Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: A wire bonding method in the manufacture of, for instance, a semiconductor device in which first bonding points or pads of a chip and second bonding points or leads of a lead frame are connected by wires, and the bonding by wires is initiated from one end of the row of the first bonding points (pads) and is successively performed in one direction toward a center of the row, and after bonding has been performed up to an approximate center of the row, then bonding is initiated from another end of the row in the opposite direction toward the center of the row.

Abstract: Corrosion of a metal member under heat transfer condition is monitored by using a test coupon made of the same material as that of the metal member. The test coupon may have a welded portion and a crevice. One substantial surface of the test coupon is heated by a sheet shaped heating element, and at least one portion of the other surface of the test coupon is contacted with the corrosive fluid. After detecting a status of corrosion of the test coupon, the corrosion of the metal member is monitored based on the results of the detection. In case a counter electrode or reference electrode is used, the electrode is immersed in the corrosive fluid, and electrical signals between the test coupon and the electrode are measured. Then, the corrosion of the metal member is monitored.

Abstract: In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.

Abstract: In a wire bonding method, particularly a method for forming a ball at an end of a bonding wire that has an intended ball size, a tail length of the bonding wire extending from the lower end of a capillary is determined according to the size of the intended ball and the internal shape of the lower end portion of the capillary, and the wire end having such a tail length is melted up to the lower end surface of the capillary by a discharge produced by an electric torch so as to form a ball on the wire end.

Abstract: A wire bonding method for bonding a first bonding point and then a second bonding point by bonding wire that passes through a capillary including a reverse operation that moves the capillary in a direction opposite from a second bonding point after the bonding is done to the first bonding point, a damper is closed temporarily during the reverse operation so as to apply tension to the wire, thus forming a strong kink at an uppermost point of the neck height portion of a resulting wire loop between the first and second bonding points.

Abstract: In a fixed type discharge electrode system employed for forming a ball on a bonding wire, a magnet is provided on, for instance, the discharge electrode so as to apply a magnetic field that causes the portion of an electric spark facing the bonding wire to be bent and positioned beneath the bonding wire.

Abstract: A circuit and method for controlling a rotating or oscillating element of a DC motor, including a positional deviation correction signal generator in addition to a position sensor which detects an amount of rotation or oscillation and position of the rotating or oscillating element, a main control circuit that includes a DC motor driving circuit, and a computer which controls the main control circuit. The output signal of the positional deviation correction signal generator is controlled by the computer based upon positional deviation correction information and signals from the position sensor, so that the positional deviation correction signal generator compensates for any positional deviation of the rotating or oscillating element of the DC motor at a stopping position thereof.

Abstract: In a wire bonding apparatus in which images of workpieces placed on a heating block so as to be bonded are taken by a camera through an optical path housing in which an optical path from the workpiece to the camera is established, heaters are installed on the optical path housing so as to heat the optical path housing at a constant temperature which is higher than the temperature that is affected by the heating block.

Abstract: The water of a water system is treated to inhibit corrosion of metal components by passage through an anion exchanger preloaded with corrosion-inhibiting anions. A low molecular weight polymer is added. A chlorine containing slime controlling agent is added. The concentration of the chloride ion in water is maintained below 50 mg/L.

Abstract: According to the present invention there are provided method and apparatus for producing a simple printing plate having open cells, which method and apparatus area simple in construction and permit accurate and continuous production of the printing plate. More specifically, as the method there is provided a method of producing a simple printing plate having open cells by pressing both an embossing member having a relief image and a to-be-embossed member which is a sheet having open cells, in a heated state of the embossing member, allowing the relief image to be transferred to the to-be-embossed member, characterized in that the embossing member is attached to an embossing cylinder, the to-be-embossed member is attached to a to-be-embossed cylinder, one or both of the embossing cylinder and the to-be-embossed cylinder being in an arcuate form, and both cylinders are rotated in synchronism with each other, thereby pressing the embossing member and the to-be-embossed member in a rolling fashion.

Abstract: A method for producing a printing plate which involves forming an image on the surface of a sheet having open cells by selectively applying a thermal exposure to the surface of the sheet. The sheet is a thermoplastic resin preferably having melting point between about 50.degree. to 150.degree. C. The resulting printing plate has a planar surface with no relief sections; instead there are porous and nonporous sections, with the porous sections being permeable to ink infused within the printing plate. A method of printing using the above plate is also disclosed.

Abstract: An electrode used in a wire bonding method and apparatus for applying an electric discharge to an end of a bonding wire so as to form a ball at the end of the bonding wire. The electrode is provided with an obliquely cut surface at one end so that the end of the electrode is in a semicircular shape, and an edge area of the semicircular end surface is positioned to face upward and used as an electric discharge part. The electrode can be covered by a ceramic material except for the semicircular end surface.

Abstract: In bonding machines such as a wire bonding machine, a lock which makes the changing of bonding data impossible is placed on specific data setting mode items, which are stored in a memory, via a data setting mode locking circuit. The changing of data in such locked data setting modes is made possible only if a password inputted is the same as a previously set-in password.

Abstract: According to the present invention there are provided method and apparatus for producing a simple printing plate having open cells, which method and apparatus area simple in construction and permit accurate and continuous production of the printing plate. More specifically, as the method there is provided a method of producing a simple printing plate having open cells by pressing both an embossing member having a relief image and a to-be-embossed member which is a sheet having open cells, in a heated state of the embossing member, allowing the relief image to be transferred to the to-be-embossed member, characterized in that the embossing member is attached to an embossing cylinder, the to-be-embossed member is attached to-be-embossed cylinder, one or both of the embossing cylinder and the to-be-embossed cylinder being in an arcuate form, and both cylinders are rotated in synchronism with each other, thereby pressing the embossing member and the to-be-embossed member in a rolling fashion.

Abstract: A wire clamper for wire bonding apparatuses including a pair of clamping arms provided with clamping elements at the terminal ends of the clamping arms that are opened and closed by the electrostrictive strain effect or magnetstrictive strain effect of a piezoelectric element, and a temperature compensation component is connected to the piezoelectric element so as to correct the fluctuation in the clamping load in the clamping elements that are caused by temperature changes in the clamper.

Abstract: An ultrasonic wire bonding method that uses an ultrasonic oscillation output from a non-rotatable form, wherein the ultrasonic oscillation output used for bonding the leads that extend in an X-direction which is perpendicular to the axial direction of a horn is set to be larger than the ultrasonic oscillation output used for bonding the leads extending in a Y-direction which coincides with the axial direction of the horn.

Abstract: An ultrasonic bonding apparatus including a piezoelectric element which transmit a vibration via the electric strain or magnetic strain effect to a capillary which is mounted to a non-resonant bonding arm, a microcomputer which outputs frequency data and amplitude data and an open-loop control circuit which includes a memory in which output waveform data is stored, a programmable frequency generator which varies the frequency according to the frequency data from the microcomputer and outputs a memory address switching signal, a first D/A converter which determines the amplitude in accordance with the amplitude data from the microcomputer, and a second D/A converter which applies output voltage or current to the piezoelectric element based upon the output waveform data at an address stored in the memory and selected by the address switching signal which is sent from the programmable frequency generator and upon the amplitude determined by the first D/A converter.

Abstract: In a wire bonding apparatus and method which reduces variances of the length of tails of bonding wires without increasing the total wire cutting time, a capillary and a wire cutting clamp are moved up fast 10 and then slowly 11, after the wire is bonded to a second bonding point 1, to a-point slightly below a desired tail length S, and then the capillary and the clamp are moved up slowly 12 so that the clamp is closed to cut the wire and then moved up fast 13 and slowly 14 again.

Abstract: In order to avoid an excessive wire loop curvature at a second bonding point, a wire bonding is performed with the steps of: moving the capillary, after the wire is connected to a first bonding point, toward the second bonding point, and right before the capillary comes above the second bonding point, the capillary is moved down obliquely so that the capillary is positioned exactly above the second bonding point, and then the capillary is moved down straight so that the wire is pressed against the second bonding point.