Abstract: Compounds of the general formula (I) or salts thereof and activators of PPAR&dgr; (peroxisome proliferator activated receptor &dgr;) containing the compounds or the salts as the active ingredient: wherein R1 and R2 each are hydrogen, C1-8 alkyl, an aryl or heterocyclic group which may be substituted, or the like; A is oxygen, sulfur, or the like; X1 and X2 are each a free valency, oxygen, S(O)p (wherein p is an integer of 0 to 2), C(═O), C(═O)NH, NHC(═O), CH═CH, or the like; Y is optionally substituted C1-8 alkylene; Z is oxygen or sulfur; R3 and R4 are each optionally substituted C1-8 alkyl; and R8 is hydrogen or C1-8 alkyl, with the proviso that when X1 is a free valency, X2 is not O or S(O)p, while when X1 is C(═O)NH, X2 is not a free valency.

Abstract: Compounds of the general formula (I) or salts thereof and activators of PPAR&dgr; (peroxisome proliferator activated receptor &dgr;) containing the compounds or the salts as the active ingredient: wherein R1 and R2 each are hydrogen, C1-8 alkyl, an aryl or heterocyclic group which may be substituted, or the like; A is oxygen, sulfur, or the like; X1 and X2 are each a free valency, oxygen, S(O)p (wherein p is an integer of 0 to 2), C(═O), C(═O)NH, NHC(═O), CH═CH, or the like; Y is optionally substituted C1-8 alkylene; Z is oxygen or sulfur; R3 and R4 are each optionally substituted C1-8 alkyl; and R8 is hydrogen or C1-8 alkyl, with the proviso that when X1 is a free valency, X2 is not O or S(O)p, while when X1 is C(═O)NH, X2 is not a free valency.

Abstract: In an apparatus for calculating m-multiplication of a rational point over an elliptic curve defined over a finite field, a base-&phgr; expansion part calculates c0, c1, . . .

Abstract: Numbers 1, 2, . . . , M are assigned to bidding prices from the minimum to maximum values V1 to VN. For a bidding value Vvi each user 11-i generates two sequences of information si={si,1, si,2, . . . , si,M} and ti={ti,1, ti,2, . . . , ti,M} such that si,1=ti,1, . . . , si,vi−1, si,vi≠ti,vi, . . . , si,M≠ti,M, then secretly sends the two sequences of information si and ti to quantitative competition apparatuses 15A and 15B, respectively, and sends hash values H1i=h(si) and H2i=h(ti) of the two sequences of information si and ti and a hash value h(Vvi∥ri) containing an intended value Vvi to a bulletin board apparatus 21.

Abstract: There are described contact terminals which enable stable measurement of electrical characteristics of semiconductor devices. A heat-resistant insulating film having a plurality of apertures formed therein is sandwiched between an upper metal mold and a lower metal mold. The upper and lower metal molds are positioned, and conductive resin is poured into the cavity defined between the upper and lower metal molds, thereby producing a plurality of contact terminals. After removal of the upper and lower metal molds, there is produced a heat-resistant film having a plurality of contact terminals formed thereon.

Abstract: There are described contact terminals which enable stable measurement of electrical characteristics of semiconductor devices. A heat-resistant insulating film having a plurality of apertures formed therein is sandwiched between an upper metal mold and a lower metal mold. The upper and lower metal molds are positioned, and conductive resin is poured into the cavity defined between the upper and lower metal molds, thereby producing a plurality of contact terminals. After removal of the upper and lower metal molds, there is produced a heat-resistant film having a plurality of contact terminals formed thereon.

Abstract: A transporting apparatus used in testing a plurality of semiconductor devices includes a magazine in which a plurality of pallets are stacked in plural stages, each pallet with a plurality of semiconductor device placed thereon; a distributing stocker mechanism for placing the plurality of pallets in the magazine onto a carrier; a carrier transporting mechanism for transporting the carrier into a test station in a constant temperature room and transporting the carrier after to outside the constant temperature room; and a recovery stocker mechanism for recovering the plurality of pallets after test on the carrier into the magazine. Thus, the transporting apparatus with high installing area efficiency and high test efficiency can be fabricated at low production cost.

Abstract: A process for preparation of 2-(10,11-dihydro-10-oxodibenzo[b,f]thiepin-2-yl)propionic acid (i.e., Zaltoprofen) is performed by subjecting 2-(4-amino-3-carboxy-methylphenyl)propionic acid or its salt to diazotization and subsequent reaction with thiophenol to produce 2-(3-carboxymethyl-4-phenylthiophenyl)propionic acid or its salt, and subjecting the product to cyclization reaction. Other related processes and related compounds are also disclosed.

Abstract: A semiconductor device socket prevents adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. A positioning base of the socket supports external leads of the semiconductor device such that the lead ends of the leads do not contact a body of the socket. Movable contact terminals of the socket disposed opposite the external leads can move into and out of contact with the external leads.

Abstract: A semiconductor device test socket for connecting an external circuit to external leads of a semiconductor device to permit testing of the semiconductor device includes a body having a positioning base for supporting roots of external leads of a semiconductor device to be tested. A plurality of movable contact terminals are supported by the body and disposed opposite to the external leads of the semiconductor device when the semiconductor device is supported by the positioning base. The contact terminals are movable between a first position electrically contacting the external leads and a second position spaced from the external leads. The contact terminals are configured so as to be moved to their second positions when a conveyance tool for supporting the semiconductor device to be tested is moved towards the test socket and pressed against the contact terminals, and so as to move to their first positions when the conveyance tool is moved away from the test socket out of contact with the contact terminals.

Abstract: A semiconductor device socket preventing adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. In the semiconductor device socket, a positioning base supports a shoulder of each of external leads extending from the semiconductor device without contacting the base and the contact portion of each of the movable contact terminals makes electrical contact with the shoulder of the corresponding external lead. The movable contact terminals are disposed opposite to the external leads outside of the positioning base and are opened and closed as a movable cover is moved relative to the base.

Abstract: A socket has a base (10) that is to be fixed on a printed wiring substrate (not shown in the drawings) and a cover (12), in the shape of a square frame, that is reciprocably movable in the vertical direction relative to base (10). An adaptor (20) is fixed to the center of base (10) by means of bolts (22) and an elevator carrier (24) is mounted on adaptor (20) in such a manner as to move among first, second and third vertically disposed positions in dependence upon movement of the cover (12). A large number of contact elements (26) are arranged in a pattern corresponding to the lead terminal pattern of an IC package for loading in the socket. Above each contact row, there is provided a linkage mechanism (32, 36) including a laterally extending bar (36a) movable toward and away from contact elements (26) in dependence upon the vertical movement of the cover (12).

Abstract: A tape carrier includes an elongated electrically insulating tape divided into a plurality of separable tape sections. A semiconductor chip is mounted at each of a plurality of semiconductor device mounting portions having a plurality of leads on each of the tape sections. The semiconductor chips are connected to the respective leads. A plurality of testing connection terminals on each of the tape sections are connected to respective testing connection terminals by testing wires.

Abstract: A mobile communication apparatus is provided, in which the linearity during a small output power of a radio-frequency power amplifier can be maintained as during a large output power. The input signal power to a radio-frequency power amplifier is decreased by an attenuator during a small power output. The resulting downward trend of the transmission signal power is compensated for by increasing the gain of the radio-frequency amplifier circuit through a transmission power control circuit. Under this condition, the radio-frequency power amplifier is made operable in a linear region of the transistor in the same manner as during a large power output. As a result, the linearity of the amplifier is guaranteed over the whole operating range of the transmission power.

Abstract: A method of manufacturing semiconductor devices includes accommodating the semiconductor devices in the form of semimanufactures in accomodating tools having uniform outer dimensions regardless of the type of the semiconductor devices; receiving the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices while maintaining the semiconductor devices in the accomodating tools; and processing the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices.

Abstract: A tape carrier includes an elongated electrically insulating tape divided into a plurality of separable tape sections. A semiconductor chip is mounted at each of a plurality of semiconductor device mounting portions having a plurality of leads on each of the tape sections. The semiconductor chips are connected to the respective leads. A plurality of testing connection terminals on each of the tape sections are connected to respective testing connection terminals by testing wires.

Abstract: A semiconductor device socket preventing adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. In the semiconductor device socket, a positioning base supports a shoulder of each of external leads extending from the semiconductor device without contacting the base and the contact portion of each of the movable contact terminals makes electrical contact with the shoulder of the corresponding external lead. The movable contact terminals are disposed opposite to the external leads outside of the positioning base and are opened and closed as a movable cover is moved relative to the base.

Abstract: An apparatus for controlling the fermentation of moromi mash comprises a sampling mechanism for sampling a portion of the prescribed amount of moromi mash stored in at least one storage tank, and an automatic multiple analyzer for receiving the portion of the prescribed amount of moromi mash from the sampling mechanism and simultaneously analyzing the concentrations of at least two ingredients of the sampled portion of the moromi mash.

Abstract: A delay circuit for use in an electric blasting system including a capacitor for storing electric energy supplied from an electric blaster, an actuation circuit for detecting the stop of voltage supply from the blaster to generate an actuation signal, a circuit for generating clock pulses, a circuit for counting a predetermined number of clock pulses in response to the actuation signal to generate an igniting signal, and a switching circuit for responding to the igniting signal to discharge the electric energy stored in the capacitor through an igniting resistor, the actuation circuit having a zener diode with a threshold voltage. When the voltage supply from the blaster is stopped and the voltage across the zener diode becomes lower than the threshold voltage, the zener diode is cut-off to generate the actuation signal.