STRUCTURE FOR HOLDING A HEAT PIPE TO A BASE
A structure for holding a heat pipe to a base includes a base and a heat pipe. The base has a first side and an opposite second side, and is formed at a middle portion with a receiving recess, such that two sidewalls are raised from two lateral sides of the receiving recess. Each of the sidewalls has at least one projected section formed using a part material of the base, such that portions of the base adjacent to the projected sections respectively form an opening. The heat pipe is laid in the receiving recess and has a top and a bottom surface. The projected sections are bent to flatly press against the top surface of the heat pipe to firmly hold the heat pipe to the base. Since the projected sections are formed using a part material of the base, the holding structure is manufactured at largely reduced cost.
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The present invention relates to a structure for holding a heat pipe to a base, and more particularly to a structure for holding a heat pipe to a base that is manufactured at largely reduced cost.
BACKGROUND OF THE INVENTIONThe progress in the electronic technology enables various chips, such as the central processing unit (CPU), to have gradually reduced volume. Meanwhile, for the chips to process more data, the number of electronic components provided on the presently available chips is several times higher than that on the conventional chips of the same volume. When the number of electronic components on the chips increases, the heat generated by the electronic components during operation thereof also increases. For example, the heat generated by the CPU during operation thereof is high enough to burn out the whole CPU. Thus, it is always a very important issue as how to properly provide a heat dissipation device for various chips. Among others, heat pipes have become an important type of heat dissipation device.
Further, the projected sections 104 are upward extended portions of the two sidewalls 102 of the recess 101. This means extra material is needed to form the projected sections 104 to thereby increase the holding structure's manufacturing cost.
In brief, the prior art structure for holding the heat pipe to the base has the following disadvantages: (1) requiring higher manufacturing cost; and (2) tending to lower the heat transfer effect of the heat pipe.
It is therefore tried by the inventor to develop an improved structure for holding the heat pipe to the base.
SUMMARY OF THE INVENTIONA primary object of the present invention is to provide a structure for holding a heat pipe to a base that is manufactured at largely reduced cost.
Another object of the present invention is to provide a structure for holding a heat pipe to a base that enables a close and firm contact between the heat pipe and the base.
A further object of the present invention is to provide a structure for holding a heat pipe to a base that ensures good heat transfer effect of the heat pipe.
To achieve the above and other objects, the holding structure according to the present invention includes a base and a heat pipe. The base has a first side and an opposite second side, and is formed at a middle portion with a receiving recess, such that a sidewall is raised from each of two lateral sides of the receiving recess. Each of the sidewalls has at least one upward projected section formed using a part material of the base, such that portions of the base adjacent to the projected sections respectively form an opening. The heat pipe is laid in the receiving recess and has a top surface and a bottom surface. The projected sections are bent to flatly press against the top surface of the heat pipe, so that the heat pipe is firmly held to the base.
According to the holding structure of the present invention, after the heat pipe is positioned in the receiving recess of the base, the projected sections are bent to flatly press against the top surface of the heat pipe, so that the heat pipe is firmly held to the base. Since the projected sections are formed using a part material of the base through a stamping process, no other additional element or material is needed to hold down the heat pipe. With these arrangements, the heat pipe can be more closely and tightly attached to the base and the manufacturing cost of the holding structure is largely reduced.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to
The base 2 is shaped through a mechanical process. In the embodiments of the present invention, the mechanical process is stamping.
The heat pipe 3 has a top surface 31 and a bottom surface 32. When the heat pipe 3 is laid in the receiving recess 23, the top surface 31 is flush with the first side 21 of the base 2 at the two open surfaces 26, and the projected sections 232 can be inward bent to flatly press against the top surface 31. In the embodiments of the present invention, the heat pipe 3 is shown as a flat heat pipe.
According to the present invention, the heat pipe 3 can be held to the base 2 directly by a mechanical process, such as stamping or rolling. Alternatively, the heat pipe 3 is first mechanically flattened and then positioned in the receiving recess 23 of the base 2. Thereafter, the projected sections 232 on the sidewalls 231 of the receiving recess 23 are pressed to flatly contact with the top surface 31 of the heat pipe 3, so that the heat pipe 3 is closely and firmly held to the base 2. It is noted the projected sections 232 are formed by stamping the base 2. That is, the projected sections 232 are formed using a part material of the base 2 instead of using extra material. Therefore, with the present invention, the heat pipe 3 can be closely and firmly held to the base 2 without the need of using other element or extra material to form the projected sections 232, enabling the holding structure to have largely reduced overall weight and manufacturing cost.
Please refer to
The projected sections 232 are not necessarily formed using a part material of the open surfaces 26 of the base 2 as that shown in
In conclusion, the present invention has the following advantages: (1) being produced at largely reduced manufacturing cost; and (2) enabling close and tight contact of the heat pipe with the base.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims
1. A structure for holding a heat pipe to a base, comprising:
- a base having a first side and an opposite second side, and being formed at a middle portion with a receiving recess, such that a sidewall is raised from either lateral side of the receiving recess; each of the sidewalls having at least one upward projected section formed using a part material of the base, such that portions of the base adjacent to the projected sections respectively forming an opening; and
- a heat pipe being laid in the receiving recess and having a top surface and a bottom surface; and the projected sections being bent to flatly press against the top surface of the heat pipe.
2. The holding structure as claimed in claim 1, wherein the openings are extended from the first side to the second side to penetrate through the base.
3. The holding structure as claimed in claim 1, wherein the top surface of the heat pipe is flush with the first side of the base.
4. The holding structure as claimed in claim 1, wherein the base is shaped through a mechanical process.
5. The holding structure as claimed in claim 4, wherein the mechanical process is stamping.
6. The holding structure as claimed in claim 1, wherein the heat pipe and the base are held together through a mechanical process.
7. The holding structure as claimed in claim 6, wherein the mechanical process is selected from the group consisting of stamping and rolling.
8. The holding structure as claimed in claim 1, wherein the heat pipe is a flat heat pipe.
9. The holding structure as claimed in claim 1, wherein the projected section has a shape selected from the group consisting of a rectangular, a round, a triangular and any other geometrical shape.
10. The holding structure as claimed in claim 1, wherein the base is formed at an area adjacent to one sidewall of the receiving recess with a through hole, and the projected section is formed on the other sidewall of the receiving recess corresponding to the through hole, such that the projected section flatly pressed against the top surface of the heat pipe has a free end extended into the through hole.
11. The holding structure as claimed in claim 1, wherein portions of the base located at two lateral sides of the receiving recess form two raised open surfaces, and the openings being formed on the two open surfaces.
12. The holding structure as claimed in claim 1, wherein the openings are formed on the sidewalls at positions corresponding to the projected sections.
Type: Application
Filed: Dec 31, 2013
Publication Date: Jul 2, 2015
Applicant: Asia Vital Components Co., Ltd. (New Taipei City)
Inventors: Sheng-Huang Lin (New Taipei City), Kuo-Sheng Lin (New Taipei City)
Application Number: 14/145,472