Abstract: A package component includes an insulating substrate, a semiconductor structure, a first conductive line and a conductive pad. The semiconductor structure is disposed in the insulating substrate and separated from the insulating substrate. The first conductive line is disposed on a first side of the insulating substrate. The conductive pad is disposed on a first side of the semiconductor structure. The first conductive line and the conductive pad include a same material. A surface roughness of the conductive pad is greater than a surface roughness of the first conductive line.

Abstract: A semiconductor structure includes a conductive bump disposed between a substrate and a board; an isolation member disposed over the board and surrounding the conductive bump and the substrate; a metallic member disposed between the isolation member and the conductive bump; and a solder disposed between the substrate and the board and configured to attach the metallic member to the substrate and the board. A method of manufacturing a semiconductor structure includes disposing a first solder on a first surface of a substrate; disposing a metallic member to the first surface of the substrate by the first solder; disposing a second solder on a board; and bonding the metallic member to the board by the second solder.

Abstract: Semiconductor package and method of manufacturing are presented herein. In an embodiment, a device is provided that includes a first semiconductor component embedded in a first core substrate, a first redistribution layer on a first side of the first core substrate, a second redistribution layer on a second side of the first core substrate opposite the first side, a first resin film over the second redistribution layer, a second semiconductor component embedded in a second core substrate, a third redistribution layer on a third side of the second core substrate, wherein the third redistribution layer is bonded to the second redistribution layer by the first resin film, a fourth redistribution layer on a fourth side of the second core substrate opposite the third side, and a through hole via extending through the first redistribution layer, the first core substrate, the second redistribution layer, the third redistribution layer, the second core substrate, and the fourth redistribution layer.

Abstract: Methods and pad structures to test via accuracy are provided. A method according to the present disclosure includes forming a first pad and a second pad on a device component, wherein the second pad includes a via landing area and a clearance opening, providing a core substrate that includes a cavity, placing the device component in the cavity, forming a build-up film over the device component and the core substrate, forming a first contact via extending through the build-up film to contact the landing area and a second contact via extending through build-up film and the clearance opening, and performing a continuity test to determine whether the second contact via is in contact with the second pad.

Abstract: Methods of conducting electrical tests on semiconductor packages are provided. A method according to the present disclosure includes forming a build-up structure that includes a plurality of metal layers embedded a plurality of dielectric layers, forming a core structure that embeds a passive device, performing a first electrical test on the build-up structure, performing a second electrical test on the core structure, and after performing the first electrical test and the second electrical test, bonding the build-up structure to the core structure.

Abstract: A chip package structure is provided. The chip package structure includes a wiring substrate having a pad and a conductive adhesive layer over the pad and having a first inner wall, a second inner wall, a first sidewall, and a second sidewall. The first inner wall and the second inner wall face each other, and the first sidewall and the second sidewall are opposite to each other. The chip package structure also includes a nickel layer over the conductive adhesive layer, and the nickel layer covers the first inner wall, the second inner wall, the first sidewall, and the second sidewall of the conductive adhesive layer. The chip package structure further includes a chip over the wiring substrate and a conductive bump connected between the nickel layer and the chip.

Abstract: A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.

Abstract: A chip package structure is provided. The chip package structure includes a wiring substrate including a substrate, a first pad, and a second pad. The first pad and the second pad are respectively over a first surface and a second surface of the substrate, and the first pad is narrower than the second pad. The chip package structure includes a nickel layer over the first pad. The nickel layer has a T-shape in a cross-sectional view of the nickel layer. The chip package structure includes a chip over the wiring substrate. The chip package structure includes a conductive bump between the nickel layer and the chip.

Abstract: A method includes forming a reconstructed package substrate, which includes placing a plurality of substrate blocks over a carrier, encapsulating the plurality of substrate blocks in an encapsulant, planarizing the encapsulant and the plurality of substrate blocks to reveal redistribution lines in the plurality of substrate blocks, and forming a redistribution structure overlapping both of the plurality of substrate blocks and encapsulant. A package component is bonded over the reconstructed package substrate.

Abstract: A chip package structure is provided. The chip package structure includes a first wiring substrate comprising a substrate, a first pad, a second pad, and an insulating layer. The first pad and the second pad are respectively over a first surface and a second surface of the substrate, the first surface is opposite to the second surface, the insulating layer is over the first surface and partially covers the first pad, and the first pad is wider than the second pad. The chip package structure includes a nickel-containing layer over the first pad. The chip package structure includes a conductive protection layer over the nickel-containing layer. The conductive protection layer has a curved surface, and a recess is surrounded by the curved surface and an inner wall of the insulating layer over the first pad.

Abstract: Embodiments provide a package substrate. The package substrate includes a substrate and a semiconductor device. The substrate includes a cavity hole therein. The semiconductor device is embedded in the cavity hole. The semiconductor device includes a first device component and a second device component. The first device component has a first pad, a second pad, and a first trench capacitor. The second device component has a third pad, a fourth pad, and a second trench capacitor. A backside of the first device component is bonded to a backside of the second device component, and the first pad has an area less than an area of the third pad, and the second pad has an area less than an area of the fourth pad.

Abstract: A semiconductor structure includes: an interposer including an integrated passive device, a die-side redistribution structure, first on-interposer bump structures, and second on-interposer bump structures. First die-side redistribution wiring interconnects electrically connect electrical nodes within the integrated passive device to the first on-interposer bump structures. Second die-side redistribution wiring interconnects provide a respective electrical connection between a respective pair of second on-interposer bump structures. A first semiconductor die includes first on-die bump structures that are bonded to the first on-interposer bump structures through first solder material portions, and further includes second on-die bump structures that are bonded to the second on-interposer bump structures through second solder material portions.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a die structure including a plurality of die regions and a plurality of first seal rings. Each of the plurality of first seal rings surrounds a corresponding die region of the plurality of die regions. The semiconductor device further includes a second seal ring surrounding the plurality of first seal rings and a plurality of connectors bonded to the die structure. Each of the plurality of connectors has an elongated plan-view shape. A long axis of the elongated plan-view shape of each of the plurality of connectors is oriented toward a center of the die structure.

Abstract: Embodiments provide a package substrate. The package substrate includes a substrate having a cavity hole therein, and a semiconductor device in the cavity hole. The semiconductor device has first terminal side and a second terminal side opposite to the first terminal side. The package substrate further includes a first redistribution structure on the first terminal side of the cavity substrate to electrically couple to a first pad and a second pad on the first terminal side of the semiconductor device; and a second redistribution structure on the second side of the cavity substrate to electrically couple to a third pad and fourth pad on the second terminal side of the semiconductor device.

Abstract: A method includes forming a reconstructed package substrate, which includes placing a plurality of substrate blocks over a carrier, encapsulating the plurality of substrate blocks in an encapsulant, planarizing the encapsulant and the plurality of substrate blocks to reveal redistribution lines in the plurality of substrate blocks, and forming a redistribution structure overlapping both of the plurality of substrate blocks and encapsulant. A package component is bonded over the reconstructed package substrate.

Abstract: A chip package structure is provided. The chip package structure includes a first wiring substrate including a substrate, a first pad, a second pad, and an insulating layer. The chip package structure includes a nickel-containing layer over the first pad. The chip package structure includes a conductive protection layer over the nickel-containing layer. The conductive protection layer includes tin, and a recess is surrounded by the conductive protection layer and the insulating layer over the first pad. The chip package structure includes a chip over the second surface of the substrate. The chip package structure includes a conductive bump between the second pad and the chip.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a die structure including a plurality of die regions and a plurality of first seal rings. Each of the plurality of first seal rings surrounds a corresponding die region of the plurality of die regions. The semiconductor device further includes a second seal ring surrounding the plurality of first seal rings and a plurality of connectors bonded to the die structure. Each of the plurality of connectors has an elongated plan-view shape. A long axis of the elongated plan-view shape of each of the plurality of connectors is oriented toward a center of the die structure.

Abstract: A chip structure is provided. The chip structure includes a substrate, a redistribution layer over the substrate, a bonding pad over the redistribution layer, a shielding pad over the redistribution layer and surrounding the bonding pad, an insulating layer over the redistribution layer and the shielding pad, and a bump over the bonding pad and the insulating layer. The insulating layer includes a first part and a second part surrounded by the first part, the first part has first thickness, the second part has a second thickness, and the first thickness and the second thickness are different.

Abstract: A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die. The semiconductor die has a corner. The package substrate includes several conductive lines, and one of the conductive lines under the corner of the semiconductor die includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is non-linear and has a varying extension direction.

Abstract: A laser-less packaging substrate fabrication process is provided. A substrate plate including through-plate metal via structures is provided. At least one interconnect-level structure may be formed by performing a unit sequence of processing steps that includes: a metal seed deposition step; a first masking step; a first electroplating step that forms metal lines; a second masking step; a second electroplating step that forms metal via structures; a seed layer etch step; a dielectric material deposition step that forms a dielectric material layer; and a planarization step that removes portions of the dielectric material layer that are more distal from the substrate plate than distal horizontal surfaces of the metal via structures. Laser drilling processing steps are not necessary during manufacture of the packaging substrate.