Patents by Inventor Kun Xu

Kun Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12125124
    Abstract: In one example, an apparatus comprises: a buffer memory; and a memory access circuit configured to: fetch, from a first memory, a set of first groups of data elements of a first matrix, each first group of data elements being stored at consecutive memory addresses at the first memory; based on a first configuration, store the set of first groups of data elements at consecutive memory addresses or at non-consecutive memory addresses at the buffer memory; based on a second configuration that defines a memory address offset, fetch a set of second groups of the data elements from the buffer memory, each second group of the data elements being stored at consecutive memory addresses of the buffer memory, each second group being separated by the memory address offset in the buffer memory; and store each fetched second group at consecutive addresses of a destination memory to form a second matrix.
    Type: Grant
    Filed: March 7, 2023
    Date of Patent: October 22, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Kun Xu, Ron Diamant
  • Patent number: 12103135
    Abstract: An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: October 1, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Hassan G. Iravani, Kun Xu, Denis Ivanov, Shih-Haur Shen, Boguslaw A. Swedek
  • Patent number: 12090599
    Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.
    Type: Grant
    Filed: August 4, 2023
    Date of Patent: September 17, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Benjamin Cherian, Jun Qian, Kiran Lall Shrestha
  • Patent number: 12063220
    Abstract: A system and methods comprise a touchscreen at a premises. The touchscreen includes a processor coupled to a security system at the premises. User interfaces are presented via the touchscreen. The user interfaces include a security interface that provides control of functions of the security system and access to data collected by the security system, and a network interface that provides access to network devices. Network devices at the premises are coupled to the touchscreen. Application programming interfaces (APIs) are coupled to the processor and provide access to the plurality of network devices. A security server at a remote location is coupled to the touchscreen. The security server comprises a client interface through which remote client devices exchange data with the touchscreen and security system, a web application that accesses a first set of the APIs, and a server application that accesses a second set of the APIs.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: August 13, 2024
    Assignee: iControl Networks, Inc.
    Inventors: Paul Dawes, David Proft, Kun Xu, Micah Koch
  • Patent number: 12057354
    Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.
    Type: Grant
    Filed: May 22, 2023
    Date of Patent: August 6, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Kiran Lall Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian, Jun Qian, Harry Q. Lee
  • Publication number: 20240229283
    Abstract: A method used to repair a workpiece through a combination of laser and an electrochemical reaction is provided. A tool anode is arranged on the back side of the workpiece and is spaced therefrom. A laser beam is focused on an outer surface of the workpiece to realize localized repairing on the back side. The method realizes localized coating repairing on the back side of the workpiece through coordination between the thermal effect of the laser and the electrochemical deposition based on the characteristic of high thermal conductivity of the workpiece. The electrodeposition reaction does not occur in regions that do not need to be repaired. The operating process is simple, the cost of the plating solution is largely reduced, and the problem that the coating on the inner wall of the thin-walled workpiece is difficult to repair due to stripping is solved.
    Type: Application
    Filed: May 31, 2022
    Publication date: July 11, 2024
    Applicant: JIANGSU UNIVERSITY
    Inventors: Kun XU, Zhihao LENG, Yangfan TANG, Sheng GUO, Zhaoyang ZHANG, Hao ZHU, Yang LIU, Yucheng WU, Wenhui LIANG, Panzhou LI
  • Publication number: 20240218919
    Abstract: The present disclosure discloses an electric drive axle, comprising a driving assembly, a power coupling gear, a first gear transmission assembly, a second gear transmission assembly and two half shafts connected by a differential, the driving assembly is used to drive the differential. In the above way, the electric drive axle and the electric vehicle provided according to the present disclosure realize 3 shifting speeds, and can timely engage in different speeds according to the vehicle load, road conditions, transportation time requirements, etc., so as to realize the efficient operation of the vehicle, improve the operation efficiency, reduce energy consumption, meet the power demand of commercial vehicles with diverse loads and working conditions, and obtain high transportation efficiency and economic benefits.
    Type: Application
    Filed: June 7, 2022
    Publication date: July 4, 2024
    Inventors: Shan LI, Yueyue DENG, Jing DENG, Hongxiang YAN, Kun XU, Rongyue LIU, Hongbo WANG
  • Publication number: 20240173395
    Abstract: Provided in the present disclosure are a Zika/dengue vaccine and its application thereof. The present disclosure introduces a mutation into the E-protein FL fusion region of the Zika virus or dengue virus. Antigens with said mutations are unable to bind to antibodies that causes ADE. After immunization with the vaccine of the present disclosure acquired from the said antigens, production of FL epitope-induced antibodies can be prevented, thereby reducing or eliminating the ADE effect.
    Type: Application
    Filed: November 9, 2020
    Publication date: May 30, 2024
    Applicant: Institute of Microbiology, Chinese Academy of Sciences
    Inventors: Fu GAO, Lianpan DAI, Jinghua YAN, Kun XU, Yuxuan HAN, Qihui WANG, Qingrui HUANG, Jinhe LI
  • Publication number: 20240165768
    Abstract: An apparatus for processing a substrate, the apparatus comprising a polishing assembly and a controller. The polishing assembly is configured to (a) polish a surface of the substrate. The controller is configured to (b) detect a first substrate measurement corresponding to a first region of the substrate, (c) detect a second substrate measurement corresponding to a second region of the substrate; (d) determine a difference between the first substrate measurement at the first region and the second substrate measurement at the second region; stop the polishing of the surface of the substrate in response to a determination that the difference between the first substrate measurement and the second substrate measurement is within a tolerance threshold; and repeat (a)-(d) in response to a determination that the difference between the first substrate measurement and the second substrate measurement is outside of the tolerance threshold.
    Type: Application
    Filed: November 18, 2022
    Publication date: May 23, 2024
    Inventors: Kun XU, Harry Q. LEE
  • Patent number: 11983128
    Abstract: Techniques to reduce overhead in a direct memory access (DMA) engine can include processing descriptors from a descriptor queue to obtain a striding configuration to generate tensorized memory descriptors. The striding configuration can include, for each striding dimension, a stride and a repetition number indicating a number of times to repeat striding in the corresponding striding dimension. One or more sets of tensorized memory descriptors can be generated based on the striding configuration. Data transfers are then performed based on the generated tensorized memory descriptors.
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: May 14, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Kun Xu, Ron Diamant, Ilya Minkin, Mohammad El-Shabani, Raymond S. Whiteside, Uday Shilton Udayaselvam
  • Patent number: 11966389
    Abstract: A method (and structure and computer product) of machine translation for processing input questions includes receiving, in a processor on a computer, an input question presented in a natural language. The input question is preprocessed to find one or more condition values for possible Structured Query Language (SQL) queries. One or more possible SQL queries are enumerated based on the one or more found condition values and a paraphrasing model is used to rank the enumerated SQL queries. The highest ranked SQL query is executed against a relational database to search for a response to the input question.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: April 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Vadim Sheinin, Zhiguo Wang, Lingfei Wu, Kun Xu
  • Publication number: 20240123565
    Abstract: A method of chemical mechanical polishing includes bringing a conductive layer of a substrate into contact with a polishing pad, supplying a polishing liquid to the polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, and determining a sequence of thickness values for the conductive layer based on the sequence of signal values. Determining the sequence of thickness values includes at least partially compensating for a contribution of the polishing liquid to the signal values.
    Type: Application
    Filed: August 31, 2023
    Publication date: April 18, 2024
    Inventors: Kun Xu, Andrew Siordia
  • Publication number: 20240116152
    Abstract: A method of controlling polishing includes polishing a stack of adjacent conductive layers on a substrate, measuring with an in-situ eddy current monitoring system a sequence of characterizing values for the substrate during polishing, calculating a polishing rate from the sequence of characterizing values repeatedly during polishing, calculating one or more adjustments for one or more polishing parameters based on a current polishing rate using a first control algorithm for an initial time period, detecting a change in the polishing rate that indicates exposure of the underlying conductive layer, and calculating one or more adjustments for one or more polishing parameters based on the polishing rate using a different second control algorithm for a subsequent time period after detecting the change in the polishing rate.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: Kun Xu, Harry Q. Lee, Benjamin Cherian, David Maxwell Gage
  • Patent number: 11932650
    Abstract: The present disclosure relates to derivatized agelastatin compounds and methods for the treatment, prevention, or delay of cancer, comprising administering a therapeutically effect amount of the derivatized agelastatin compounds, a pharmaceutically acceptable salt thereof, or a composition thereof to a subject in need thereof. Methods for making the derivatized agelastatin compounds are also provided.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: March 19, 2024
    Assignees: Massachusetts Institute of Technology, Tufts Medical Center, Inc.
    Inventors: Mohammad Movassaghi, Alyssa H. Antropow, Rachel J. Buchsbaum, Kun Xu
  • Publication number: 20240026747
    Abstract: A coring and sampling integrated sub, including an integrally formed base body, a probe module, a coring module and a hydraulic module. The probe module, the coring module and the hydraulic module are all mounted on the base body. The hydraulic module, the probe module and the coring module are sequentially arranged from top to bottom. An output end of the hydraulic module is configured to be connected to the probe module and the coring module, respectively. The hydraulic module is configured to provide telescopic power for the probe module, and provide power for movement, flipping, and pushing of the coring module. Also disclosed is a downhole instrument including the coring and sampling integrated sub.
    Type: Application
    Filed: October 29, 2021
    Publication date: January 25, 2024
    Applicant: CHINA OILFIELD SERVICES LIMITED
    Inventors: Yongren FENG, Tao LU, Lin HUANG, Shusheng GUO, Xiaodong CHU, Kun XU, Tiemin LIU, Yongchao CHEN, Yongzeng XUE, Xinhuo WENG, Guoqiang ZHANG, Suogui SHANG, Yang SHEN, Ya JIN
  • Publication number: 20240014080
    Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.
    Type: Application
    Filed: September 21, 2023
    Publication date: January 11, 2024
    Inventors: Kun Xu, Kiran Lall Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian, Jun Qian, Harry Q. Lee
  • Patent number: 11868872
    Abstract: In one example, an apparatus comprises: a direct memory access (DMA) descriptor queue that stores DMA descriptors, each DMA descriptor including an indirect address; an address translation table that stores an address mapping between indirect addresses and physical addresses; and a DMA engine configured to: fetch a DMA descriptor from the DMA descriptor queue to the address translation table to translate a first indirect address of the DMA descriptor to a first physical address based on the address mapping, and perform a DMA operation based on executing the DMA descriptor to transfer data to or from the first physical address.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: January 9, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Ilya Minkin, Ron Diamant, Kun Xu
  • Patent number: 11865664
    Abstract: During polishing of a stack of adjacent layers, a plurality of instances of a profile control algorithm are executed on a controller with different instances having different values for a control parameter. A first instance receives a sequence of characterizing values from an in-situ monitoring system during an initial time period to control a polishing parameter, and a second instance receives the sequence of characterizing values during the initial time period and a subsequent time period to control the polishing parameter. Exposure of the underlying layer is detected based on the sequence of characterizing values from the in-situ monitoring system.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: January 9, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Harry Q. Lee, Benjamin Cherian, David Maxwell Gage
  • Patent number: 11850699
    Abstract: A method of controlling polishing includes polishing a stack of adjacent conductive layers on a substrate, measuring with an in-situ eddy current monitoring system a sequence of characterizing values for the substrate during polishing, calculating a polishing rate from the sequence of characterizing values repeatedly during polishing, calculating one or more adjustments for one or more polishing parameters based on a current polishing rate using a first control algorithm for an initial time period, detecting a change in the polishing rate that indicates exposure of the underlying conductive layer, and calculating one or more adjustments for one or more polishing parameters based on the polishing rate using a different second control algorithm for a subsequent time period after detecting the change in the polishing rate.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: December 26, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Harry Q. Lee, Benjamin Cherian, David Maxwell Gage
  • Patent number: D1036872
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: July 30, 2024
    Assignee: Shenzhen Easehold Technology Co., Ltd.
    Inventors: Kun Xu, Meihong Peng