Patents by Inventor Kunihiko Hayashi

Kunihiko Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050158896
    Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.
    Type: Application
    Filed: March 14, 2005
    Publication date: July 21, 2005
    Inventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
  • Publication number: 20050158894
    Abstract: Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an array direction of the light emitting devices into long-sized line-shaped device substrates. The line-shaped device substrates are arrayed on a second substrate such that the line-shaped device substrates are enlargedly spaced from each other. The line-shaped device substrates divided from the second substrate are arrayed on a third substrate such as to be enlargedly spaced from each other.
    Type: Application
    Filed: March 10, 2005
    Publication date: July 21, 2005
    Inventors: Hisashi Ohba, Kunihiko Hayashi
  • Publication number: 20050155699
    Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.
    Type: Application
    Filed: December 22, 2004
    Publication date: July 21, 2005
    Inventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
  • Publication number: 20050158895
    Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.
    Type: Application
    Filed: March 14, 2005
    Publication date: July 21, 2005
    Inventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
  • Patent number: 6901454
    Abstract: A circuit group control system which receives from a master processor a first command sequence and a second command sequence each of which is composed of a plurality of commands, each command being to be executed by one of a plurality of circuits, and causes any available circuits to execute the commands one by one in order of arrangement in each command sequence. The circuit group control system achieves concurrent execution of a plurality of command sequences by causing a circuit (a second circuit) to execute a command in the second command sequence while another circuit (a first circuit) is executing another command in the first command sequence.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: May 31, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuo Higaki, Tetsuya Tanaka, Kunihiko Hayashi, Hiroshi Kadota, Tokuzo Kiyohara, Kozo Kimura, Hideshi Nishida
  • Patent number: 6892450
    Abstract: Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an array direction of the light emitting devices into long-sized line-shaped device substrates. The line-shaped device substrates are arrayed on a second substrate such that the line-shaped device substrates are enlargedly spaced from each other. The line-shaped device substrates divided from the second substrate are arrayed on a third substrate such as to be enlargedly spaced from each other.
    Type: Grant
    Filed: August 5, 2002
    Date of Patent: May 17, 2005
    Assignee: Sony Corporation
    Inventors: Hisashi Ohba, Kunihiko Hayashi
  • Publication number: 20050102440
    Abstract: A circuit group control system which receives from a master processor a first command sequence and a second command sequence each of which is composed of a plurality of commands, each command being to be executed by one of a plurality of circuits, and causes any available circuits to execute the commands one by one in order of arrangement in each command sequence. The circuit group control system achieves concurrent execution of a plurality of command sequences by causing a circuit (a second circuit) to execute a command in the second command sequence while another circuit (a first circuit) is executing another command in the first command sequence.
    Type: Application
    Filed: December 8, 2004
    Publication date: May 12, 2005
    Inventors: Nobuo Higaki, Tetsuya Tanaka, Kunihiko Hayashi, Hiroshi Kadota, Tokuzo Kiyohara, Kozo Kimura
  • Publication number: 20050083437
    Abstract: In synchronization of a conventional AV system, when a stream as the master stops, a system clock cannot be corrected for synchronization. Since the correction is consistently performed even when an error is small, overhead of correction is large. On the other hand, when an error is large, sharp correction causes a feeling that something wrong. In the present invention, when the stream as the master stops, previously registering the degree of priority regarding the master, consideration of a corrected period or a previous error for the system clock, or transmitting a stream containing information regarding the master can allow for other process to serves as the master. Accordingly, it is possible to provide a method for synchronization with maintaining correction of the system clock. When a corrected error is large, gradual correction or reference can provide a system with normal feeling.
    Type: Application
    Filed: May 18, 2004
    Publication date: April 21, 2005
    Inventors: Kazuyuki Uchida, Kengo Nishimura, Akihiro Miyazaki, Jyunichi Nakahashi, Kunihiko Hayashi, Satoshi Ikawa
  • Patent number: 6872635
    Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: March 29, 2005
    Assignee: Sony Corporation
    Inventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
  • Publication number: 20040181791
    Abstract: In the case of assigning task management blocks 210 and 220 for the first type tasks to time slot information 110 and 120 one by one, assigning a plurality of task management blocks 200, 201 and 202 for the second type tasks to time slot information 100 many versus one, selecting a task management block according to the priority when switching to the time slot of the time slot information 100, and switching to the time slot except the time slot information 100, a task switching apparatus of the present invention selects the task management block assigned to the time slot and executes the task.
    Type: Application
    Filed: March 10, 2004
    Publication date: September 16, 2004
    Inventor: Kunihiko Hayashi
  • Publication number: 20040144080
    Abstract: An exhaust emission control system for a vehicle including a primary engine and a secondary engine having a displacement smaller than that of the primary engine is provided with an exhaust passage having a junction portion at which exhaust gas discharged from the primary engine and exhaust gas discharged from the secondary engine join together, and an exhaust emission purifying device that purifies the exhaust gas joined at the junction portion in the exhaust passage.
    Type: Application
    Filed: January 16, 2004
    Publication date: July 29, 2004
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Makoto Suzuki, Kunihiko Hayashi
  • Publication number: 20040054998
    Abstract: Provided is a program execution apparatus that appropriately determines an execution sequence of tasks each given a target completion time before which execution of the task is to be completed, and executes the tasks according to the determined execution sequence. For each task a plurality of types of priorities having a hierarchical relationship among them are set. The apparatus includes: a storing unit that stores an identifier of each task that is already in existence, at a memory position therein determined based upon a plurality of types of priorities set for each task; a receiving unit that receives an identifier of a new task, and a plurality of types of priorities set for the new task; and a writing unit that writes the received identifier at a memory position in the storing unit determined based upon the received plurality of types of priorities.
    Type: Application
    Filed: July 17, 2003
    Publication date: March 18, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventor: Kunihiko Hayashi
  • Patent number: 6660312
    Abstract: Disclosed herein is a method for producing an oil-in-water emulsified food having an egg yolk content as calculated in terms of raw egg yolk of 2.8% or more, a content of cholesterol derived from egg yolk of 7×10−4% or more, and a total cholesterol content of less than 6×10−3%. This method comprises the steps of subjecting an egg yolk fluid to enzymatic processing, thereby converting phospholipids contained in the egg yolk into lysophospholipids; subjecting the enzymatically processed egg yolk to processing for reducing cholesterol, thereby obtaining processed dry egg yolk retaining at least 0.1% of cholesterol; and mixing the processed dry egg yolk with other ingredients in an amount of at least 0.7% of all the ingredients used. The product obtained by this method has a significantly reduced cholesterol content although its egg yolk content is high. Further, this product is excellent in emulsion stability and thus scarcely undergoes separation during storage.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: December 9, 2003
    Assignee: Kewpie Kabushiki Kaisha
    Inventors: Masao Tobita, Kunihiko Hayashi, Masahiro Goto, Mari Yamada, Yuji Ogino, Satoshi Teraoka
  • Patent number: 6629512
    Abstract: An electronic control unit (ECU) of an engine system starts a control (preheat) that supplies heat reserving hot water stored in a heat accumulating device to an engine prior to an engine start. The ECU determines a time that continues the preheat on the basis of a cooling water temperature of the engine so as to execute the engine start after a warming-up of the engine is reliably finished. Further, during the execution of the preheat, a lighting lamp is turned on, and that incidence is recognized to a driver. When the preheat is completed, the ECU automatically starts the engine.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: October 7, 2003
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Kazuki Iwatani, Makoto Suzuki, Katuhiko Arisawa, Masakazu Tabata, Kunihiko Hayashi
  • Publication number: 20030162463
    Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is disclosed. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer is heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.
    Type: Application
    Filed: February 10, 2003
    Publication date: August 28, 2003
    Inventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
  • Publication number: 20030149864
    Abstract: A processor for sequentially executing a plurality of programs using a plurality of register value groups stored in a memory that correspond one-to-one with the programs.
    Type: Application
    Filed: January 8, 2003
    Publication date: August 7, 2003
    Inventors: Kazuya Furukawa, Tetsuya Tanaka, Nobuo Higaki, Kunihiko Hayashi, Hiroshi Kadota, Tokuzo Kiyohara, Kozo Kimura, Hideshi Nishida, Kazushi Kurata, Shigeki Fujii, Toshio Sugimura
  • Publication number: 20030110329
    Abstract: A circuit group control system which receives from a master processor a first command sequence and a second command sequence each of which is composed of a plurality of commands, each command being to be executed by one of a plurality of circuits, and causes any available circuits to execute the commands one by one in order of arrangement in each command sequence. The circuit group control system achieves concurrent execution of a plurality of command sequences by causing a circuit (a second circuit) to execute a command in the second command sequence while another circuit (a first circuit) is executing another command in the first command sequence.
    Type: Application
    Filed: November 7, 2002
    Publication date: June 12, 2003
    Inventors: Nobuo Higaki, Tetsuya Tanaka, Kunihiko Hayashi, Hiroshi Kadota, Tokuzo Kiyohara, Kozo Kimura, Hideshi Nishida
  • Publication number: 20030070274
    Abstract: Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an array direction of the light emitting devices into long-sized line-shaped device substrates. The line-shaped device substrates are arrayed on a second substrate such that the line-shaped device substrates are enlargedly spaced from each other. The line-shaped device substrates divided from the second substrate are arrayed on a third substrate such as to be enlargedly spaced from each other.
    Type: Application
    Filed: August 5, 2002
    Publication date: April 17, 2003
    Inventors: Hisashi Ohba, Kunihiko Hayashi
  • Publication number: 20030044507
    Abstract: Disclosed herein is a method for producing an oil-in-water emulsified food having an egg yolk content as calculated in terms of raw egg yolk of 2.8% or more, a content of cholesterol derived from egg yolk of 7×10−4% or more, and a total cholesterol content of less than 6×10−3%. This method comprises the steps of subjecting an egg yolk fluid to enzymatic processing, thereby converting phospholipids contained in the egg yolk into lysophospholipids; subjecting the enzymatically processed egg yolk to processing for reducing cholesterol, thereby obtaining processed dry egg yolk retaining at least 0.1% of cholesterol; and mixing the processed dry egg yolk with other ingredients in an amount of at least 0.7% of all the ingredients used. The product obtained by this method has a significantly reduced cholesterol content although its egg yolk content is high. Further, this product is excellent in emulsion stability and thus scarcely undergoes separation during storage.
    Type: Application
    Filed: April 19, 2002
    Publication date: March 6, 2003
    Applicant: KEWPIE KABUSHIKI KAISHA
    Inventors: Masao Tobita, Kunihiko Hayashi, Masahiro Goto, Mari Yamada, Yuji Ogino, Satoshi Teraoka
  • Publication number: 20030034120
    Abstract: A device transferring method and a device arraying method are provided for readily transferring a number of devices from a first substrate to a second substrate such that the devices are enlargedly spaced from each other with a pitch larger than an array pitch of the devices arrayed on the first substrate.
    Type: Application
    Filed: July 31, 2002
    Publication date: February 20, 2003
    Inventors: Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Masaru Minami, Kunihiko Hayashi