Patents by Inventor Kun-tack Lee

Kun-tack Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210217635
    Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Inventors: Young-hoo Kim, Sang-jine PARK, Yong-jhin CHO, Yeon-jin GIL, Ji-hoon JEONG, Byung-kwon CHO, Yong-sun KO, Kun-tack LEE
  • Patent number: 10985036
    Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: April 20, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo Kim, Sang-Jine Park, Yong-Jhin Cho, Yeon-Jin Gil, Ji-Hoon Jeong, Byung-Kwon Cho, Yong-Sun Ko, Kun-Tack Lee
  • Publication number: 20210060625
    Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
    Type: Application
    Filed: June 2, 2020
    Publication date: March 4, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung Min SHIN, Hun Jae JANG, Seok Hoon KIM, Young-Hoo KIM, In Gi KIM, Tae-Hong KIM, Kun Tack LEE, Ji Hoon CHA, Yong Jun CHOI
  • Publication number: 20200343113
    Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.
    Type: Application
    Filed: November 21, 2019
    Publication date: October 29, 2020
    Inventors: Yong Jun CHOI, Seok Hoon KIM, Young-Hoo KIM, In Gi KIM, Sung Hyun PARK, Seung Min SHIN, Kun Tack LEE, Jinwoo LEE, Hun Jae JANG, Ji Hoon CHA
  • Publication number: 20200335361
    Abstract: A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.
    Type: Application
    Filed: November 22, 2019
    Publication date: October 22, 2020
    Inventors: Hun Jae JANG, Seung Min Shin, Seok Hoon Kim, In Gi Kim, Tae-Hong Kim, Kun Tack Lee, Jinwoo Lee, Ji Hoon Cha, Yong Jun Choi
  • Publication number: 20200286727
    Abstract: A method of processing substrates, comprising: loading a substrate into a process chamber; supplying a supercritical fluid, that is a process fluid under the supercritical state, into the process chamber, chemicals separated from the substrate and the supercritical fluid being mixed into a supercritical mixture in the process chamber; and gradually decreasing a chemical concentration of the supercritical mixture by alternately repeating a pressure drop mode and a supplemental mode such that the supercritical mixture partially flows out from the process chamber at the pressure drop mode when an inner pressure of the process chamber reaches a first pressure and the supercritical fluid turbulently flows into the process chamber at the supplemental mode when the inner pressure of the process chamber reaches a second pressure that is smaller than the first pressure and over a supercritical pressure of the process fluid.
    Type: Application
    Filed: May 22, 2020
    Publication date: September 10, 2020
    Inventors: Ji-Hoon JEONG, Jung-Min OH, Kun-Tack LEE, Hyo-San LEE
  • Patent number: 10679843
    Abstract: A method of processing substrates, comprising: loading a substrate into a process chamber; supplying a supercritical fluid, that is a process fluid under a supercritical state, into the process chamber, chemicals separated from the substrate and the supercritical fluid being mixed into a supercritical mixture in the process chamber; and gradually decreasing a chemical concentration of the supercritical mixture by alternately repeating a pressure drop mode and a supplemental mode such that the supercritical mixture partially flows out from the process chamber at the pressure drop mode when an inner pressure of the process chamber reaches a first pressure and the supercritical fluid turbulently flows into the process chamber at the supplemental mode when the inner pressure of the process chamber reaches a second pressure that is smaller than the first pressure and over a supercritical pressure of the process fluid.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: June 9, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Hoon Jeong, Jung-Min Oh, Kun-Tack Lee, Hyo-San Lee
  • Patent number: 10668403
    Abstract: A source supplier includes a source reservoir that contains a liquefied source fluid for a supercritical process, a vaporizer that vaporizes the liquefied source fluid into a gaseous source fluid under high pressure, a purifier that removes organic impurities and moistures from the gaseous source fluid and an analyzer connected to the purifier that analyzes an impurity fraction and a moisture fraction in the gaseous source fluid. Moisture and organic impurities are removed from the source fluid to reduce the moisture concentration of the supercritical fluid in the supercritical process.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: June 2, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-Min Oh, Ji-Hoon Jeong, Dong-Gyun Han, Kun-Tack Lee, Hyo-San Lee, Yong-Myung Jun
  • Patent number: 10576582
    Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo Kim, Il-Sang Lee, Yong-sun Ko, Chang-Gil Ryu, Kun-Tack Lee, Hyo-San Lee
  • Patent number: 10435234
    Abstract: A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: October 8, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong Jhin Cho, In Kwang Bae, Jung Min Oh, Mi Hyun Park, Kun Tack Lee, Yong Jun Choi
  • Publication number: 20190019669
    Abstract: Disclosed are an apparatus for treating a substrate and a method of treating substrates. The apparatus includes an inlet valve through which a supercritical fluid flows into the process chamber until an inner pressure of the process chamber reaches a first pressure and a turbulent flow generator turbulently supplementing the supercritical fluid into the process chamber until the inner pressure of the process chamber is recovered to the first pressure. A pressure drop module partially removes a supercritical mixture from the process chamber until the inner pressure of the process chamber is dropped to the second pressure. A pressure drop mode and a supplemental mode may be alternately repeated by the flow controller.
    Type: Application
    Filed: September 18, 2018
    Publication date: January 17, 2019
    Inventors: Ji-Hoon JEONG, Jung-Min OH, Kun-Tack LEE, Hyo-San LEE
  • Publication number: 20180358242
    Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.
    Type: Application
    Filed: November 30, 2017
    Publication date: December 13, 2018
    Inventors: Young-hoo Kim, Sang-jine PARK, Yong-jhin CHO, Yeon-jin GIL, Ji-hoon JEONG, Byung-kwon CHO, Yong-sun KO, Kun-tack LEE
  • Publication number: 20180334318
    Abstract: A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.
    Type: Application
    Filed: November 16, 2017
    Publication date: November 22, 2018
    Inventors: Yong Jhin Cho, In Kwang Bae, Jung Min Oh, Mi Hyun Park, Kun Tack Lee, Yong Jun Jun
  • Publication number: 20180311764
    Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 1, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo KIM, Il-Sang LEE, Yong-sun KO, Chang-Gil RYU, Kun-Tack LEE, Hyo-San LEE
  • Patent number: 10083829
    Abstract: Disclosed are an apparatus for treating a substrate and a method of treating substrates. The apparatus includes an inlet valve through which a supercritical fluid flows into the process chamber until an inner pressure of the process chamber reaches a first pressure and a turbulent flow generator turbulently supplementing the supercritical fluid into the process chamber until the inner pressure of the process chamber is recovered to the first pressure. A pressure drop module partially removes a supercritical mixture from the process chamber until the inner pressure of the process chamber is dropped to the second pressure. A pressure drop mode and a supplemental mode may be alternately repeated by the flow controller.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: September 25, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Hoon Jeong, Jung-Min Oh, Kun-Tack Lee, Hyo-San Lee
  • Patent number: 10029332
    Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: July 24, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo Kim, Il-Sang Lee, Yong-sun Ko, Chang-Gil Ryu, Kun-Tack Lee, Hyo-San Lee
  • Publication number: 20180114706
    Abstract: A wafer boat assembly including a boat, a pedestal, and a base. The boat includes a slot to hold a wafer and a rod including a gas line. The pedestal includes a first surface and a connection line coupled to the gas line. The base is on a second surface of the pedestal, rotates the pedestal, and supplies gas to the connection line. The boat is on the first surface of the pedestal. The gas flows along the gas line and is dispensed from a location where the rod contacts the wafer to levitate the wafer.
    Type: Application
    Filed: April 24, 2017
    Publication date: April 26, 2018
    Inventors: Sang Ryol YANG, Kyo Jun JEON, Kun Tack LEE, Jong Heun LIM
  • Patent number: 9903651
    Abstract: A sealing member includes a body having a ring shape, a lower contacting portion protruding from a lower end of the body and having at least one recess, the recess provided in a lower surface of the lower contacting portion and extending in a radial direction of the body, and an outer contacting portion protruding outwards from the body along an outer side portion of the body.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: February 27, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-Myung Jun, Yong-Sun Ko, Kun-Tack Lee, Il-Sang Lee, Ji-Hoon Jeong, Yong-Jhin Cho, Jin-Suk Hong
  • Publication number: 20180028936
    Abstract: A source supplier includes a source reservoir that contains a liquefied source fluid for a supercritical process, a vaporizer that vaporizes the liquefied source fluid into a gaseous source fluid under high pressure, a purifier that removes organic impurities and moistures from the gaseous source fluid and an analyzer connected to the purifier that analyzes an impurity fraction and a moisture fraction in the gaseous source fluid. Moisture and organic impurities are removed from the source fluid to reduce the moisture concentration of the supercritical fluid in the supercritical process.
    Type: Application
    Filed: April 7, 2017
    Publication date: February 1, 2018
    Inventors: JUNG-MIN OH, JI-HOON JEONG, DONG-GYUN HAN, KUN-TACK LEE, HYO-SAN LEE, YONG-MYUNG JUN
  • Patent number: 9754806
    Abstract: Provided are an apparatus and method for treating wafers using a supercritical fluid. The wafer treatment apparatus includes a plurality of chambers; a first supply supplying a first fluid in a supercritical state; a second supply supplying a mixture of the first fluid and a second fluid; a plurality of first and second valves; and a controller selecting a first chamber of the plurality of chambers for wafer treatment to control the open/closed state of each of the plurality of first valves so that the first fluid can be supplied only to the first chamber of the plurality of chambers and selecting a second chamber of the plurality of chambers to control the open/closed state of each of the plurality of second valves so that the mixture of the first fluid and a second fluid can be supplied only to the second chamber of the plurality of chambers.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: September 5, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyo-San Lee, Chang-ki Hong, Kun-tack Lee, Jeong-nam Han