Abstract: Disclosed is an antimicrobial peptide having an amino acid sequence of formula presented as (P1)M(nA1X1X2)N(P2)X, wherein P1 is selected from the group consisting of basic amino acids including Arg and Lys; A1 is selected from the group consisting of aromatic amino acids including Trp, Phe and Ala; X1 is selected from the group consisting of basic amino acids or nonpolar amino acids, including Arg, Lys, Val, Leu, Ala and Ile; X2 is selected from the group consisting of basic amino acids or nonpolar amino acids, including Arg, Lys, Val, Leu, Ala and Ile; P2 is selected from the group consisting of basic amino acids including Arg and Lys; and the numbers of M and X are respectively 0˜2; when N>2, A1 is Ala and the Ala residues are less than N?2.

Abstract: The present invention is related to a high salt-resistance antibacterial peptide by increasing width of side chain of amino acids and/or increasing length of side chain of amino acids in the antibacterial peptide; and a method for increasing salt-resistance of antibacterial peptide by increasing width of side chain and/or increasing length of side chain in the antibacterial peptide.

Abstract: An acoustic echo cancellation (AEC) system includes a remote device, for capturing a remote captured sound, a server coupled to the remote device, and a local device coupled to the server. The server transmits the remote captured sound from the remote device to the local device. The local device receives, stores and plays the remote captured sound as a local playback sound. An echo is generated from reflection of the local playback sound. The local device captures the echo and a local sound into a local captured sound, and transmits both the remote captured sound and the local captured sound to the server. The server performs AEC on the local captured sound by using the remote captured sound from the local device and transmits the AEC processed local captured sound to the remote device.

Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate having a flip region with a through-opening and bonding to a Non-conductive Film to bond to a carrier board in order to form a compound carrier board structure. Therefore, when a die is planted in the film region of the carrier board structure, the carrier board is able to susceptible to different stresses during a package process. The baseplate uses the low Thermal Expansion Coefficient material to avoid warpage problems caused by the thermal expansion of the carrier board resulting from the thermal stresses. The carrier board is able to disperse conduction of thermal stresses by the baseplate in order to strengthen cooling effect of the compound carrier board structure. Thus, the present invention achieves miniaturization and heat strengthening and enhances the mechanical strength.

Abstract: An acoustic echo cancellation (AEC) system includes a remote device, for capturing a remote captured sound, a server coupled to the remote device, and a local device coupled to the server. The server transmits the remote captured sound from the remote device to the local device. The local device receives, stores and plays the remote captured sound as a local playback sound. An echo is generated from reflection of the local playback sound. The local device captures the echo and a local sound into a local captured sound, and transmits both the remote captured sound and the local captured sound to the server. The server performs AEC on the local captured sound by using the remote captured sound from the local device and transmits the AEC processed local captured sound to the remote device.

Abstract: An overlay mark including at least one first overlay mark and at least one second overlay mark is provided. The first overlay mark includes a plurality of first bars and a plurality of first spaces arranged alternately, and the first spaces are not constant. The second overlay mark includes a plurality of second bars and a plurality of second spaces arranged alternately, and the second spaces are constant. Besides, the second overlay mark partially overlaps with the first overlay mark.

Abstract: An exemplary electronic device with integrated circuit chips being on one circuit board and required connector circuits being on another, connectable, circuit board provides modularization and interchangeability for ease of adaptation in manufacture of electronic products utilizing the electronic device. In particular, the IC chips are mounted on a first circuit board, and the connector circuits are mounted on a second circuit board. The first circuit board is mountable to the second circuit board and is electrically connected to the second circuit board.

Abstract: A remote control for controlling an electronic device includes a first control panel and a second control panel. When the remote control is in a first operating state, the first control panel closes relative to the second control panel. The first control panel is used to receive operations from a user. When the remote control is in the second operating state, the first control panel opens relative to the second control panel in a first direction, both the first and second control panels are used to receive operations from a user. A remote control assembly is also provided.

Abstract: Enclosed is an antagonist, which includes a peptide chain represented by an amino acid sequence. The amino acid sequence has a short sequence, C-X1X2X3X4X5-N, which is situated before and neighbored to the third cysteine (Cys, C) of the N-terminus, wherein X1 is an amino acid with aromatic ring, hydrophobic property or long chain, and X2, X3, X4 and X5 are glutamine (G), serine (S), alanine (A) and proline (P) respectively. In one embodiment, X1 is phenylalanine (F). The present antagonists can be used to inhibit or treat with the diseases caused by the activated cells expressing CXCR1 and/or CXCR2 receptor, for example, the acute or chronic inflammatory reaction induced with polymorphonuclear neutrophils (PMNs) expressing CXCR1 and/or CXCR2 receptor, and angiogenesis accompanied by tumor growth inhibition.

Abstract: An audio processing system is provided. The audio processing system has a sound receiving device configured to receive sounds and output an audio signal; a controller, electrically connected to the sound receiving unit, configured to write the audio signal to an audio signal buffer with a first frequency; and an audio processing unit, electrically connected to the controller, configured to read the audio signal from the audio signal buffer with a second frequency to perform audio processing, wherein the controller further dynamically adjusts the second frequency, so that the second frequency approaches the first frequency according to a convergence curve.

Abstract: Enclosed is an antagonist, which includes a peptide chain represented by an amino acid sequence. The amino acid sequence has a short sequence, C-X1X2X3X4X5-N, which is situated before and neighbored to the third cysteine (Cys, C) of the N-terminus, wherein X1 is an amino acid with aromatic ring, hydrophobic property or long chain, and X2, X3, X4 and X5 are glutamine (G), serine (S), alanine (A) and proline (P) respectively. In one embodiment, X1 is phenylalanine (F). The present antagonists can be used to inhibit or treat with the diseases caused by the activated cells expressing CXCR1 and/or CXCR2 receptor, for example, the acute or chronic inflammatory reaction induced with polymorphonuclear neutrophils (PMNs) expressing CXCR1 and/or CXCR2 receptor, and angiogenesis accompanied by tumor growth inhibition.

Abstract: The present invention is related to a high salt-resistance antibacterial peptide by increasing width of side chain of amino acids and/or increasing length of side chain of amino acids in the antibacterial peptide; and a method for increasing salt-resistance of antibacterial peptide by increasing width of side chain and/or increasing length of side chain in the antibacterial peptide.

Abstract: Disclosed is an antimicrobial peptide having an amino acid sequence of formula presented as (P1)M(nA1X1X2)N(P2)X, wherein P1 is selected from the group consisting of basic amino acids including Arg and Lys; A1 is selected from the group consisting of aromatic amino acids including Trp, Phe and Ala; X1 is selected from the group consisting of basic amino acids or nonpolar amino acids, including Arg, Lys, Val, Leu, Ala and Ile; X2 is selected from the group consisting of basic amino acids or nonpolar amino acids, including Arg, Lys, Val, Leu, Ala and Ile; P2 is selected from the group consisting of basic amino acids including Arg and Lys; and the numbers of M and X are respectively 0˜2; when N>2, A1 is Ala and the Ala residues are less than N?2.

Abstract: The present disclosure provides a method for fabricating a semiconductor device using a track pipeline system. The method includes storing a plurality of chemicals in a plurality of storage units of the system, wherein each storage unit is operable to store one of the chemicals, mixing the chemicals into a mixture, and dispensing the mixture onto a wafer using a nozzle of the system.

Abstract: A reticle includes a reticle body having a first surface, a pattern disposed on the first surface of the reticle body, and at least a protection layer disposed on the first surface of the reticle body. The protection layer is in contact with the first surface of the reticle body.

Abstract: A method for improving illumination uniformity in an exposure process is described, wherein a light source, a reticle and a projection system are used to expose a substrate in the exposure process. A realtime adjustable gray filter like a gray LCD panel is placed in the light path between the light source and the exposed substrate to compensate the illumination nonuniformity on the substrate in real time.

Abstract: A method for reducing critical dimension is provided. An exposure process and a develop process are performed on a photoresist layer. An optical trim exposure process is performed between the exposure process and the development process or before the exposure process. The optical trim expsoure process is performed to expose the photoresit layer by using a fully open mask of which the transmission rate is greater than zero. Because of the performance of the optical trim exposure process, the critical dimension of the photoresist layer can be reduced without substantially changing the characteristics of the photoresist layer.

Abstract: An in-vehicle hands-free cellular phone set is disclosed. It utilizes a pair of radio transmitter/receiver modules workable at similar radio frequency. The two-way communication by call-in and call-out is performed through the two radio transmitter/receiver modules, one built in the cellular phone, and the other set in the sunshade of the vehicle. By means of that, the sunshade can serve as an effective hands-free means for the driver to use the cellular phone conveniently and securely without the need of intricate change-over of wire connection. Other component parts, a loud speaker for call-in voice output and a microphone for call-out voice output, are provided on the same pedestal of the cellular phone set. The power supply for the cellular phone set can be obtained from the vehicle power system or from an exclusive storage battery unit via a power supply switch.