Abstract: A task allocation time decision unit inputs a period of each of the tasks and a load factor of each of the tasks with respect to execution time of all tasks from a task context memory unit, and decides the task allocation time. A task occasion frequency computation unit computes a task occasion frequency. An execution time ratio computation unit computes an execution time ratio of each task with respect to a execution time of a certain task. A schedulability condition computation unit computes a conditional expression for enabling scheduling on the basis of the period. A task allocation time decision unit computes a task allocation time for enabling scheduling from the conditional expression and the execution time ratio and outputs the resultant task allocation time to a task allocation time display unit.

Abstract: An internal combustion engine includes a heat accumulator to accumulate heat from a heat medium, a heat supplier to supply the heat medium accumulated in the heat accumulator to the internal combustion engine, and plural inlets to introduce the heat medium supplied by the heat supplier to each cylinder of the internal combustion engine. Differences in temperature among the cylinders are decreased since the warmed heat medium flows into each cylinder directly.

Abstract: An electronic control unit (ECU) of an engine system starts a control (preheat) that supplies heat reserving hot water stored in a heat accumulating device to an engine prior to an engine start. The ECU determines a time that continues the preheat on the basis of a cooling water temperature of the engine so as to execute the engine start after a warming-up of the engine is reliably finished. Further, during the execution of the preheat, a lighting lamp is turned on, and that incidence is recognized to a driver. When the preheat is completed, the ECU automatically starts the engine.

Abstract: A superconducting Josephson junction element including a first, a-axis oriented, superconductive metal oxide crystal grain having a first area of a {001} plane, and a second, c-axis oriented, superconductive metal oxide crystal grain having a second area of a {110} plane, wherein the first and second crystal grains are in contact with each other at the first and second areas to form a grain boundary therebetween.

Abstract: The present invention is directed to a method for growing a superconductive film on a superconductive substrate in order to produce a bulk single crystal. According to a preferred embodiment, an oxide superconductive film of a material which is the same or similar to the substrate material is epitaxially grown at a temperature between 450.degree. C. and 800.degree. C. so that the film and substrate have the same lattice orientations. According to the present invention, problems associated with conventional films having non-superconductor substrates (e.g., MgO and SrTiO.sub.3) are avoided.

Abstract: An oxide superconductor thin film of Y.sub.1.+-..alpha. Ba.sub.2.+-..beta. Cu.sub.3.+-..gamma. O.sub.7-.delta. with a smooth surface having a low density of particles being generated without decreasing superconductivity is produced by the steps of applying a pulsed laser beam to the target formed of an oxide material having an apparent density of 95% or more, substantially composed of Y.sub.1.+-..alpha. Ba.sub.2.+-..beta. Cu.sub.3.+-..gamma. O.sub.7-.delta., which is obtained from a molded body of an amorphous powder by subjecting it to partial melting, followed by gradual cooling, depositing and accumulating an irradiated and evaporated oxide material of the target on a substrate.

Abstract: An electronic circuit comprising a circuit substrate with electronic circuit elements bonded onto the circuit substrate with gaps between the circuit substrate and the respective electronic circuit elements has thermal conductive layers comprising an oxidatively curable resin filled into the gaps. The thermal conductive layers are produced by filling a varnish comprising an oxidatively curable resin into the gaps and exhibit excellent moist heat resistance and thermal conductive properties. The electronic circuit elements once mounted on the circuit substrate can easily be removed as required by releasing the bonding between the elements and the substrate.