Abstract: A light-emitting structure includes a substrate and a light-emitting unit. The substrate has a first meander conductive track and a second meander conductive track. Each first chip-mounting area of the first meander conductive track has at least two first chip-mounting lines. Each second chip-mounting area of the second meander conductive track has at least two second chip-mounting lines. The light-emitting unit includes first light-emitting groups and second light-emitting groups. Each first light-emitting group includes at least one or a plurality of first LED chips disposed on the same first chip-mounting line of the corresponding first chip-mounting area, and each second light-emitting group includes at least one or a plurality of second LED chips disposed on the same second chip-mounting line of the corresponding second chip-mounting area. The first and the second chip-mounting areas are arranged alternately, thus the first and the second light-emitting groups are arranged alternately.

Abstract: A light emitting diode (LED) device includes: a substrate having a central portion; an LED chip unit formed on the central portion of the substrate; a circuit pattern having a positive electrode and a negative electrode that are formed on the substrate, each of the positive electrode and the negative electrode including an arc portion and at least one extending portion that extends from the arc portion toward the central portion; a wire unit connecting the LED chip unit to the extending portions; a glass layer disposed on the substrate, covering the arc portions and including an opening unit that is aligned with the central portion of the substrate; a dam structure formed on the glass layer and extending along the arc portions; and an encapsulated body disposed substantially within the dam structure to cover the extending portions, the wire unit and the LED chip unit.

Abstract: An LED package structure includes a carrier mounted with a plurality of LED chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof. The second glue-layer is stacked on the first glue-layer. The second glue-layer has a height higher than that of the first glue-layer. The second glue-layer has a volume greater than that of the first glue-layer. The present invention also provides a method of LED package structure to stably produce a dam structure with uniform shape and high ratio of height/width.

Abstract: The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.