Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates diametrically opposite to each other. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly placed above the pair of bonded substrates and configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

Abstract: An apparatus and method is provided for controlling a propagation of a bond wave during semiconductor processing. The apparatus has a first chuck to selectively retain a first workpiece. A second chuck selectively retains a second workpiece. The first and second chucks selectively secure at least a periphery of the respective first workpiece and second workpiece. An air vacuum is circumferentially located in a region between the first chuck and second chuck. The air vacuum is configured to induce a vacuum between the first workpiece and second workpiece to selectively bring the first workpiece and second workpiece together from a propagation point. The air vacuum can be localized air vacuum guns, a vacuum disk, or an air curtain positioned about the periphery of the region between the first chuck and second chuck. The air curtain induces a lower pressure within the region between the first and second chucks.

Abstract: Provided is a composite layer structure comprising a first layer and a second layer. The second layer is disposed on the first layer. A material of the second layer is different from a material of the first layer. The composite layer structure is formed by a co-extrusion molding film process, and the composite layer structure has a thickness of between 0.01 mm and 1 mm. Further, the present invention also provides a decorated molding article and a method for fabricating the same.

Abstract: An approach is provided to provide URLs based on a digital subject matter image (DSMI) received from a requestor. The approach identifies a set of classification labels pertaining to the DSMI and matches the set of classification labels against multiple sets of predefined labels with each of the sets of predefined labels corresponding to a URL. The matching results in a selected URL pertaining to the DSMI with this URL being returned to the requestor. In one embodiment, the approach is performed by a domain name system (DNS).

Abstract: An apparatus and method is provided for controlling a propagation of a bond wave during semiconductor processing. The apparatus has a first chuck to selectively retain a first workpiece. A second chuck selectively retains a second workpiece. The first and second chucks selectively secure at least a periphery of the respective first workpiece and second workpiece. An air vacuum is circumferentially located in a region between the first chuck and second chuck. The air vacuum is configured to induce a vacuum between the first workpiece and second workpiece to selectively bring the first workpiece and second workpiece together from a propagation point. The air vacuum can be localized air vacuum guns, a vacuum disk, or an air curtain positioned about the periphery of the region between the first chuck and second chuck. The air curtain induces a lower pressure within the region between the first and second chucks.

Abstract: A bio-sensing apparatus is used to sense a biopolymer. The bio-sensing apparatus includes a sensing element, a light-transmitting element and a surface plasma resonance layer. The bio-sensing apparatus is disposed on the sensing element. The surface plasma resonance layer is disposed on the light-transmitting element, and is used to receive the biopolymer. The light-transmitting element is disposed between the surface plasma resonance layer and the sensing element.

Abstract: A display panel includes a first substrate; a second substrate disposed opposite to the first substrate; a display medium disposed between the first substrate and the second substrate; and a first engaging structure including a first protruding portion and a first receiving portion. The first protruding portion is disposed on a first surface of the first substrate, and the first receiving portion is disposed on a second surface of the second substrate. The first receiving portion has a first opening to expose a portion of the second surface of the second substrate. At least a portion of the first protruding portion is disposed within the first opening of the first receiving portion. The first protruding portion and the portion of the second surface of the second substrate exposed from the first opening are spaced apart by a distance.

Abstract: A display panel has a display region and a non-display region. The display panel includes a first substrate; a second substrate disposed opposite to the first substrate; a display medium disposed between the first substrate and the second substrate; and an adhesion structure disposed between the first substrate and the second substrate and in the non-display region, wherein a width of the adhesion structure ranges from 5 ?m to 500 ?m.

Abstract: Disclosed is a hearing auxiliary device for helping a person with hearing impairment to obtain hearing information. The hearing auxiliary device includes a bone conduct transceiver, a receiver and a driver. The bone conduct transceiver converts a sound raw data to a bone conduct signal. The receiver is installed to an inner ear portion of the person with hearing impairment, and the receiver receives the bone conduct signal and converts the bone conduct signal to a sound restoration signal. The driver sends out a physical signal according to the sound restoration signal, in order to let the person with hearing impairment to obtain a hearing signal.

Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates diametrically opposite to each other. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly placed above the pair of bonded substrates and configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

Abstract: An apparatus and method is provided for controlling a propagation of a bond wave during semiconductor processing. The apparatus has a first chuck to selectively retain a first workpiece. A second chuck selectively retains a second workpiece. The first and second chucks selectively secure at least a periphery of the respective first workpiece and second workpiece. An air vacuum is circumferentially located in a region between the first chuck and second chuck. The air vacuum is configured to induce a vacuum between the first workpiece and second workpiece to selectively bring the first workpiece and second workpiece together from a propagation point. The air vacuum can be localized air vacuum guns, a vacuum disk, or an air curtain positioned about the periphery of the region between the first chuck and second chuck. The air curtain induces a lower pressure within the region between the first and second chucks.

Abstract: A bio-sensing apparatus is used to sense a biopolymer. The bio-sensing apparatus includes a sensing element, a light-transmitting element and a surface plasma resonance layer. The bio-sensing apparatus is disposed on the sensing element. The surface plasma resonance layer is disposed on the light-transmitting element, and is used to receive the biopolymer. The light-transmitting element is disposed between the surface plasma resonance layer and the sensing element.

Abstract: The present disclosure relates to a method for debonding a pair of bonded substrates. In the method, a debonding apparatus is provided comprising a wafer chuck, a flex wafer assembly, and a set of separating blades. The pair of bonded substrates is placed upon the wafer chuck so that a first substrate of the bonded substrate pair is in contact with a chuck top surface. The flex wafer assembly is placed above the bonded substrate pair so that its first surface is in contact with an upper surface of a second substrate of the bonded substrate pair. A pair of separating blades having different thicknesses is inserted between the first and second substrates from edges of the pair of bonded substrates diametrically opposite to each other while the second substrate is concurrently pulled upward until the flex wafer assembly flexes the second substrate from the first substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

Abstract: An image capturing module including a light emitting element, a sensing element, a first circuit substrate, and a second circuit substrate is provided. The first circuit substrate includes a first substrate having a first through hole and a second through hole. The light emitting element is disposed in the first through hole. The sensing element is disposed in the second through hole. The second circuit substrate is disposed on a side of the first circuit substrate and includes a second substrate having a third through hole and a fourth through hole. The third through hole exposes a light emitting surface of the light emitting element disposed in the first through hole. The fourth through hole exposes a sensing surface of the sensing element disposed in the second through hole. A manufacturing method of the image capturing module is also provided.

Abstract: An image capturing module including a light emitting element, a sensing element, and a circuit substrate is provided. The circuit substrate includes a substrate, a plurality of conductive plugs, a first wiring layer, and a second wiring layer. The substrate has a first through hole, a second through hole, and a plurality of third through holes. The light emitting element is disposed in the first through hole. The sensing element is disposed in the second through hole. The conductive plugs are disposed in the third through holes. The first wiring layer is disposed on a first surface of the substrate. The second wiring layer is disposed on a second surface of the substrate opposite to the first surface. The second wiring layer is electrically connected to the first wiring layer through the conductive plugs. A manufacturing method of the image capturing module is also provided.

Abstract: An image capturing module including a light emitting element, a sensing element, a first circuit substrate, a second circuit substrate, and a third circuit substrate is provided. The first circuit substrate is located between the second circuit substrate and the third circuit substrate and includes a first substrate having a first and a second through holes. The light emitting element is mounted on the third circuit substrate and disposed in the first through hole. The sensing element is disposed in the second through hole. The second circuit substrate includes a second substrate having a third and a fourth through holes. The third through hole exposes a light emitting surface of the light emitting element disposed in the first through hole. The fourth through hole exposes a sensing surface of the sensing element disposed in the second through hole. A manufacturing method of the image capturing module is also provided.

Abstract: An adaptive lubrication control method used in an adaptive lubrication control system for a machining center having an axial system comprises a controller and a lubricating system. The method uses a built-in macro program unit and programmable logic unit of the controller to acquire the feed rate and load data of the axial system of the machining center for computing the shift parameter of the axial system so that the optimal lubrication timing and lubrication time length can be figured out for controlling the lubricating system to lubricate the axial system automatically.

Abstract: Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.

Abstract: An image capturing module including a substrate, a plurality of light emitting devices, a sensor, and a transparent colloid curing layer is provided. The light emitting devices and the sensor are disposed on the substrate and are respectively electrically connected to the substrate. The transparent colloid curing layer is disposed on the substrate and covers the sensor and the light emitting devices. At least one trench is provided at a side of the transparent colloid curing layer opposite to the sensor. The at least one trench is located between the sensor and the light emitting devices, and a depth of the at least one trench is less than a thickness of the transparent colloid curing layer. An electrical apparatus is also provided.

Abstract: The present invention relates to a humidifying device for a breathing mask. The breathing mask includes a breathing tube assembled thereto. The humidifying device includes a body, a liquid discharger, a liquid receiver, and a water-absorbent member. The body is connected to the breathing tube. The body includes a passage communicating with the breathing tube. The liquid discharger is fixed to the body. The liquid discharger includes a liquid outlet communicating with the passage. The liquid receiver is fixed to the body and is disposed below the liquid discharger. The liquid receiver includes a liquid inlet communicating with the passage. The water-absorbent member consists of a filtering material. The water-absorbent member is accommodated in the passage and disposed between the liquid outlet and the liquid inlet.