Abstract: Semiconductor devices and methods are disclosed herein. In one example, a disclosed semiconductor device includes: an insulation layer, a first electrode with sidewalls and a bottom surface in contact with the insulation layer; a second electrode with sidewalls and a bottom surface in contact with the insulation layer; and an insulator formed between the first electrode and the second electrode. The insulator is coupled to a sidewall of the first electrode and coupled to a sidewall of the second electrode.

Abstract: Computing systems, methods and management tools for scheduling, optimizing and completing a dynamically adjustable workflow process. The computing systems, methods and management tools being capable of evaluating the availability of resources available for completing the workflow process and ascertaining the reliability of the resources in order to pre-generate a workflow process schedule. The computing systems, methods and management tools are further able to communicate with the assigned resources to incrementally negotiate and receive approval for proposed improvements to the pre-generated workflow schedule prior to implementation of the workflow schedule in order to optimize the cycle time of the process and increase probability of successfully completing the workflow process. The computing systems, methods and management tools may dynamically track the due dates for completing particular tasks and generate amended workflow process schedules in the event a failure occurs.

Abstract: An Uninterruptible Power Supply (UPS) including a charger configured to convert input AC power into DC power having a first voltage level, a DC-DC converter configured to convert the DC power having the first voltage level into DC power having a DC bus voltage level, a DC bus coupled to the DC-DC converter, an inverter coupled to the output via an output switch and configured to convert the DC power having the DC bus voltage level into output AC power, a bypass line including a bypass switch coupled between the input and the output switch, a rectifier coupled between the bypass line and the DC bus, and a controller configured to operate the UPS in a first mode of operation to provide DC power to the DC bus via the DC-DC converter and in a second mode of operation to provide DC power to the DC bus via the rectifier.

Abstract: A manufacturing method of a resistive memory device includes the following steps. A first electrode is formed. A first metal oxide layer is formed on the first electrode, and the first metal oxide layer includes first metal atoms. A multilayer insulator structure is formed on the first metal oxide layer. A second metal oxide layer is formed on the multilayer insulator structure. The second metal oxide layer includes second metal atoms, the multilayer insulator structure includes third metal atoms, and each of the third metal atoms is identical to each of the second metal atoms. A second electrode is formed on the second metal oxide layer. The multilayer insulator structure is disposed between the first metal oxide layer and the second metal oxide layer in a vertical direction, and an atomic percent of the third metal atoms in the multilayer insulator structure changes in the vertical direction.

Abstract: Semiconductor devices and methods are disclosed herein. In one example, a disclosed semiconductor device includes: an insulation layer, a first electrode with sidewalls and a bottom surface in contact with the insulation layer; a second electrode with sidewalls and a bottom surface in contact with the insulation layer; and an insulator formed between the first electrode and the second electrode. The insulator is coupled to a sidewall of the first electrode and coupled to a sidewall of the second electrode.

Abstract: An approach is provided for dynamically identifying a danger zone for a predicted traffic accident and generating a warning about the accident. From a monitoring device at a first location, information about traffic conditions for vehicles at time T0 and at least one subsequent time T0+t is received. Based on speeds of the vehicles and a fixed distance from the first location, a response time is calculated. Within the response time, a dual artificial intelligence (AI) model using shallow and deep learners applied on historical accident data is employed. Based on the dual AI model and the traffic conditions, an accident involving vehicle(s) in the traffic is predicted to occur in a zone. A warning about the accident is generated and sent to device(s) in the vehicle(s). The warning is presented to driver(s) of the vehicle(s).

Abstract: The present disclosure, in some embodiments, relates to a workpiece bonding apparatus. The workpieces bonding apparatus includes a first substrate holder having a first surface configured to receive a first workpiece, and a second substrate holder having a second surface configured to receive a second workpiece. A vacuum apparatus is positioned between the first substrate holder and the second substrate holder and is configured to selectively induce a vacuum between the first surface and the second surface. The vacuum is configured to attract the first surface and the second surface toward one another.

Abstract: A semiconductor device includes a substrate, a first transistor disposed on the substrate, a second transistor in proximity to the first transistor on the substrate, at least one interlayer dielectric layer covering the first transistor and the second transistor, a first stress-inducing dummy metal pattern disposed on the at least one interlayer dielectric layer and directly above the first transistor, and a second stress-inducing dummy metal pattern disposed on the at least one interlayer dielectric layer and directly above the second transistor.

Abstract: An Uninterruptible Power Supply (UPS) including a charger configured to convert input AC power into DC power having a first voltage level, a DC-DC converter configured to convert the DC power having the first voltage level into DC power having a DC bus voltage level, a DC bus coupled to the DC-DC converter, an inverter coupled to the output via an output switch and configured to convert the DC power having the DC bus voltage level into output AC power, a bypass line including a bypass switch coupled between the input and the output switch, a rectifier coupled between the bypass line and the DC bus, and a controller configured to operate the UPS in a first mode of operation to provide DC power to the DC bus via the DC-DC converter and in a second mode of operation to provide DC power to the DC bus via the rectifier.

Abstract: A processing method of formic acid soldering includes providing a solder, performing a formic acid providing step, performing a soldering step and performing a cooling step. The solder is disposed at a soldering object. In the formic acid providing step, a water-containing formic acid vapor extracted from a formic acid source is introduced to a soldering object so as to form a water-containing formic acid atmosphere surrounding the soldering object. In the soldering step, the solder and the soldering object are soldered in the water-containing formic acid atmosphere at a soldering temperature so as to form a soldered object with high temperature. In the cooling step, the soldered object with high temperature is cooled by a cooling method so as to form a soldered object. A range of a moisture content of the formic acid source is greater than or equal to 0.1 wt % and less than 15 wt %.

Abstract: A multifunctional physical store system with automatic sterilization and disinfection functions includes a central process device, and a disinfection device, an order device, a sterilization device, and a serve device that are coupled with the central process device. The system is applied to a physical store. The disinfection device is applied for carrying out the disinfection operation on the environment of the physical store. The sterilization device is applied for carryout surface sterilization on the people entering the store. The order device and the serve device are applied for people to order and acquire meals. Therefore, the application of various devices facilitates a nearly dust-free and sterile environment in the store, lowering the possibility of virus or bacterial infection between people in the operation area and the customers.

Abstract: A cleaning process of wafer polishing pad, the process includes providing a wafer polishing pad, performing a planarization process with the wafer polishing pad, leaving a residue on the wafer polishing pad after the planarization process, and performing a cleaning step with a cleaning nozzle to remove the residue, the cleaning nozzle comprises at least one Y-shaped pipe, one end of which is a water outlet, and the other two ends are respectively a water inlet and an air inlet, wherein a cleaning liquid flows from the water inlet to the water outlet, and a pressurized gas flows in from the air inlet.

Abstract: A smart cooling fan system is disclosed, and comprises a first temperature sensor, a second temperature sensor, a first cooling fan connected to a main processor of an electronic device, a second cooling fan disposed in a housing case of the electronic device, and a microcontroller. The microcontroller is configured to, based on immediate fan rotation speed, find out a first volumetric flow rate and a second volumetric flow rate by looking up a CFM-RPM lookup table (LUT), a first PWM LUT and a second PWM LUT, the microcontroller controls the first cooling fan to produce a first airflow having the first volumetric flow rate, and also controls the second cooling fan to produce a second airflow having the second volumetric flow rate. As a result, the operating temperature of the main processor and an ambient temperature of the housing case are therefore immediately reduced.

Abstract: In some embodiments, the present disclosure relates to a process tool that includes a chamber housing defining a processing chamber. Within the processing chamber is a wafer chuck configured to hold a substrate. Further, a bell jar structure is arranged over the wafer chuck such that an opening of the bell jar structure faces the wafer chuck. A plasma coil is arranged over the bell jar structure. An oxygen source coupled to the processing chamber and configured to input oxygen gas into the processing chamber.

Abstract: A method of fabricating a decorated molding article includes forming an all-in-one coating on a substrate and performing a curing step, thereby forming a composite layer structure with a protective effect, a color effect, and a bonding effect. The composite layer structure may form a molded film with better physical properties (e.g., higher hardness, better protection effect, and the like) after the blister molding process. Therefore, the molded film of the embodiments may be applied to a laser engraving process to form a variety of light-transmitting decorated molding articles.

Abstract: A decorated molding article includes a workpiece and a composite layer structure. The composite layer structure is attached to an outer surface of the workpiece through an adhesive layer. The composite layer structure at least includes: a substrate having a first surface and a second surface opposite to each other; an optical effect layer disposed on the first surface of the substrate; and a decorative layer disposed between the first surface of the substrate and the optical effect layer. The decorative layer formed by a printing method has a thickness less than a thickness of the optical effect layer formed by a coating method, and the optical effect layer and the decorative layer each includes a protective material, an ink material, and an adhesive material. In such embodiment, the all-in-one coating material may be formed on the substrate by the coating method or the printing method to form the optical effect layer and the decorative layer with protective, color, and adhesive effects.

Abstract: A docking station has a base, a main casing, a cover body, a ventilation layer, and multiple first lateral openings. The main casing forms a first inner space and has multiple first through-holes. The ventilation layer is in gaseous communication with the first inner space via the first through-holes. The cover body is fixed to the main casing, and the ventilation layer is formed between the cover body and the main casing. The first lateral openings are formed in the cover body and in gaseous communication with the ventilation layer. When in use, heat generated by electronic components inside the first inner space makes air inside the first inner space flow upwards to the ventilation layer and subsequently exits the docking station via the first lateral openings. Meanwhile, cool air enters the first inner space via the first lateral openings to dissipate heat.

Abstract: Provided is a composite layer structure comprising a first layer and a second layer. The second layer is disposed on the first layer. A material of the second layer is different from a material of the first layer. The composite layer structure is formed by a co-extrusion molding film process, and the composite layer structure has a thickness of between 0.01 mm and 1 mm. Further, the present invention also provides a decorated molding article and a method for fabricating the same.

Abstract: The present invention provides a method of generating dummy patterns and calibration kits, including steps of generating devices-under-test (DUTs) using a point of said chip window layer as reference point in a unit cell, generating calibration kits corresponding to the DUTs using the point as reference point in corresponding unit cells, generating DUT dummy patterns for each DUTs individually in the unit cell, copying the DUT dummy patterns in the unit cell to the corresponding calibration kits in the corresponding unit cells using the point as reference point, and merging all of the unit cell and corresponding unit cells into a final chip layout.

Abstract: A headphone control system for use within a headphone includes a temperature sensor for detecting whether the circumference temperature of the headphone is relatively far from the human temperature implying the headphone is no longer worn by the user, and a gravity sensor for detecting whether the headphone is stationary implying that the headphone is not used for enabling a power saving mode, or is moving implying that the headphone is not yet unused for maintaining operation. The detection constantly is applied to the headphone disregarding whether the headphone is in an operation mode or a power saving mode so as to efficiently have the headphone operated in response to currently using or power-saved in response to non-using.