Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

Abstract: To generate sequential addresses when multiple integrated circuit (IC) devices are accessing the same memory, an address token is sent along the IC devices communicatively coupled in a ring topology. The address token is first transferred along the ring topology during a memory reservation phase in which each IC device can set a corresponding memory request bit to indicate that the IC device has data to write to the memory. The modified address token is then transferred along the ring topology again during a memory access phase. During the memory access phase, each IC device that has data to write can perform a memory write operation using a sequential address determined from the contents of the address token.

Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.

Abstract: A method of chemical mechanical polishing includes bringing a substrate having a conductive layer disposed over a semiconductor wafer into contact with a polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, determining a sequence of thickness values for the conductive layer based on the sequence of signal values, and at least partially compensating for a contribution of conductivity of the semiconductor wafer to the signal values.

Abstract: A body is brought into contact with a polishing pad of a polishing system, a polishing liquid is supplied to the polishing pad, relative motion between the body and the polishing pad is generated while the body contacts the polishing pad, a signal from an in-situ eddy current monitoring system during the relative motion while the body contacts the polishing pad, generating, and mechanical vibrations in the polishing system are detected based on a signal from the in-situ eddy current monitoring system.

Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

Abstract: To generate sequential addresses when multiple integrated circuit (IC) devices are accessing a memory region, an address token is sent along the IC devices communicatively coupled in a ring topology. The address token includes a data increment value for the memory region. When a device receives the address token, a memory write address is determined based on the data increment value and a base address corresponding to the memory region for the current write cycle. The IC device can perform a write operation using the memory write address if the device has data to write. The data increment value of the address token is then updated based on the number of data units being written in the current write cycle to the memory region by the IC device, and the updated address token is transmitted to the next IC device of the ring topology.

Abstract: An optical imaging lens, sequentially including at least one lens element and an optical ring element from an object side to an image side along an optical axis, is provided. The optical ring element is located on a side of the lens element closest to the image side and facing the image side, and has an object-side bearing surface facing the object side and in contact with the closest lens element. The object-side bearing surface has an object-side outer periphery and an object-side inner periphery, and the object-side inner periphery is located between the optical axis and the object-side outer periphery. The object-side bearing surface has at least one groove, and the at least one groove extends to the object-side inner periphery along a radial direction.

Abstract: Task-dependent analysis of various types of data graphs is provided, based at least on generation of a random graph based on node embeddings corresponding to a data graph, and a graph feature matrix corresponding to the data graph based on a distance between the random graph and the data graph.

Abstract: The present invention discloses a detection method, a system, an electronic equipment, and a storage medium of product test data, where the detection method includes: obtaining historical test data of historical batches of products; screening the historical test data to obtain intermediate test data; grouping the intermediate test data based on preset test parameters to obtain first groups; obtaining distribution patterns of the first groups based on the intermediate test data of the first groups; when the distribution pattern is a preset distribution pattern, using the first group corresponding to the distribution pattern as a target group; and obtaining a target test limit value based on the intermediate test data corresponding to the target group. In the present invention, the test limit value can be adjusted dynamically and adaptively, and chip test data with abnormal data can be effectively detected in real time, which improves test quality of the chip.

Abstract: An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.

Abstract: There is included a method and apparatus comprising computer code for a joint training method using neural networks with noise-robust losses comprising encoding input tokens from a noisy dataset into input vectors using an input encoder; predicting a label based on the input vectors using a classifier model; calculating a beta value based on the input vectors and the label using a label quality predictor model, wherein the beta value is instance-specific for each training instance; and j oint training more than one model using a first modified loss function based on the beta value and an entropy value.

Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

Abstract: A quasi-macroscopic cold field emission electron gun and a manufacturing method thereof are provided, which includes a filament device and an electron gun base, wherein the filament device includes a cold cathode filament and a conductive capillary tube, the cold cathode filament passes through one end of the conductive capillary tube and is crimped through a pressing groove device, the other end of the conductive capillary tube is connected to the electron gun base, and the end of the cold cathode filament is the electron emission end. Through the coaxial nesting and pressing deformation of quasi-macroscopic carbon fiber and metal tube and using of the non welding electrical connection method, this technology avoids the problem that it is not easy to form a reliable electrical connection during the welding process due to the poor wettability between carbon fiber and metal.

Abstract: An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.

Abstract: In one example, an apparatus comprises: a buffer memory; and a memory access circuit configured to: fetch, from a first memory, a set of first groups of data elements of a first matrix, each first group of data elements being stored at consecutive memory addresses at the first memory; based on a first configuration, store the set of first groups of data elements at consecutive memory addresses or at non-consecutive memory addresses at the buffer memory; based on a second configuration that defines a memory address offset, fetch a set of second groups of the data elements from the buffer memory, each second group of the data elements being stored at consecutive memory addresses of the buffer memory, each second group being separated by the memory address offset in the buffer memory; and store each fetched second group at consecutive addresses of a destination memory to form a second matrix.

Abstract: Data received from an in-situ monitoring system includes, for each scan of a sensor, a plurality of measured signal values for a plurality of different locations on a layer. A thickness of a polishing pad is determined based on the data from the in-situ monitoring system. For each scan, a portion of the measured signal values are adjusted based on the thickness of the polishing pad. For each scan of the plurality of scans and each location of the plurality of different locations, a value is generated representing a thickness of the layer at the location. This includes processing the adjusted signal values using one or more processors configured by machine learning. A polishing endpoint is detected or a polishing parameter is modified based on the values representing the thicknesses at the plurality of different locations.

Abstract: Method and apparatus for automatically predicting lexical sememes using a lexical dictionary, comprising inputting a word, retrieving the word's semantic definition and sememes corresponding to the word from an online dictionary, setting each of the retrieved sememes as a candidate sememe, inputting the word's semantic definition and candidate sememe, and estimating the probability that the candidate sememe can be inferred from the word's semantic definition.

Abstract: The embodiments of the present disclosure relate to antigens of ?-coronaviruses, preparation methods and uses thereof. The amino acid sequence of the antigen of the ?-coronavirus includes an amino acid sequence arranged in a (A-B)-(A-B) pattern or an amino acid sequence arranged in a (A-B)-C-(A-B) pattern or an amino acid sequence arranged in a (A-B)-(A-B?) pattern or an amino acid sequence arranged in a (A-B)-C-(A-B?) pattern. The antigen of the ?-coronavirus has a single-chain dimer structure. A single-chain dirtier expressed according to examples of the present disclosure is stable in content and has excellent immunogenicity as an antigen of a ?-coronavirus, and a vaccine prepared by using the single-chain dimer as an antigen of a ?-coronavirus can elicit high-titer neutralizing antibodies in mice.