Abstract: A memory device includes a plurality of strings of memory cells. A plurality of stacks of conductive strips includes first upper strips configured as first string select lines for the strings in the plurality of strings, second upper strips configured as second string select lines for the strings in the plurality of strings, and intermediate strips configured as word lines for the strings in the plurality of strings. The memory device includes control circuitry coupled to the first string select lines and the second string select lines, and configured to select a particular string in the plurality of strings by applying a first turn-on voltage to a first string select line in the first string select lines coupled to the particular string, and a second turn-on voltage to a second string select line in the second string select lines coupled to the particular string.

Abstract: A method of manufacturing a semiconductor structure, comprising: receiving a first substrate including a first surface, a second surface opposite to the first surface and a plurality of conductive bumps disposed over the first surface; receiving a second substrate; disposing an adhesive over the first substrate or the second substrate; heating the adhesive in a first ambiance; bonding the first substrate with the second substrate by applying a force of less than about 10,000N upon the first substrate or the second substrate and heating the adhesive in a second ambiance; and thinning down a thickness of the first substrate from the second surface.

Abstract: A memory device includes: a plurality of conductive stacked structures including at least a string select line, a plurality of word lines and at least a ground select line; a plurality of memory cells formed in the conductive stacked structures; a plurality of bit lines, formed on the conductive stacked structures; and at least an odd common source line and at least an even common source line, formed on the conductive stacked structures. The odd common source line is coupled to a plurality of odd bit lines of the bit lines. The even common source line is coupled to a plurality of even bit lines of the bit lines.

Abstract: A method is provided for operating a NAND array that includes a plurality of blocks of memory cells. A block of memory cells includes a plurality of NAND strings having channel lines between first string select switches and second string select switches. The plurality of NAND strings shares a set of word lines between the first and second string select switches. A channel-side erase voltage is applied to the channel lines through the first string select switches in a selected block. Word line-side erase voltages are applied to a selected subset of the set of word lines in the selected block to induce tunneling in memory cells coupled to the selected subset. Word line-side inhibit voltages are applied to an unselected subset of the set of word lines in the selected block to inhibit tunneling in memory cells coupled to the unselected subset.

Abstract: A memory device includes: a plurality of conductive stacked structures including at least a string select line, a plurality of word lines and at least a ground select line; a plurality of memory cells formed in the conductive stacked structures; a plurality of bit lines, formed on the conductive stacked structures; and at least an odd common source line and at least an even common source line, formed on the conductive stacked structures. The odd common source line is coupled to a plurality of odd bit lines of the bit lines. The even common source line is coupled to a plurality of even bit lines of the bit lines.

Abstract: A memory device and an erase method for the memory device are provided. The memory device includes plural blocks and a controller. The plural blocks include at least one first block and at least one second block. The erase method is controlled by the controller and includes the following steps. A first stage erase operation and a second stage erase operation are sequentially performed on the at least one first block in a first time interval and a second time interval. The first stage erase operation and the second stage erase operation are sequentially performed on the at least one second block in the second time interval and a third time interval.

Abstract: A memory device and an erase method for the memory device are provided. The memory device includes plural blocks and a controller. The plural blocks include at least one first block and at least one second block. The erase method is controlled by the controller and includes the following steps. A first stage erase operation and a second stage erase operation are sequentially performed on the at least one first block in a first time interval and a second time interval. The first stage erase operation and the second stage erase operation are sequentially performed on the at least one second block in the second time interval and a third time interval.

Abstract: A method of operating a NAND array including blocks of memory cells is provided. A block includes a plurality of strings having channel lines between first and second string select switches. The strings share a set of word lines between the first and second string select switches. A channel-side voltage can be applied to the channel lines . A control voltage can be applied to a selected subset of the first string select switches. The channel lines can be floated at ends of the second string select switches. Tunneling in memory cells coupled to an unselected subset of the first string select switches can be inhibited. Word line-side erase voltages can be applied to word lines in the set of word lines in the block to induce tunneling in memory cells coupled to the word lines and coupled to the selected subset of the first string select switches.

Abstract: A method is provided for operating a NAND array that includes a plurality of blocks of memory cells. A block of memory cells includes a plurality of NAND strings having channel lines between first string select switches and second string select switches. The plurality of NAND strings shares a set of word lines between the first and second string select switches. A channel-side erase voltage is applied to the channel lines through the first string select switches in a selected block. Word line-side erase voltages are applied to a selected subset of the set of word lines in the selected block to induce tunneling in memory cells coupled to the selected subset. Word line-side inhibit voltages are applied to an unselected subset of the set of word lines in the selected block to inhibit tunneling in memory cells coupled to the unselected subset.

Abstract: A memory device includes a plurality of strings of memory cells. A plurality of stacks of conductive strips includes first upper strips configured as first string select lines for the strings in the plurality of strings, second upper strips configured as second string select lines for the strings in the plurality of strings, and intermediate strips configured as word lines for the strings in the plurality of strings. The memory device includes control circuitry coupled to the first string select lines and the second string select lines, and configured to select a particular string in the plurality of strings by applying a first turn-on voltage to a first string select line in the first string select lines coupled to the particular string, and a second turn-on voltage to a second string select line in the second string select lines coupled to the particular string.

Abstract: Common problems when programming 3D NAND Flash memory having alternating page orientation include the back-pattern effect and pattern-induced program disturb. Improved programming techniques may substantially reduce these problems and, in turn, increase precision when setting memory cells' threshold voltages. Provided are exemplary techniques that combine aspects of “by-word-line” programming and “by-page” programming. As such, each page may be programmed beginning with the memory cells that are closest to string select structures, and memory cells on multiple even or odd pages may be programmed substantially simultaneously.

Abstract: A memory device comprises a first memory string and a second memory string. The first memory string is coupled to a first bit line and a plurality of word lines, and the second memory string is coupled to a second bit line and the word lines. When an erasing voltage is applied to the word lines, a first voltage is applied to the first bit line to erase data stored in the first memory string, and a second voltage is applied to the second bit line to set the second memory string to be floating.

Abstract: A memory device comprises a first memory string and a second memory string. The first memory string is coupled to a first bit line and a plurality of word lines, and the second memory string is coupled to a second bit line and the word lines. When an erasing voltage is applied to the word lines, a first voltage is applied to the first bit line to erase data stored in the first memory string, and a second voltage is applied to the second bit line to set the second memory string to be floating.

Abstract: Control transistors and memory cells within 3D NAND Flash memory arrays may both be created using the same technology, such as charge trapping structures, to simplify the fabrication process. However, the resulting control transistors may initially have higher variability in threshold voltages, when compared to traditional gate-oxide-based control transistors. Provided are exemplary techniques to trim control transistors to provide increased reliability and performance during array operation.

Abstract: A method of operating a memory array is disclosed. The memory array includes a plurality of memory cells arranged in rows and columns, wherein a plurality of parallel memory strings correspond to respective ones of the columns, and a plurality of word lines are arranged orthogonal to the plurality of memory strings, each word line being connected to gate electrodes of a corresponding one of the rows of memory cells. The method includes performing a program operation that programs all of the memory cells on edge word lines located at opposite edges of the memory array, and that programs selected memory cells between the edge word lines in the memory array according to input data to be stored in the memory array. Each programmed memory cell has a threshold voltage at a program verify (PV) level.

Abstract: A method is provided for operating a NAND array that includes a plurality of blocks of memory cells. A block of memory cells in the plurality of blocks includes a plurality of NAND strings having channel lines between first string select switches and second string select switches. The plurality of NAND strings shares a set of word lines between the first and second string select switches. A channel-side erase voltage is applied to the channel lines through the first string select switches in a selected block. Word line-side erase voltages are applied to a selected subset including more than one member of the set of word lines shared by NAND strings in the selected block to induce tunneling in memory cells coupled to the selected subset, while tunneling is inhibited in memory cells coupled to an unselected subset including more than one member of the set of word lines.

Abstract: Control transistors and memory cells within 3D NAND Flash memory arrays may both be created using the same technology, such as charge trapping structures, to simplify the fabrication process. However, the resulting control transistors may initially have higher variability in threshold voltages, when compared to traditional gate-oxide-based control transistors. Provided are exemplary techniques to trim control transistors to provide increased reliability and performance during array operation.

Abstract: Common problems when programming 3D NAND Flash memory having alternating page orientation include the back-pattern effect and pattern-induced program disturb. Improved programming techniques may substantially reduce these problems and, in turn, increase precision when setting memory cells' threshold voltages. Provided are exemplary techniques that combine aspects of “by-word-line” programming and “by-page” programming. As such, each page may be programmed beginning with the memory cells that are closest to string select structures, and memory cells on multiple even or odd pages may be programmed substantially simultaneously.

Abstract: A pre-reading method and a programming method for a 3D NAND flash memory are provided. The pre-reading method comprises the following steps. A selected string includes a first memory cell, two second memory cells and a plurality of third memory cells. The two second memory cells are adjacent to the first memory cell. The third memory cells are not adjacent to the first memory cell. A first pass voltage is applied on the second memory cells, a second pass voltage is applied on the third memory cells, and a read voltage is applied on the first memory cell via a plurality of word lines for reading a data of the first memory cell. The first pass voltage is larger than the second pass voltage.

Abstract: A memory device is described that includes a three-dimensional array of memory cells having a plurality of levels of memory cells accessed by a plurality of word lines, and a plurality of bit lines. Control circuitry is coupled to the plurality of word lines and the plurality of bit lines. The control circuitry is adapted for programming a selected memory cell in a selected level of the array and on a selected word line, by hot carrier generation assisted FN tunneling, while inhibiting disturb in unselected memory cells in unselected levels and in the selected level and on unselected word lines by self-boosting.