Abstract: In a wire bonding method and apparatus for connecting first and second bonding points by a wire, a wire clamper, that is made up of an immovable member and a movable member which is driven by a linear motor, is used. The linear motor is actuated so that the clamper first acts in a direction of clamping, then the power to the linear motor is switched off or the linear motor is actuated so that the clamper acts in a direction of releasing, and then the linear motor is actuated in the direction that the clamper clamps the wire, thus moving the movable member.

Abstract: In a bonding method used in manufacturing semiconductor devices, after a bonding wire is connected to a first bonding point, a capillary is moved straight up and then moved away from a second bonding point, thus making a first reverse action. From there, the capillary is again raised and a second reverse action is performed so that the capillary is moved again in the direction opposite to the second bonding point. The capillary is further raised with feeding out the wire for the length which is enough to make a wire loop, and then the capillary is moved down to the second bonding point where the bonding is performed.

Abstract: A wire bonding method that uses plurality of bonders so that each samples treated by the respective bonders are collected via single sample correcting line, in which bonders perform bondings at different points on the samples and/or performs marking bonds at different points thereon, resulting in that the bonder that has performed the bonding can be easily recognized by examining bonding points.