Abstract: A first resistivity value and a correlation function relating thickness of a conductive layer having the first resistivity value to a signal from an in-situ monitoring system are stored. A second resistivity value for a conductive layer on a substrate is received. A sequence of signal values that depend on thickness of the conductive layer is received from an in-situ electromagnetic induction monitoring system that monitors the substrate during polishing. A sequence of thickness values is generated based on the sequence of signal values and the correlation function. For at least some thickness values of the sequence of thickness values adjusted thickness values are generated that compensate for variation between the first resistivity value and the second resistivity value to generate a sequence of adjusted thickness values. A polishing endpoint is detected or an adjustment for a polishing parameter is determined based on the sequence of adjusted thickness values.

Abstract: Method and apparatus for automatically predicting lexical sememes using a lexical dictionary, comprising inputting a word, retrieving the word's semantic definition and sememes corresponding to the word from an online dictionary, setting each of the retrieved sememes as a candidate sememe, inputting the word's semantic definition and candidate sememe, and estimating the probability that the candidate sememe can be inferred from the word's semantic definition.

Abstract: A method and system of analyzing a symbolic sequence is provided. Metadata of a symbolic sequence is received from a computing device of an owner. A set of R random sequences are generated based on the received metadata and sent to the computing device of the owner of the symbolic sequence for computation of a feature matrix based on the set of R random sequences and the symbolic sequence. The feature matrix is received from the computing device of the owner. Upon determining that an inner product of the feature matrix is below a threshold accuracy, the iterative process returns to generating R random sequences. Upon determining that the inner product of the feature matrix is at or above the threshold accuracy, the feature matrix is categorized based on machine learning. The categorized global feature matrix is sent to be displayed on a user interface of the computing device of the owner.

Abstract: Disclosed are a device and a method for microelectrodeposition through a laser assisted flexible following tool electrode. Localization of electrodeposition and dimensional precision of members are enhanced by using the flexible following tool electrode to restrict a dispersion region of an electric field and a reaction region of electrodeposition, and a complex-shaped member can be deposited by controlling a motion path of the flexible following tool electrode. Since a laser has a high power density, introducing laser irradiation changes an electrode state in a radiated region, accelerates ion diffusion and electron transfer speeds, and increases a deposition rate, thus reducing defects such as pitting and cracking in a deposit, enhancing deposition quality, and achieving fabrication of a micro-part by a synergistic action of both electrochemical energy and laser energy.

Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.

Abstract: A first resistivity value and a correlation function relating thickness of a conductive layer having the first resistivity value to a signal from an in-situ monitoring system are stored. A second resistivity value for a conductive layer on a substrate is received. A sequence of signal values that depend on thickness of the conductive layer is received from an in-situ electromagnetic induction monitoring system that monitors the substrate during polishing. A sequence of thickness values is generated based on the sequence of signal values and the correlation function. For at least some thickness values of the sequence of thickness values adjusted thickness values are generated that compensate for variation between the first resistivity value and the second resistivity value to generate a sequence of adjusted thickness values. A polishing endpoint is detected or an adjustment for a polishing parameter is determined based on the sequence of adjusted thickness values.

Abstract: A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modified reference trace represents measurements of a bare doped reference semiconductor wafer by an in-situ electromagnetic induction monitoring system as modified by a neutral network. The substrate is monitored with an in-situ electromagnetic induction monitoring system to generate a measured trace that depends on a thickness of the conductive layer, and at least a portion of the measured trace is applied to a neural network to generate a modified measured trace. An adjusted trace is generated, including subtracting the modified reference trace from the modified measured trace.

Abstract: A method of controlling polishing includes polishing a stack of adjacent conductive layers on a substrate, measuring with an in-situ eddy current monitoring system a sequence of characterizing values for the substrate during polishing, calculating a polishing rate from the sequence of characterizing values repeatedly during polishing, calculating one or more adjustments for one or more polishing parameters based on a current polishing rate using a first control algorithm for an initial time period, detecting a change in the polishing rate that indicates exposure of the underlying conductive layer, and calculating one or more adjustments for one or more polishing parameters based on the polishing rate using a different second control algorithm for a subsequent time period after detecting the change in the polishing rate.

Abstract: During polishing of a stack of adjacent conductive layers on a substrate, an in-situ eddy current monitoring system measures sequence of characterizing values. A polishing rate is repeatedly calculated from the sequence of characterizing values repeatedly, one or more adjustments for one or more polishing parameters are repeatedly calculated based on a current polishing rate using a first control algorithm for an initial time period, a change in the polishing rate that meets at least one first predetermined criterion that indicates exposure of the underlying conductive layer is detected, and one or more adjustments for one or more polishing parameters are calculated based on the polishing rate using a different second control algorithm for a subsequent time period after detecting the change in the polishing rate.

Abstract: During polishing of a stack of adjacent layers, a plurality of instances of a profile control algorithm are executed on a controller with different instances having different values for a control parameter. A first instance receives a sequence of characterizing values from an in-situ monitoring system during an initial time period to control a polishing parameter, and a second instance receives the sequence of characterizing values during the initial time period and a subsequent time period to control the polishing parameter. Exposure of the underlying layer is detected based on the sequence of characterizing values from the in-situ monitoring system.

Abstract: An apparatus for micromachining a semiconductor material from opposing sides through synchronous coordination of laser and electrochemistry includes an optical path system, a stable low-pressure jet generation system, and an electrolytic machining system. The optical path system includes a laser generator, a beam expander, a reflector, a galvanometer, and a lens. The electrolytic machining system includes a direct-current pulsed power supply, an adjustable cathode fixture, an electrolyte tank, a current probe, and an oscilloscope. The stable low-pressure jet generation system provides an electrolyte flow into a metal needle. The electrolyte flow forms an electrolyte layer between a semiconductor material and a cathode copper plate, such that the cathode and the anode are in electrical contact with each other. In a method employing the apparatus, a laser beam is irradiated onto the semiconductor material to form a local high-temperature region, which leads to a localized increase in electrical conductivity.

Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

Abstract: The present invention relates to a carbonate reservoir filtration-loss self-reducing acid fracturing method.

Abstract: Method and apparatus for automatically predicting lexical sememes using a lexical dictionary, comprising inputting a word, retrieving the word's semantic definition and sememes corresponding to the word from an online dictionary, setting each of the retrieved sememes as a candidate sememe, inputting the word's semantic definition and candidate sememe, and estimating the probability that the candidate sememe can be inferred from the word's semantic definition.

Abstract: The disclosure provides a nanolaser based on a depth-subwavelength graphene-dielectric hyperbolic dispersive cavity, comprising a pumping light source and the depth-subwavelength graphene-dielectric hyperbolic dispersive cavity; wherein the depth-subwavelength graphene-dielectric hyperbolic dispersive cavity is a spherical or hemispherical hyperbolic dispersive microcavity formed by alternately wrapping a dielectric core with graphene layers and dielectric layers.

Abstract: A device for insulating a cathode surface in electrochemical machining is provided. The cathode surface insulation device is characterized in that super-hydrophobic micro-structures are prepared in regions to be insulated on the cathode surface, so as to realize selective insulation of the surface of the tool cathode, and thereby achieve objects of constraining an electrical field in the processing area, reducing stray corrosion and side surface taper, and improving processing efficiency and accuracy.

Abstract: Provided is a fabrication method for a composite planar pH sensor modified by graphene film including: slotting into substrate, setting copper foil on both sides, and setting leads on the copper foil; coating graphene film on the copper foils using micro mechanical stripping method to form the first graphene film and the second graphene film; depositing Sb layer and Sb2O3 layer successively on the first graphene film by magnetron sputtering method, and coating Nafion™ perfluorinated sulfonic acid membrane on the Sb2O3 layer by spin-coating method to fabricate pH working electrode; depositing Ag layer on the second graphene film and dipping in FeCl3 solution to form AgCl layer; coating the third graphene film on the AgCl layer to fabricate reference electrode. The composite planar pH sensor modified by graphene film may be used in pH measurement for solid, semisolid, mash and solution samples.

Abstract: Techniques for exchanging compressed gradient data within a distributed system are disclosed. A set of gradients are computed at a first worker node of the distributed system using a neural network model and a set of weights associated with the neural network model. Each of the set of gradients having a value less than a threshold is clipped, resulting in non-clipped data elements and clipped data elements. A mapping indicating which of the set of gradients correspond to non-clipped data elements and which of the set of gradients correspond to clipped data elements is generated. Compressed data is generated based on the non-clipped data elements.

Abstract: A first resistivity value and a correlation function relating thickness of a conductive layer having the first resistivity value to a signal from an in-situ monitoring system are stored. A second resistivity value for a conductive layer on a substrate is received. A sequence of signal values that depend on thickness of the conductive layer is received from an in-situ electromagnetic induction monitoring system that monitors the substrate during polishing. A sequence of thickness values is generated based on the sequence of signal values and the correlation function. For at least some thickness values of the sequence of thickness values adjusted thickness values are generated that compensate for variation between the first resistivity value and the second resistivity value to generate a sequence of adjusted thickness values. A polishing endpoint is detected or an adjustment for a polishing parameter is determined based on the sequence of adjusted thickness values.