body is located at one side of the limit part away from the electrode assembly. The limit part is configured to limit the cap body from moving relatively to the housing towards the electrode assembly. The convex part protrudes from an inner surface of the cap body towards the electrode assembly. The convex part is configured to go beyond the limit part away from the cap body, so that the convex part is pressed against the tab.

Abstract: The present invention discloses a landslide experimental device for remotely controlling and simulating a constant seepage flow and weight load and an experimental method thereof in centrifuge test. The landslide experimental device includes a model box, a landslide device, a near-constant water flow control box, remote control devices and a water outlet pipe. The landslide device comprises a landslide model, a load balancing device, a weight storage device, an angle control panel and a tension bar. The remote control devices are arranged at the control box water outlet, at the control box water inlet, on the tension bar, on telescoping control sensors and on the weight storage device, respectively. With the present invention, the influences on the stability of landslide model with different landslide angles under the condition of the seepage flow and weight load can be simulated.

Abstract: Package substrates employing integrated slot-shaped antenna(s), and related integrated circuit (IC) packages and fabrication methods. The package substrate can be provided in a radio-frequency (RF) IC (RFIC) package. The package substrate includes one or more slot-shaped antennas each formed from a slot disposed in the metallization substrate that can be coupled to the RFIC die for receiving and radiating RF signals. The slot-shaped antenna includes a conductive slot disposed in at least one metallization layer in the package substrate. A metal interconnect in a metallization layer in the package substrate is coupled to the conductive slot to provide an antenna feed line for the slot-shaped antenna. In this manner, the slot-shaped antenna being integrated into the metallization substrate of the IC package can reduce the area in the IC package needed to provide an antenna and/or provide other directions of antenna radiation patterns for enhanced directional RF performance.

Abstract: The embodiments of this application provide a battery cell, a battery, a power consumption device, and a battery cell manufacturing method and device, which pertain to the technical field of batteries. The battery cell includes a housing, an electrode assembly, an end cover, and a current collecting member. The housing has an opening. The electrode assembly is accommodated in the housing. The end cover covers the opening and is connected to the housing in a sealed manner. The current collecting member is accommodated in the housing and is located on a side of the electrode assembly facing the end cover, and the current collecting member is configured to be connected to the housing and the electrode assembly, so that the electrode assembly is electrically connected to the housing.

Abstract: A substrate that includes a core layer comprising a first surface and a second surface, at least one first dielectric layer located over a first surface of the core layer, at least one second dielectric layer located over a second surface of the core layer, high-density interconnects located over a surface of the at least one second dielectric layer, interconnects located over the surface of the at least one second dielectric layer, and a solder resist layer located over the surface of the at least one second dielectric layer. A first portion of the solder resist layer that is touching the high-density interconnects includes a first thickness that is equal or less than a thickness of the high-density interconnects. A second portion of the solder resist layer that is touching the interconnects includes a second thickness that is greater than a thickness of the interconnects.

Abstract: A battery cell is provided. The battery cell includes a tab, an electrode terminal, an adapter for electrical connection between the electrode terminal and the tab. The adapter includes a first connecting portion for electrical connection with the electrode terminal; a second connecting portion for electrical connection with the tab; a third connecting portion for connecting the first connecting portion and the second connecting portion; and a bending portion, the third connecting portion is connected with the first connecting portion by the bending portion and the third connecting portion is connected with the second connecting portion by the bending portion; the third connecting portion includes a reinforcing portion, and the reinforcing portion is located at the connection of the third connecting portion and the bending portion; the minimum distance L from an edge of the reinforcing portion to a center line of the bending portion satisfies: R<L<(R+2).

Abstract: A substrate that includes a core layer, at least one first dielectric layer located over a first surface of the core layer, at least one second dielectric layer located over a second surface of the core layer, a plurality of first interconnects located over a surface of the at least one first dielectric layer, a plurality of second interconnects located over the surface of the at least one first dielectric layer, a plurality of third interconnects located over the surface of the at least one first dielectric layer, and a solder resist layer located over the surface of the at least one second dielectric layer. The plurality of third interconnects and the plurality of second interconnects are co-planar to the plurality of first interconnects. The solder resist layer includes a first portion, a second portion, and a third portion.

Abstract: A battery cell includes a casing provided with openings at two ends of the casing in a first direction, a first end cap and a second end cap connected to the casing and configured to close the openings at the two ends of the casing, respectively, and a connecting piece disposed in the casing and configured to be connected to the first end cap or be connected to the first end cap and the second end cap. The battery cell is provided with a weak structure at one of the two ends. A connecting force between the connecting piece and the first end cap is greater than a connecting force between the connecting piece and the second end cap. A connecting position where the connecting piece is connected to the first end cap is located in an area surrounded by the weak structure.

Abstract: Embodiments of the application provide a battery cell, a manufacturing method and a manufacturing system therefor, a battery and an electric device. According to the embodiments of the application, the battery cell includes: an electrode assembly including a first electrode piece; a housing, configured to accommodate the electrode assembly and including an electrode lead-out portion; an adapter, configured to electrically connect the electrode lead-out portion and the first electrode piece. The first electrode piece is configured such that the first electrode piece is at least partially wound around the adapter and affixed to the adapter. The first electrode piece is wound around the adapter, such that a part of the first electrode piece can be affixed to the adapter by its own tension to ensure electrical connection between the first electrode piece and the adapter.

Abstract: Disclosed is a battery cell, a battery, a power consumption apparatus and a method and an apparatus for producing a battery cell. The battery cell includes: a housing, with a first opening; an electrode assembly, arranged in the housing; an end cover assembly, including an end cover, a pressure relief mechanism and a first insulating member, the end cover covers the first opening, the pressure relief mechanism is arranged on the end cover, the pressure relief mechanism is configured, when an internal pressure or temperature of the battery cell reaches a threshold, to be actuated, the first insulating member is located on a side of the end cover close to the electrode assembly to isolate the electrode assembly and the end cover, and the first insulating member is configured that a projection on the end cover along a thickness direction of the end cover covers the pressure relief mechanism.

Abstract: A package comprising a substrate and an integrated device coupled to the substrate. The substrate comprises at least one dielectric layer; a plurality of interconnects comprising plurality of pad-on-pad interconnects, wherein the plurality of pad-on-pad interconnects is embedded through a first surface of the substrate. The plurality of pad-on-pad interconnects includes a first pad-on-pad interconnect comprising a first pad and a second pad coupled to the first pad. The package further comprising a solder resist layer located over the first surface of the substrate. The solder resist layer comprises a first solder resist layer portion comprising a first thickness; and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The second solder resist layer portion is located between the at least one dielectric layer and the integrated device.

Abstract: A function processing method and device, and an electronic device are provided. The function processing method includes: obtaining a first polynomial function including a plurality of terms consisting of a plurality of first variables; constructing a node route diagram of a quantum approximate optimization algorithm (QAOA) based on the first polynomial function, where the node route diagram includes K nodes, K is determined based on the first polynomial function, and K is an integer greater than 1; generating quantum entangled states of the node route diagram, where the quantum entangled states include target quantum states of the K nodes in the node route diagram; and sequentially performing a numerical measurement on each node in the K nodes based on the target quantum state of the K nodes in the node route diagram, to obtain a first target numerical measurement result of the plurality of first variables.

Abstract: A package that includes a substrate and an electrical component coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, and a solder resist layer located over a surface of the at least one dielectric layer. The solder resist layer includes a first solder resist layer portion comprising a first thickness, and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The electrical component is located over the second solder resist layer portion.

Abstract: A system in having M memory controllers between a first memory and a second memory having N operative memory slices, where N and M are not evenly divisible, includes logic to operate the M memory controllers to linearly distribute addresses of the second memory across the N operative memory slices. The system may be utilized in commercial applications such as data centers, autonomous vehicles, and machine learning.

Abstract: This disclosure provides a node grouping method and apparatus and an electronic device, and relates to the field of evolutionary computing in quantum computing. The method includes: obtaining a graph of to-be-grouped nodes, wherein the graph of to-be-grouped nodes includes M first nodes; constructing a QAOA (quantum approximate optimization algorithm) node circuit graph based on the graph of to-be-grouped nodes, the node circuit graph including K nodes which including the M first nodes; generating a quantum entangled state of the node circuit graph that includes target quantum states of the K nodes in the node circuit graph; performing a group measurement on each of the K nodes sequentially based on the target quantum states of the K nodes to obtain a target group measurement result of the M first nodes; determining a grouping output result of the M first nodes based on the target group measurement result.

Abstract: A method for eliminating bubbles from a liquid dispensing system includes flowing a liquid containing bubbles into a liquid inlet of a tank from a filter to substantially fill the tank, wherein substantially all bubbles accumulate in an upper portion of the tank having a lateral dimension greater than a lateral dimension of a lower portion of the tank, and flowing the liquid into the tank comprises flowing the liquid through an inlet pipe extending at an acute angle relative to a horizontally-oriented axis of the tank. The method further includes flowing a liquid substantially free of bubbles out of the tank via a liquid outlet at the lower portion of the tank for dispensing to a substrate.