Patents by Inventor Kuo-Chin Chang

Kuo-Chin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240371715
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.
    Type: Application
    Filed: July 15, 2024
    Publication date: November 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang
  • Publication number: 20240332230
    Abstract: A semiconductor device including a semiconductor die, a first conductive pad, a second conductive pad, a first connector structure and a second connector structure is provided. The first conductive pad is disposed on the semiconductor die, wherein the first conductive pad has a first lateral dimension. The second conductive pad is disposed on the semiconductor die, wherein the second conductive pad has a second lateral dimension. The first connector structure is disposed on the first conductive pad, wherein the first connector structure has a third lateral dimension greater than the first lateral dimension. The second connector structure is disposed on the second conductive pad, wherein the second connector structure has a fourth lateral dimension smaller than the second lateral dimension.
    Type: Application
    Filed: May 23, 2024
    Publication date: October 3, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hao Hsu, Yen-Kun Lai, Wei-Hsiang Tu, Hao-Chun Liu, Kuo-Chin Chang, Mirng-Ji Lii
  • Patent number: 12094792
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: September 17, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang
  • Publication number: 20240297137
    Abstract: A semiconductor die includes a semiconductor substrate, an interconnect structure, and a conductive bump. The interconnect structure is disposed on and electrically connected to the semiconductor substrate. The interconnect structure includes stacked interconnect layers. Each of the stacked interconnect layers includes a dielectric layer and an interconnect wiring embedded in the dielectric layer. The interconnect wiring of a first interconnect layer among the stacked interconnect layers further includes a first via and second vias. The first via electrically connected to the interconnect wiring. The second vias connected to the interconnect wiring, and the first via and the second vias are located on a same level height. The conductive bump is disposed on the interconnect structure. The conductive bump includes a base portion and a protruding portion connected to the base portion, and the base portion is between the protruding portion and the first via.
    Type: Application
    Filed: May 9, 2024
    Publication date: September 5, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: Yen-Kun Lai, Chien-Hao Hsu, Wei-Hsiang Tu, Kuo-Chin Chang, Mirng-ji Lii
  • Patent number: 12021048
    Abstract: A semiconductor device including a semiconductor die, a first conductive pad, a second conductive pad, a first connector structure and a second connector structure is provided. The first conductive pad is disposed on the semiconductor die, wherein the first conductive pad has a first lateral dimension. The second conductive pad is disposed on the semiconductor die, wherein the second conductive pad has a second lateral dimension. The first connector structure is disposed on the first conductive pad, wherein the first connector structure has a third lateral dimension greater than the first lateral dimension. The second connector structure is disposed on the second conductive pad, wherein the second connector structure has a fourth lateral dimension smaller than the second lateral dimension.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: June 25, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hao Hsu, Yen-Kun Lai, Wei-Hsiang Tu, Hao-Chun Liu, Kuo-Chin Chang, Mirng-Ji Lii
  • Patent number: 12009327
    Abstract: A semiconductor die includes a semiconductor substrate, an interconnect structure, and a conductive bump. The interconnect structure is disposed on and electrically connected to the semiconductor substrate. The interconnect structure includes stacked interconnect layers. Each of the stacked interconnect layers includes a dielectric layer and an interconnect wiring embedded in the dielectric layer. The interconnect wiring of a first interconnect layer among the stacked interconnect layers further includes a first via and second vias. The first via electrically connected to the interconnect wiring. The second vias connected to the interconnect wiring, and the first via and the second vias are located on a same level height. The conductive bump is disposed on the interconnect structure. The conductive bump includes a base portion and a protruding portion connected to the base portion, and the base portion is between the protruding portion and the first via.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: June 11, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Kun Lai, Chien-Hao Hsu, Wei-Hsiang Tu, Kuo-Chin Chang, Mirng-Ji Lii
  • Publication number: 20240145379
    Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.
    Type: Application
    Filed: February 23, 2023
    Publication date: May 2, 2024
    Inventors: Yen-Kun Lai, Wei-Hsiang Tu, Ching-Ho Cheng, Cheng-Nan Lin, Chiang-Jui Chu, Chien Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii
  • Publication number: 20240120277
    Abstract: A chip structure is provided. The chip structure includes a substrate, a redistribution layer over the substrate, a bonding pad over the redistribution layer, a shielding pad over the redistribution layer and surrounding the bonding pad, an insulating layer over the redistribution layer and the shielding pad, and a bump over the bonding pad and the insulating layer. The insulating layer includes a first part and a second part surrounded by the first part, the first part has first thickness, the second part has a second thickness, and the first thickness and the second thickness are different.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Hong-Seng SHUE, Sheng-Han TSAI, Kuo-Chin CHANG, Mirng-Ji LII, Kuo-Ching HSU
  • Patent number: 11855022
    Abstract: Semiconductor device packages and method are provided. A semiconductor device package according to the present disclosure includes a substrate including a first region, a passive device disposed over the first region of the substrate, a contact pad disposed over the passive device, a passivation layer disposed over the contact pad, a recess through the passivation layer, and an under-bump metallization (UBM) layer. The recess exposes the contact pad and the UBM layer includes an upper portion disposed over the passivation layer and a lower portion disposed over a sidewall of the recess. A projection of the upper portion of the UBM layer along a direction perpendicular to the substrate falls within an area of the contact pad.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen, Yen-Ming Chen
  • Patent number: 11848270
    Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a redistribution layer over the substrate. The chip structure includes a bonding pad over the redistribution layer. The chip structure includes a shielding pad over the redistribution layer and surrounding the bonding pad. The chip structure includes an insulating layer over the redistribution layer and the shielding pad. The chip structure includes a bump over the bonding pad and the insulating layer. A sidewall of the bump is over the shielding pad.
    Type: Grant
    Filed: May 25, 2019
    Date of Patent: December 19, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hong-Seng Shue, Sheng-Han Tsai, Kuo-Chin Chang, Mirng-Ji Lii, Kuo-Ching Hsu
  • Publication number: 20230361022
    Abstract: An electrical connection structure includes a dielectric layer stack of a plurality of dielectric layers including a first dielectric layer as an uppermost layer, and a second dielectric layer under the first dielectric layer, a plurality of metal layers in the plurality of dielectric layers, a via stack in the plurality of dielectric layers that connects the plurality of metal layers, an upper metal layer on the dielectric layer stack over the via stack, and an upper dielectric layer on the dielectric layer stack and including an upper dielectric layer opening over the upper metal layer and the via stack. A number of first vias in the first dielectric layer, may be less than or equal to a number of second vias in the second dielectric layer, and the number of second vias in the second dielectric layer may be less than or equal to 3.
    Type: Application
    Filed: May 3, 2022
    Publication date: November 9, 2023
    Inventors: Chien Hao Hsu, Wei-Hsiang Tu, Yen-Kun Lai, Kuo-Chin Chang, Mirng-Ji Lii
  • Publication number: 20230317641
    Abstract: A semiconductor die includes semiconductor devices located on a semiconductor substrate, metal-insulator-metal corner structures overlying the semiconductor devices and located in corner regions of the semiconductor die. Metal-insulator-metal corner structures are located in the corner regions of the semiconductor die. Each of the metal-insulator-metal corner structures has a horizontal cross-sectional shape selected from a triangular shape and a polygonal shape including a pair of laterally-extending strips extending along two horizontal directions that are perpendicular to each other and connected to each other by a connecting shape.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Inventors: Yen-Kun LAI, Chien Hao Hsu, Wei-Hsiang Tu, Kuo-Chin Chang, Mirng-Ji Lii
  • Publication number: 20230107847
    Abstract: A semiconductor die may include metal interconnect structures located within interconnect-level dielectric material layers, bonding pads located on a topmost interconnect-level dielectric material layer, a dielectric passivation layer located on the topmost interconnect-level dielectric material layer, and metal bump structures extending through the dielectric passivation layer and located on the bonding pads. Each of the metal bump structures comprises a contoured bottom surface including a bottommost surface segment in contact with a top surface of a respective one of the bonding pads, a tapered surface segment in contact with a tapered sidewall of a respective opening through the dielectric passivation layer, and an annular surface segment that overlies the dielectric passivation layer and having an inner periphery that is laterally offset inward from an outer periphery by a lateral offset distance that is at least 8% of a width of a respective underlying one of the bonding pads.
    Type: Application
    Filed: May 19, 2022
    Publication date: April 6, 2023
    Inventors: Yen-Kun LAI, Yi-Wen WU, Kuo-Chin CHANG, Po-Hao TSAI, Mirng-Ji LII
  • Publication number: 20230065147
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang
  • Publication number: 20230068329
    Abstract: A semiconductor device including a semiconductor die, a first conductive pad, a second conductive pad, a first connector structure and a second connector structure is provided. The first conductive pad is disposed on the semiconductor die, wherein the first conductive pad has a first lateral dimension. The second conductive pad is disposed on the semiconductor die, wherein the second conductive pad has a second lateral dimension. The first connector structure is disposed on the first conductive pad, wherein the first connector structure has a third lateral dimension greater than the first lateral dimension. The second connector structure is disposed on the second conductive pad, wherein the second connector structure has a fourth lateral dimension smaller than the second lateral dimension.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hao Hsu, Yen-Kun Lai, Wei-Hsiang Tu, Hao-Chun Liu, Kuo-Chin Chang, Mirng-Ji Lii
  • Publication number: 20230060249
    Abstract: A semiconductor die includes a semiconductor substrate, an interconnect structure, and a conductive bump. The interconnect structure is disposed on and electrically connected to the semiconductor substrate. The interconnect structure includes stacked interconnect layers. Each of the stacked interconnect layers includes a dielectric layer and an interconnect wiring embedded in the dielectric layer. The interconnect wiring of a first interconnect layer among the stacked interconnect layers further includes a first via and second vias. The first via electrically connected to the interconnect wiring. The second vias connected to the interconnect wiring, and the first via and the second vias are located on a same level height. The conductive bump is disposed on the interconnect structure. The conductive bump includes a base portion and a protruding portion connected to the base portion, and the base portion is between the protruding portion and the first via.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Kun Lai, Chien-Hao Hsu, Wei-Hsiang Tu, Kuo-Chin Chang, Mirng-Ji Lii
  • Publication number: 20230061716
    Abstract: Semiconductor devices and methods of manufacturing are provided, wherein a first passivation layer is deposited over a top redistribution structure; a second passivation layer is deposited over the first passivation layer; and a first opening is formed through the second passivation layer. After the forming the first opening, the first opening is reshaped into a second opening; a third opening is formed through the first passivation layer; and filling the second opening and the third opening with a conductive material.
    Type: Application
    Filed: March 29, 2022
    Publication date: March 2, 2023
    Inventors: Yen-Kun Lai, Yi-Wen Wu, Kuo-Chin Chang, Po-Hao Tsai, Mirng-Ji Lii
  • Patent number: 11532583
    Abstract: A method of forming a semiconductor structure is provided. A layout of a substrate is provided. The layout includes a surface having an inner region and an outer region surrounding the inner region. An under bump metallurgy (UBM) pad region within the outer region is defined. The UBM pad region is partitioned into a first zone and a second zone, wherein the first zone faces towards a center of the substrate, and the second zone faces away from the center of the substrate. The substrate is provided according to the layout, wherein the providing of the substrate includes forming a conductive via in the substrate. The conductive via is disposed outside the second zone and at least partially overlaps the first zone from a top view perspective. A UBM pad is formed over the conductive via and within the UBM pad region.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: December 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Kuo-Chin Chang, Yen-Kun Lai, Kuo-Ching Hsu, Mirng-Ji Lii
  • Publication number: 20220384377
    Abstract: A semiconductor structure includes a semiconductor chip, a substrate and a plurality of bump segments. The bump segments include a first group of bump segments and a second group of bump segments collectively extended from an active surface of the semiconductor chip toward the substrate. Each bump segment of the second group of bump segments has a cross-sectional area greater than a cross-sectional area of each bump segment of the first group of bump segments. The first group of bump segments includes a first bump segment and a second bump segment. Each of the first bump segment and the second bump segment includes a tapered side surface exposed to an environment outside the bump segments. A portion of a bottom surface of the second bump segment is stacked on the first bump segment, and another portion of the bottom surface of the second bump segment is exposed to the environment.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Inventors: PEI-HAW TSAO, AN-TAI XU, HUANG-TING HSIAO, KUO-CHIN CHANG
  • Publication number: 20220384286
    Abstract: A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a chip over the substrate. The chip package structure includes a first heat conductive layer between the heat-spreading wall structure and the chip. The chip package structure includes a second heat conductive layer over the chip and surrounded by the first heat conductive layer. The chip package structure includes a heat-spreading lid over the substrate and covering the heat-spreading wall structure, the first heat conductive layer, the second heat conductive layer, and the chip. The heat-spreading lid is bonded to the substrate, the heat-spreading wall structure, the first heat conductive layer, and the second heat conductive layer.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Inventors: Shin CHI, Chien Hao HSU, Kuo-Chin CHANG, Cheng-Nan LIN, Mirng-Ji LII