Patents by Inventor Kuo Cheng Wang

Kuo Cheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7008255
    Abstract: An electrical connector includes a dielectric body, which has at least two rows of contact receiving holes extending therethrough and a passageway defined between the two rows of contact receiving holes. A plurality of contacts are held in the contact receiving holes. A latch mechanism mounted in the passageway includes two latch arms, each of which has a hook and a force receiving portion, a pivot coupling the two latch arms together, and a spring disposed between the two latch arms. When the force receiving portions are exerted by a force, the two latch arms are pivoted to deflect the hooks from their original positions to mate with a mating connector. Thereafter, when the force is removed from the force receiving portions, the hooks urged by the spring tend to recover to their original positions to thereby fasten the mating connector.
    Type: Grant
    Filed: June 6, 2005
    Date of Patent: March 7, 2006
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventor: Kuo-Cheng Wang
  • Patent number: 6692268
    Abstract: A PC (PCMCIA) card is constructed to include a jacket formed of a plastic bottom cover shell and a plastic top cover shell and defining a receiving chamber, the top cover shell and the bottom cover shell each having a plurality of locating grooves symmetrically disposed at two sides, and an interface adapter mounted inside the receiving chamber, the interface adapter including a circuit board and two connectors at two sides of the circuit board, the connectors each having a plurality of locating rods disposed at two sides and respectively engaged into the locating grooves of the jacket.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: February 17, 2004
    Assignee: I/O Interconnect Inc.
    Inventors: Gary Kung, Kuo Cheng Wang
  • Publication number: 20030216063
    Abstract: A PC (PCMCIA) card is constructed to include a jacket formed of a plastic bottom cover shell and a plastic top cover shell and defining a receiving chamber, the top cover shell and the bottom cover shell each having a plurality of locating grooves symmetrically disposed at two sides, and an interface adapter mounted inside the receiving chamber, the interface adapter including a circuit board and two connectors at two sides of the circuit board, the connectors each having a plurality of locating rods disposed at two sides and respectively engaged into the locating grooves of the jacket.
    Type: Application
    Filed: June 7, 2002
    Publication date: November 20, 2003
    Applicant: I-O INTERCONNECT INC.
    Inventors: Gary Kung, Kuo Cheng Wang
  • Patent number: 6540523
    Abstract: A for memory cards comprises a base part and four guide piece sections. The base part is an integrated casing made by way of injection molding and provides a longitudinal spacing wall and two transverse partitions between an upper wall and a lower wall and between two lateral walls of a rear wall thereof respectively based on the width and the height of each of different types memory cards such that the front side thereof is formed with four slot sockets. Each of the slot sockets is provided with a plurality of grooves or engaging recesses corresponding to the number of signal terminals on the respective memory card. The guide piece sections are corresponding to the slot sockets respectively and each of the guide piece sections is located in and fixed to the corresponding one of the slot sockets and is composed of metal guide pieces corresponding to the number of the grooves and the engaging recesses. The metal guide pieces are bent and inserted into the grooves and the engaging recesses.
    Type: Grant
    Filed: February 4, 2002
    Date of Patent: April 1, 2003
    Assignee: I/O Interconnect Inc.
    Inventors: Gary Kung, Kuo Cheng Wang
  • Patent number: 6203374
    Abstract: A high density electrical connector of the present invention comprises a dielectric housing having a pair of retaining walls rearwardly extending therefrom, a contact module assembly received between the retaining walls, a metallic shield covering a front side of the housing, a pair of grounding portions received in the housing and a pair of metallic attaching portions for electrically connecting the shield to the grounding portion and thence to ground. The attaching portions each have a block which forms a shoulder on a lateral end thereof and a tubular part forwardly depending from the block. In assembly, the shoulders press against joining plates of the grounding portions which are supported by the retaining walls thereby guiding the tubular part and correcting offset of the grounding portions. The shoulders press against the joining plates further preventing the attaching portions from relaxing out of position after assembly. Therefore, assembly efficiency is increased.
    Type: Grant
    Filed: December 1, 1999
    Date of Patent: March 20, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Wayne Huang, Kuo Cheng Wang, Lipei Huang, Jones Fun
  • Patent number: 6166913
    Abstract: A casing for enclosing a circuit board comprises pair of symmetrical halves assembled together. Each said half forms plurality of retaining means on a first longitudinal side thereof and plurality of receiving means at a second longitudinal side opposite said first longitudinal side whereby said halves are fixedly assembled together by the interlocking engagement between said retaining means and said receiving means.
    Type: Grant
    Filed: July 13, 1998
    Date of Patent: December 26, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Jones Fun, Kuo-Cheng Wang, Steven Wang
  • Patent number: 6033258
    Abstract: A stacked connector assembly includes upper and lower electrical connectors mounted to each other. The upper and the lower connectors both include a first insulative housing having a front face for mating with a mating connector and a plurality of conductive contacts received in a plurality of passageways defined in the first housing. The upper connector further includes a pair of supports extending from a rear face of the first housing and a space defined under a bottom surface of the first housing in front of the supports for snugly receiving the lower connector. A spacer for an electrical connector having guiding keys is also proposed.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: March 7, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Wayne Huang, Kuo-Cheng Wang
  • Patent number: 6018190
    Abstract: An I/O card device includes a metallic, rectangular upper cover having two longitudinal sides each having an L-shaped cross-section with a bottom wall facing each other and defining a number of holes, an upper insulative frame injection molded to the upper cover to fixedly connect therewith in which the upper frame fills the holes of the longitudinal sides, a lower metallic cover having a structure similar to the upper cover, a lower insulative frame having a structure similar to the upper frame and insert molded to the lower cover to fill the holes thereof. The upper frame and lower frame are connected together by ultrasonic soldering. A front connector is fixed to a front end of the device by engaging two lateral mounting ears of the front connector to front ends of the upper and lower frames. A rear connector is fixed to a rear end of the device by engaging two lateral mounting ears of the rear connector to rear ends of the upper and lower frames.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: January 25, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Kuo-Cheng Wang, Chin-Shen Wu, Charles Chou
  • Patent number: 6004144
    Abstract: An electrical card for providing a computer system with a signal processing module, includes metallic top and bottom covers, an insulative supporting frame, a circuit board, a first connector, a second connector and a grounding plate. The grounding plate is securely attached to the first connector by engagement between attachment plates of the grounding plate and extension arms of the first connector. The first connector together with the grounding plate are attached to the supporting frame by means of engagement between L-shaped interlocking members of the first connector and L-shaped interlocking recesses of the supporting frame. The supporting bracket is attachably received in the bottom cover, the second connector is mounted to one end of the circuit board, and the circuit board is received within the supporting bracket whereby the grounding plate forms a grounding path from grounding pads of the circuit board to the bottom cover.
    Type: Grant
    Filed: June 2, 1998
    Date of Patent: December 21, 1999
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Joel Jyh-Haur Yeh, Kuo-Cheng Wang, Chine-Shen Wu
  • Patent number: 5983491
    Abstract: An I/O card assembly (10) includes a rectangular frame (12) having an internal PC board (100) therein and sandwiched between a pair of metal covers (11, 14). A pair of connectors (22, 24) are respectively positioned on two opposite ends of the I/O card assembly (10) wherein one connector (22) has contact tails solderably mounted onto the circuit pads (102) on one end of the PC board (100), and the other connector (24) has contact tails solderably mounted onto the circuit pads on the other end of the PC board (100). The frame (12) includes recesses (13) to retainably receive the mounting ears (32) of the connectors (22) therein so that the connector (22) can be retained within the frame (12) in position. The PC board (100) is made from a raw plate (106) which includes holes (104) therein to receivably retain boardlock means (34) therein so that the connector (22) can be directly but temporarily retained, i.e.
    Type: Grant
    Filed: January 13, 1998
    Date of Patent: November 16, 1999
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Kuo-Cheng Wang
  • Patent number: 5975917
    Abstract: A method for manufacturing an electrical connector (20) comprises the steps of forming an insulative housing (24) defining a mating opening (33) in a front face thereof for mating with a second electrical connector and a central cavity (38) defined in a rear face of the housing (24), forming a contact module (26) including at least one row of conductive contacts (27) received therein, the contacts (27) each defining a contact section (52) for mating with a second contact of the second connector and a tail section (56) for engaging with a printed circuit board, and inserting the contact module (26) into the central cavity (38). An electrical connector (20) formed by such a method and the contact module (26) used with such an electrical connector (20) are also disclosed.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: November 2, 1999
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Kuo-Cheng Wang, Wayne Huang
  • Patent number: 5771156
    Abstract: An I/O card assembly (10) includes a rectangular frame (12) having an internal PC board (100) therein and sandwiched between a pair of metal covers (11, 14). A pair of connectors (22, 24) are respectively positioned on two opposite ends of the I/O card assembly (10) wherein one connector (22) has contact tails solderably mounted onto the circuit pads (102) on one end of the PC board (100), and the other connector (24) has contact tails solderably mounted onto the circuit pads on the other end of the PC board (100). The frame (12) includes recesses (13) to retainably receive the mounting ears (32) of the connectors (22) therein so that the connector (22) can be retained within the frame (12) in position. The PC board (100) is made from a raw plate (106) which includes holes (104) therein to receivably retain the boardlock device (34) therein so that the connector (22) can be directly but temporarily retained, i.e.
    Type: Grant
    Filed: November 22, 1995
    Date of Patent: June 23, 1998
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Kuo-Cheng Wang