Abstract: A vehicle can include a horn able to produce an effective sound volume. The vehicle can be a motorcycle. The horn of the motorcycle can be positioned relative to parts of the motorcycle in such a way that an effective sound volume can be produced by the horn, while obstruction by the horn of cooling airflow is reduced or eliminated. In particular, at least a part of the horn can be displaced laterally from front forks of the motorcycle, in a position where the horn overlaps with an inner panel of a cowl of the motorcycle in a front view.

Abstract: A side mirror includes a mount seat mounted to a front cowl that covers a portion of the front of a vehicle body, a mirror stay supported on the mount seat with a basal end thereof supported in a turnable manner, and a mirror provided at a tip end of the mirror stay. The mount seat includes a base portion 41a extended in one direction and mounted to the front cowl, and a support portion provided on the base portion 41a to support the basal end of the mirror stay so that a direction Dp in which a turning shaft of the mirror stay extends is inclined to a length direction DL of the base portion. With this structure, a side mirror increased in degree of freedom in selecting a mount position on a front cowl can be provided.

Abstract: A motorcycle is provided with a translucent screen board 25 arranged forwardly of a handle 13 which changes a direction of a front wheel according to an operation by a rider and extended obliquely upward toward a rear of a vehicle body, and a rectifier plate 30 extending along the screen board 25 in front of the screen board 25. The rectifier plate 30 prevents dust, etc., from adhering to the screen board when the motorcycle travels.

Abstract: A vehicle cowl may be arranged on a side portion of a vehicle, and include a duct that extends in a vehicle width direction. The duct may have an inside opening and an outside opening. The inside opening may face inward, toward the vehicle body, and the outside opening may face outward from the vehicle. The cowl may further include a panel for covering a portion of the outside opening. The panel may be arranged so that, when the vehicle is viewed from the front, a portion of the outside opening left uncovered by the panel is shielded by a forward part of the panel, and thus not visible. The vehicle may be a motorcycle.

Abstract: A vehicle cowl may comprise a receiving portion formed as a local depression, and one or more openings formed on sides of the receiving portion. The vehicle cowl may be configured to be disposed rearward of a front wheel of a vehicle, the one or more openings to face rearward and the local depression to extend rearward when the vehicle cowl is in place on the vehicle. The receiving portion may be configured to receive and/or deflect an object or substance splashed or thrown up by the front wheel, such as water, mud or road debris, in a position rearward of the front wheel. Moreover, air can flow through the one or more openings on the sides of the receiving portion, to cool heat-generating parts such as the radiator and engine. The vehicle may be a motorcycle.

Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

Abstract: In wire bonding, a clearance measurement between the capillary and reference member being performed by an image capturing device for capturing elevation images of the used and new (replaced) capillaries and the reference member and by a clearance measuring device that processes the elevation images of the capillaries and the reference member, obtained by the image capturing device, and then measures the distance in a vertical direction between the tip ends of the capillaries and the tip end of the reference member, thus setting post-replacement capillary contact position data based on pre-replacement capillary contact position data and the obtained clearance difference.

Abstract: A bump bonding apparatus and method in which a ball 6 is formed on the tip end of a wire 4 by an electric discharge between the wire 4 and a discharge electrode 3, and a bump 8 is formed by joining this ball 6 to the pad 2 of a semiconductor chip 1. In cases where the position of the capillary 5, when the capillary 5 is lowered following the next ball formation and the tip end portion of the wire (ball 6 or stripped bump) comes into contact with the electrode pad 2 drops below the lower limit of the permissible error range of the ball contacting level (first detected position H1) of the capillary 5 at a time when a normally formed ball 6, comes into contact with the electrode pad 2, a bump non-adhesion signal is outputted, and the bonding operation is stopped.

Abstract: An XY table used in a semiconductor manufacturing apparatus including lower (X table) fixed to an X movable element and an upper table (Y table) fixed to a Y movable element, in which the upper table (Y table) is supported movably in a Y direction and immovably in an X direction on the lower table (X table), the X movable element is immovable in the Y direction with respect to the X motor main body, the Y movable element is movable in the X direction with respect to the Y motor main body. Furthermore, the Y motor main body is provided with a permanent magnet that covers an entire region of movement of a magnetic action component (coils) of the Y movable element in the X direction.

Abstract: So as to achieve accurate detection of the bonding tool position in, for instance, a wire bonding apparatus, the positional relationship between a position detection camera and a reference hole formed in, for instance, a clamper is measured by imaging the reference hole by the position detection camera. The position detection camera and a bonding tool are moved by an XY table, and the tip end of the bonding tool is inserted into the reference hole. Then, the bonding tool is moved in the X and Y directions, and the contact of the bonding tool to an edge of the reference hole is detected based upon changes in the waveform of the ultrasonic vibrations applied to the bonding tool, thus measuring the positional relationship between the tool and the reference hole. The offset amount between the position detection camera and the bonding tool is then determined based upon the measured values and the amounts of movement of the bonding tool between the locations for such measured values.

Abstract: An XY table used in a semiconductor manufacturing apparatus including lower (X table) fixed to an X movable element and an upper table (Y table) fixed to a Y movable element, in which the upper table (Y table) is supported movably in a Y direction and immovably in an X direction on the lower table (X table), the X movable element is immovable in the Y direction with respect to the X motor main body, the Y movable element is movable in the X direction with respect to the Y motor main body. Furthermore, the Y motor main body is provided with a permanent magnet that covers an entire region of movement of a magnetic action component (coils) of the Y movable element in the X direction.

Abstract: According to the method of treating water in a cooling water system, adhesion of fouling is on-line monitored by a compact and inexpensive apparatus and a slime control treatment is intensified according to the result of on-line monitoring. The water treatment is intensified in response to the change of electric potential of a sensor monitoring microbial fouling 11 made of sensitized metallic material. When the electric potential of the sensor exceeds a threshold value, an agent is added through both chemical feeding pumps 15 and 17. When the electric potential lowers to the normal value, the agent is added only through the pump 15.

Abstract: Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.

Abstract: According to the method of treating water in a cooling water system, adhesion of fouling is on-line monitored by a compact and inexpensive apparatus and a slime control treatment is intensified according to the result of on-line monitoring. The water treatment is intensified in response to the change of electric potential of a sensor monitoring microbial fouling 11 made of sensitized metallic material. When the electric potential of the sensor exceeds a threshold value, an agent is added through both chemical feeding pumps 15 and 17. When the electric potential lowers to the normal value, the agent is added only through the pump 15.

Abstract: Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.

Abstract: So as to achieve accurate detection of the bonding tool position in, for instance, a wire bonding apparatus, the positional relationship between a position detection camera and a reference hole formed in, for instance, a clamper is measured by imaging the reference hole by the position detection camera. The position detection camera and a bonding tool are moved by an XY table, and the tip end of the bonding tool is inserted into the reference hole. Then, the bonding tool is moved in the X and Y directions, and the contact of the bonding tool to an edge of the reference hole is detected based upon changes in the waveform of the ultrasonic vibrations applied to the bonding tool, thus measuring the positional relationship between the tool and the reference hole. The offset amount between the position detection camera and the bonding tool is then determined based upon the measured values and the amounts of movement of the bonding tool between the locations for such measured values.

Abstract: In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.

Abstract: In method for forming a ball on a bonding wire, the tip end of the bonding wire that extends from a capillary is bent toward a discharge electrode, and the capillary is moved obliquely so that the tip end of the tail of the bonding wire faces the discharge electrode, and then an electric discharge is performed between the discharge electrode and the tip end of the wire, thus forming a ball on the tip end of the wire.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: A bonding apparatus for manufacturing, for instance, a semiconductor device including a computer system which calculates a limit value of a driving current that flows to a linear motor controlling a bonding arm, and the computer system including a memory which stores correction current values that are used to correct the driving force of a plate spring at various height positions of the bonding arm, and limit values of the driving current according to a bonding load.