Patents by Inventor Kun Yu

Kun Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6488875
    Abstract: A method of manufacturing no-stick multi-color incense is to mix wood powder and an adhesive in powder form evenly and then the mixture is added into a liquid containing pigment and fragrance, stirred into a one-color glutinous paste and compressed into a single-color chunk by machines. The same procedures above-mentioned are repeated several times to obtain chunks with different colors. These mono-color chunks are cut into small cubes. The cubes are mixed together, piled on top of each other with different colors and then extruded by extruding machine to form incense with multiple colors. After drying, no-stick multi-color incense is obtained.
    Type: Grant
    Filed: July 6, 2000
    Date of Patent: December 3, 2002
    Inventor: Kun-Yu Lin
  • Patent number: 6365455
    Abstract: An EPROM cell and a method that includes a gate structure having a sidewall spacer. The sidewall spacer is made by way of an amorphous or polycrystalline silicon layer, which is converted into an insulating layer such as silicon dioxide. Deposition of the amorphous or polycrystalline silicon layer is more accurate and produces a more uniform layer than conventional dielectric layer deposition.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: April 2, 2002
    Assignee: Mosel Vitelic, Inc.
    Inventors: Wen-Doe Su, Thomas Chang, Kuo-Tung Sung, Mao Song Tseng, Shih-Chi Lai, Kun-Yu Sung, Liang-Chen Lin
  • Patent number: 6117755
    Abstract: A method for planarizing the interface of polysilicon and silicide in a polycide structure is presented in this invention. It is by regulating the process temperature when depositing polysilicon to meanwhile improve its planarization. At first, a doped polysilicon layer is deposited on a semiconductor substrate in the integrated circuits, then immediately after the deposition of an undoped polysilicon, the process temperature is reduced and the treatment of purging is followed with, finally, a metal silicide is formed on the undoped polysilcion.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: September 12, 2000
    Assignee: Mosel Vitelic Inc.
    Inventors: Sung Kun-Yu, Chien-Hung Chen, Yi-Fu Chung, Kuang-Chao Chen
  • Patent number: 6075167
    Abstract: This invention relates to a method for preparing cycloaliphatic diamines by hydrogenating aromatic diamines in the presence of a supported ruthenium catalyst and a metal nitrite as a catalyst promoter to increase the rate of the hydrogenation reaction and decrease the amount of higher boiler by-products.
    Type: Grant
    Filed: September 25, 1998
    Date of Patent: June 13, 2000
    Assignee: Korea Institute of Science and Technology
    Inventors: Hoon Sik Kim, Kun Yu Park, Young Soo Kwon, Moon Jo Chung, Byung Gwon Lee
  • Patent number: 5273788
    Abstract: A layer of a hydrocarbon molecule is applied to a substrate by the Langmuir-Blodgett technique, and the surface is irradiated with a laser to decompose the layer of molecules at the surface without influencing the substrate. After decomposition the carbon atoms rearrange on the surface of the substrate to form a DLC film. The method of the invention may also be used to form other film, using a suitable molecule to produce the LB layer before irradiation.
    Type: Grant
    Filed: July 20, 1992
    Date of Patent: December 28, 1993
    Assignee: The University of Utah
    Inventor: Bing-Kun Yu