Abstract: A silicon-based thin package substrate is used for packaging semiconductor chips. The silicon-based thin package substrate preferably has a thickness of less than about 200 ?m. A plurality of through-hole vias are formed in the silicon-based thin package substrate, connecting BGA balls and solder bumps. The silicon-based thin package substrate may be used as a carrier of semiconductor chips.

Abstract: A method for fabricating a semiconductor package is provided. In one embodiment, a semiconductor chip having a plurality of exposed conductive layers thereon is provided. A first substrate having a first surface and a second surface is provided, the first surface having a plurality of exposed via plugs thereunder. The semiconductor chip is bonded to the first substrate, wherein the plurality of exposed conductor layers are aligned and in contact with the surfaces of the exposed via plugs. A portion of the second surface of the first substrate is then removed to expose the opposite ends of the plurality of via plugs. A plurality of UBM layers is formed on the surfaces of the opposite ends of the plurality of via plugs. A plurality of solder bumps is formed and mounted on the UBM layers. A second substrate having a first surface and a second surface is provided, the solder bumps being mounted to the first surface of the second substrate.

Abstract: Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress.

Abstract: An enhanced wafer level chip scale packaging (WLCSP) copper electrode post is described having one or more pins that protrude from the top of the electrode post. When the solder ball is soldered onto the post, the pins are encapsulated within the solder material. The pins not only add shear strength to the soldered joint between the solder ball and the electrode post but also create a more reliable electrical connection due to the increased surface area between the electrode post/pin combination and the solder ball. Moreover, creating an irregularly shaped solder joint retards the propagation of cracks that may form in the intermetal compounds (IMC) layer formed at the solder joint.

Abstract: A method for fabricating a semiconductor package is provided. In one embodiment, a semiconductor chip having a plurality of exposed conductive layers thereon is provided. A first substrate having a first surface and a second surface is provided, the first surface having a plurality of exposed via plugs thereunder. The semiconductor chip is bonded to the first substrate, wherein the plurality of exposed conductor layers are aligned and in contact with the surfaces of the exposed via plugs. A portion of the second surface of the first substrate is then removed to expose the opposite ends of the plurality of via plugs. A plurality of UBM layers is formed on the surfaces of the opposite ends of the plurality of via plugs. A plurality of solder bumps is formed and mounted on the UBM layers. A second substrate having a first surface and a second surface is provided, the solder bumps being mounted to the first surface of the second substrate.

Abstract: A silicon-based thin package substrate is used for packaging semiconductor chips. The silicon-based thin package substrate preferably has a thickness of less than about 200 ?m. A plurality of through-hole vias are formed in the silicon-based thin package substrate, connecting BGA balls and solder bumps. The silicon-based thin package substrate may be used as a carrier of semiconductor chips.

Abstract: A semiconductor package assembly having reduced stresses and a method for forming the same are provided. The method includes providing a package substrate comprising a base material, forming an interconnect structure overlying the package substrate, attaching at least one chip to a first surface of the package substrate, thinning the package substrate from a second surface opposite the first surface wherein the semiconductor material is substantially removed, and attaching ball grid array (BGA) balls to deep vias exposed on the second surface of the package substrate after thinning the package substrate.

Abstract: A constraint stiffener for reinforcing an integrated circuit package is provided. In one embodiment, the constraint stiffener comprises a rigid, planar base element for bonding to an integrated circuit substrate. The base element has a plurality of elongated support members, and the base element has an opening therein for surrounding an integrated circuit. The base element and support members reduce warpage due to thermal expansion mismatches between at least the integrated circuit and the substrate. In one embodiment, the elongated support members are detachable from the corners of the base element. In another embodiment, the elongated support members have means for attaching and detaching to the corners of the base element. In yet another embodiment, the elongated support members are detachable from about the midsections of the base element. In another embodiment, the elongated support members have means for attaching and detaching to the midsections of the base element.

Abstract: A constraint stiffener for reinforcing an integrated circuit package is provided. In one embodiment, the constraint stiffener comprises a rigid, planar base element for bonding to an integrated circuit substrate. The base element has a plurality of elongated support members, and the base element has an opening therein for surrounding an integrated circuit. The base element and support members reduce warpage due to thermal expansion mismatches between at least the integrated circuit and the substrate. In one embodiment, the elongated support members are detachable from the corners of the base element. In another embodiment, the elongated support members have means for attaching and detaching to the corners of the base element. In yet another embodiment, the elongated support members are detachable from about the midsections of the base element. In another embodiment, the elongated support members have means for attaching and detaching to the midsections of the base element.

Abstract: A flip chip ball grid array package is provided. In one embodiment, a flip chip ball grid array package comprises a substrate having an upper surface and a lower surface opposite the upper surface and a microelectronic element comprising a set of solder balls being secured to the upper surface of the substrate. A constraint member is secured to the lower surface of the substrate so that the constraint member has a degree of rigidity to reduce warpage due to thermal expansion mismatches between at least the microelectronic element and the substrate.

Abstract: A semiconductor assembly has solder bumps with increased reliability. One embodiment of an assembly comprises a first substrate having at least one conductive pad on its surface; a second substrate having at least one conductive pad on its surface; at least one conductive stud; and at least one solder bump in contact with the conductive pad on the first substrate, and in contact with the conductive pad of the second substrate, and formed around the at least one conductive stud. Methods for providing these assemblies are included.

Abstract: A flip chip ball grid array package is provided. In one embodiment, a flip chip ball grid array package comprises a substrate having an upper surface and a lower surface opposite the upper surface and a microelectronic element comprising a set of solder balls being secured to the upper surface of the substrate. A constraint member is secured to the lower surface of the substrate so that the constraint member has a degree of rigidity to reduce warpage due to thermal expansion mismatches between at least the microelectronic element and the substrate.

Abstract: A machine purchasing system includes a database server (1), an application server (2), and a plurality of distributed client computers (4). The system receives historical transaction records from a financial management system (6) and current prices from an electronic marketing system (5), and sets a base price for each to-be-purchased machine based on the above received information. Users select one or more eligible suppliers based on the base price and the supplier's information. The client computers are for searching information stored in the database server. A related machine purchasing method is also disclosed.

Abstract: A project bidding transaction management system in accordance with a preferred embodiment of the present invention includes a database server (1) for storing data used or generated in implementing the project bidding transaction management system, and an application server (2) for managing project bidding transactions. The application server includes: a basic data maintenance module (20) for receiving requirements of outsourcing projects, and generating specifications for the outsourcing projects; a bidder selection module (21) for selecting a plurality of suitable bidders from a list of companies wishing to bid on an outsourcing project; a price negotiation management module (22) for performing price negotiations with bidders, and generating price negotiation records; and a bid comparison module (23) for determining a winning bidder as a contractor for each outsourcing project, and generating bid results. A project bidding transaction management method is also disclosed in the present invention.

Abstract: A system and method for generating reports from a website program residing in a web server (30). The system comprises: a data collection module (41) that periodically gathers data to update a database (51); a user interface module (42) that manages users' requests, said user requests including requests for logon and requests for reports; a data service module (43) that retrieves from the database data requested for generation of reports; and a report generation module (44) that encapsulates instances of requests for reports and instantiates said instances to generate reports based on data supplied by the data service module in accordance with requests for reports. Users can access the system through web browsers to request required reports. One example of such reports is reports containing financial data.