Patents by Inventor Kun Xu

Kun Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240116152
    Abstract: A method of controlling polishing includes polishing a stack of adjacent conductive layers on a substrate, measuring with an in-situ eddy current monitoring system a sequence of characterizing values for the substrate during polishing, calculating a polishing rate from the sequence of characterizing values repeatedly during polishing, calculating one or more adjustments for one or more polishing parameters based on a current polishing rate using a first control algorithm for an initial time period, detecting a change in the polishing rate that indicates exposure of the underlying conductive layer, and calculating one or more adjustments for one or more polishing parameters based on the polishing rate using a different second control algorithm for a subsequent time period after detecting the change in the polishing rate.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: Kun Xu, Harry Q. Lee, Benjamin Cherian, David Maxwell Gage
  • Patent number: 11945302
    Abstract: A low-floor electric axle assembly including: an axle housing, two hub motors, two planetary gear reducers, two hubs, a brake system, two C-shaped beams, and a suspension system. Mechanical mounting of the suspension system is compatible with a conventional axle. The axle housing has a left and right symmetrical dumbbell-shaped structure configured to bear a weight of a vehicle. The hub motors are inner rotor type motors and are separately arranged at two ends of the axle housing left and right symmetrically. The hub motors are arranged coaxially with two wheels respectively. Two hub motor rotors are connected to the planetary gear reducers respectively. Each of the planetary gear reducers is a single-stage planetary gear reducer. A sun gear of each of the planetary gear reducers receives power outputted by each of the hub motor. Two planetary gear reducer housings are power output ends connected to two rims respectively.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: April 2, 2024
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Jian-Qiu Li, Jia-Yi Hu, Liang-Fei Xu, Bing-Kun Cai, Hang Li
  • Publication number: 20240097116
    Abstract: The invention discloses a ternary positive electrode material coated with nitride/graphitized carbon nanosheets and preparation method thereof. The ternary positive electrode material coated with nitride/graphitized carbon nanosheets includes a ternary positive electrode material matrix and a coating layer; the coating layer is composed of nitride and graphitized carbon; and the graphitized carbon is formed in situ in the coating process of the nitride. Compared with a physical mixing method, the in-situ generated carbon layer is connected to the material matrix more tightly, and the formed conductive network is denser. So that the rate performance of the material is improved to the maximum extent. The preparation method is simple and easy to realize industrial production. And the obtained ternary positive electrode material coated with nitride/graphitized carbon nanosheets has excellent rate performance and cycling stability.
    Type: Application
    Filed: October 26, 2023
    Publication date: March 21, 2024
    Inventors: Kaihua XU, Rui HE, Weifeng DING, Yunhe ZHANG, Xiang ZHANG, Kun ZHANG
  • Patent number: 11934449
    Abstract: Provided are a method and apparatus for processing map information, a device, and a storage medium which relate to the field of computer technology and, in particular, to the fields of intelligent transportation and computer vision technology. The specific implementation includes that an object in an image for query is recognized to obtain an object recognition result and that a target point of interest matching the image for query is selected from at least one candidate point of interest of an electronic map according to the object recognition result.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: March 19, 2024
    Assignee: Beijing Baidu Netcom Science Technology Co., Ltd.
    Inventors: Jia Zhao, Meng Xu, Kun Zhang
  • Patent number: 11932650
    Abstract: The present disclosure relates to derivatized agelastatin compounds and methods for the treatment, prevention, or delay of cancer, comprising administering a therapeutically effect amount of the derivatized agelastatin compounds, a pharmaceutically acceptable salt thereof, or a composition thereof to a subject in need thereof. Methods for making the derivatized agelastatin compounds are also provided.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: March 19, 2024
    Assignees: Massachusetts Institute of Technology, Tufts Medical Center, Inc.
    Inventors: Mohammad Movassaghi, Alyssa H. Antropow, Rachel J. Buchsbaum, Kun Xu
  • Publication number: 20240085328
    Abstract: Systems and methods are provided for excitation spectral microscopy using frame-synchronized acousto-optic scanning of fluorescent excitation wavelengths. Linear unmixing of the images of targets of components that are individually labeled with different fluorophores can be simultaneously imaged with high temporal resolution and low crosstalk and the local abundance of each fluorophore at each pixel can be quantified. Fluorophore decomposed micrographs of the sample can be obtained by rendering the abundance in each pixel as an image.
    Type: Application
    Filed: October 11, 2023
    Publication date: March 14, 2024
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Ke Xu, Kun Chen, Rui Yan, Limin Xiang
  • Patent number: 11927816
    Abstract: An optical module optimized for EMI shielding performance and electromagnetic shielding structure of the optical module includes a base, an upper cover, and an unlocking device connected by an unlocking handle and a movable unlocking piece; the base is butted and clamped with the upper cover to form a limiting groove for accommodating the unlocking latch on both sides of the movable unlocking piece, the unlocking latch is correspondingly slidably fitted in the limiting groove; the upper end of the unlocking latch on each side is provided with a first notch, which is used to make way for the base EMI lug boss set on the base, the lower end of the unlocking latch on each side is provided with a second notch, which is used to make way for the upper cover EMI lug boss set on the upper cover.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: March 12, 2024
    Assignee: Wuhan HGGenuine Optics Tech Co., Ltd.
    Inventors: Kun Shu, Yong Zhang, Qijian Xu, Yu Zhai
  • Publication number: 20240026747
    Abstract: A coring and sampling integrated sub, including an integrally formed base body, a probe module, a coring module and a hydraulic module. The probe module, the coring module and the hydraulic module are all mounted on the base body. The hydraulic module, the probe module and the coring module are sequentially arranged from top to bottom. An output end of the hydraulic module is configured to be connected to the probe module and the coring module, respectively. The hydraulic module is configured to provide telescopic power for the probe module, and provide power for movement, flipping, and pushing of the coring module. Also disclosed is a downhole instrument including the coring and sampling integrated sub.
    Type: Application
    Filed: October 29, 2021
    Publication date: January 25, 2024
    Applicant: CHINA OILFIELD SERVICES LIMITED
    Inventors: Yongren FENG, Tao LU, Lin HUANG, Shusheng GUO, Xiaodong CHU, Kun XU, Tiemin LIU, Yongchao CHEN, Yongzeng XUE, Xinhuo WENG, Guoqiang ZHANG, Suogui SHANG, Yang SHEN, Ya JIN
  • Publication number: 20240014080
    Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.
    Type: Application
    Filed: September 21, 2023
    Publication date: January 11, 2024
    Inventors: Kun Xu, Kiran Lall Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian, Jun Qian, Harry Q. Lee
  • Patent number: 11865664
    Abstract: During polishing of a stack of adjacent layers, a plurality of instances of a profile control algorithm are executed on a controller with different instances having different values for a control parameter. A first instance receives a sequence of characterizing values from an in-situ monitoring system during an initial time period to control a polishing parameter, and a second instance receives the sequence of characterizing values during the initial time period and a subsequent time period to control the polishing parameter. Exposure of the underlying layer is detected based on the sequence of characterizing values from the in-situ monitoring system.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: January 9, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Harry Q. Lee, Benjamin Cherian, David Maxwell Gage
  • Patent number: 11868872
    Abstract: In one example, an apparatus comprises: a direct memory access (DMA) descriptor queue that stores DMA descriptors, each DMA descriptor including an indirect address; an address translation table that stores an address mapping between indirect addresses and physical addresses; and a DMA engine configured to: fetch a DMA descriptor from the DMA descriptor queue to the address translation table to translate a first indirect address of the DMA descriptor to a first physical address based on the address mapping, and perform a DMA operation based on executing the DMA descriptor to transfer data to or from the first physical address.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: January 9, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Ilya Minkin, Ron Diamant, Kun Xu
  • Patent number: 11850699
    Abstract: A method of controlling polishing includes polishing a stack of adjacent conductive layers on a substrate, measuring with an in-situ eddy current monitoring system a sequence of characterizing values for the substrate during polishing, calculating a polishing rate from the sequence of characterizing values repeatedly during polishing, calculating one or more adjustments for one or more polishing parameters based on a current polishing rate using a first control algorithm for an initial time period, detecting a change in the polishing rate that indicates exposure of the underlying conductive layer, and calculating one or more adjustments for one or more polishing parameters based on the polishing rate using a different second control algorithm for a subsequent time period after detecting the change in the polishing rate.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: December 26, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Harry Q. Lee, Benjamin Cherian, David Maxwell Gage
  • Publication number: 20230394304
    Abstract: A method for training neural networks based on energy-based latent variable models (EBLVMs) includes bi-level optimizations based on a score matching objective. The lower-level optimizes a variational posterior distribution of the latent variables to approximate the true posterior distribution of the EBLVM, and the higher-level optimizes the neural network parameters based on a modified SM objective as a function of the variational posterior distribution. The method is used to train neural networks based on EBLVMs with nonstructural assumptions.
    Type: Application
    Filed: October 15, 2020
    Publication date: December 7, 2023
    Inventors: Jun Zhu, Fan Bao, Chongxuan Li, Kun Xu, Hang Su, Siliang Lu
  • Publication number: 20230390883
    Abstract: A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relative motion between the platen and the carrier head so as to polish the substrate. The carrier head includes a retaining ring for holding the substrate, and the acoustic sensor travels in a path below the carrier head and the retaining ring. A controller is configured to analyze a signal from the acoustic sensor and determine a characteristic of the retaining ring based on the signal.
    Type: Application
    Filed: October 6, 2022
    Publication date: December 7, 2023
    Inventors: Haoquan Fang, Thomas H. Osterheld, Benjamin Cherian, Jun Qian, Kun Xu, Sohrab Pourmand, Boguslaw A. Swedek, Jeonghoon Oh, Dominic J. Benvegnu, Brian J. Brown
  • Publication number: 20230381912
    Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.
    Type: Application
    Filed: August 4, 2023
    Publication date: November 30, 2023
    Inventors: Kun Xu, Benjamin Cherian, Jun Qian, Kiran Lall Shrestha
  • Patent number: 11794302
    Abstract: A method of chemical mechanical polishing includes bringing a conductive layer of a substrate into contact with a polishing pad, supplying a polishing liquid to the polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, and determining a sequence of thickness values for the conductive layer based on the sequence of signal values. Determining the sequence of thickness values includes at least partially compensating for a contribution of the polishing liquid to the signal values.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: October 24, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Andrew Siordia
  • Publication number: 20230332775
    Abstract: An air conditioner indoor unit includes a housing, a panel, a fan assembly, a first air guide assembly, and a first driving assembly. The panel includes a first air outlet. The first air guide assembly is located on a side of the panel away from the housing, and a second air outlet is constituted between an edge of the first air guide assembly and an edge of the first air outlet. The first driving assembly is configured to drive the first air guide assembly to move relative to the panel, so as to change a size of the second air outlet to adjust a flow direction of air flowing out from the second air outlet. The first air guide assembly includes a flow direction changing structure, and the flow direction changing structure is configured to move in a direction different from a moving direction of the first air guide assembly.
    Type: Application
    Filed: June 12, 2023
    Publication date: October 19, 2023
    Applicant: QINGDAO HISENSE HITACHI AIR-CONDITIONING SYSTEMS CO., LTD.
    Inventors: Kun XU, Luhua YAN, Zhichao YUAN, Yanfang ZHU, Hu LI, Tao LI, Jianjun MENG, Bao QI, Xutong SONG, Yanqiang HUAN, Changquan ZHANG
  • Patent number: 11791224
    Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: October 17, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Kiran Lall Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian, Jun Qian, Harry Q. Lee
  • Patent number: 11789859
    Abstract: To generate sequential addresses when multiple integrated circuit (IC) devices are accessing the same memory, an address token is sent along the IC devices communicatively coupled in a ring topology. The address token is first transferred along the ring topology during a memory reservation phase in which each IC device can set a corresponding memory request bit to indicate that the IC device has data to write to the memory. The modified address token is then transferred along the ring topology again during a memory access phase. During the memory access phase, each IC device that has data to write can perform a memory write operation using a sequential address determined from the contents of the address token.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: October 17, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Kun Xu, Suresh Hariharan
  • Patent number: 11780047
    Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: October 10, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Benjamin Cherian, Jun Qian, Kiran Lall Shrestha